| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/30/2014 | CN103752576A Jig universal for centrifugal cleaning |
| 04/30/2014 | CN102931108B Encapsulating method for flip chip |
| 04/30/2014 | CN102693941B Wafer cutting process |
| 04/30/2014 | CN102683287B Method for improving write margin of static random access memory (SRAM) |
| 04/30/2014 | CN102640281B Semiconductor storage device |
| 04/30/2014 | CN102637600B Preparation method of MOS (metal oxide semiconductor) device |
| 04/30/2014 | CN102623495B Tunneling field effect transistor with multi-doping pocket structure and manufacturing method for tunneling field effect transistor |
| 04/30/2014 | CN102569143B Diode polarity collating device |
| 04/30/2014 | CN102569107B Preparation method of elastic contact interconnection structure of chip and electrode |
| 04/30/2014 | CN102560488B DBC (Direct Bonded Copper) substrate surface treatment process based on nano-silver soldering paste connecting chip |
| 04/30/2014 | CN102522424B CMOS device capable of reducing charge sharing effect and manufacturing method thereof |
| 04/30/2014 | CN102482758B Substrate processing method |
| 04/30/2014 | CN102456628B Method of manufacturing strained source/drain structures |
| 04/30/2014 | CN102456595B Vacuum transmission processing equipment and method |
| 04/30/2014 | CN102437157B Preparation method of CMOS (complementary metal oxide semiconductor) device capable of implementing multistage working voltage by single-thickness gate oxide layer |
| 04/30/2014 | CN102437147B Dense-pitch small-pad copper-line bonded intelligent card (IC) chip stacking packing piece and preparation method thereof |
| 04/30/2014 | CN102437117B Novel process for integrating silicide and metal foredielectric and forming structure thereof |
| 04/30/2014 | CN102427050B Shallow trench isolation technology without chemically mechanical polishing |
| 04/30/2014 | CN102412157B ACT dummy insert method used for raising semiconductor device performance |
| 04/30/2014 | CN102368471B COF (Chip On Flex) packaging method and structure for LCD (liquid crystal display) driving chips |
| 04/30/2014 | CN102339818B Power module and manufacture method thereof |
| 04/30/2014 | CN102308365B An conductive pattern and method for manufacturing same |
| 04/30/2014 | CN102282650B Back-junction solar cell |
| 04/30/2014 | CN102254880B Chip packaging device and manufacturing method thereof |
| 04/30/2014 | CN102246275B Methods of forming multi-doped junctions on a substrate |
| 04/30/2014 | CN102231372B Multi-turn arranged carrier-free IC (Integrated Circuit) chip packaging component and manufacturing method thereof |
| 04/30/2014 | CN102205521B Method for polishing a semiconductor wafer |
| 04/30/2014 | CN102201333B Photoresists and methods for use thereof |
| 04/30/2014 | CN102191486B 激光加工装置 The laser processing apparatus |
| 04/30/2014 | CN102171013B Compression molding method and device |
| 04/30/2014 | CN102164719B Suction sheet |
| 04/30/2014 | CN102105968B Chemical liquid feeding device |
| 04/30/2014 | CN102104012B Manufacturing method of light-emitting diode |
| 04/30/2014 | CN102099272B Glass substrate packaging device and glass substrate packaging method |
| 04/30/2014 | CN102097343B Wire bonding method for copper wire and support plate pad, and structure |
| 04/30/2014 | CN102087972B Flash memory device having a curved upper surface |
| 04/30/2014 | CN102077315B System and method to fabricate magnetic random access memory |
| 04/30/2014 | CN102067248B Magnetically controlled polymer nanocomposite material and methods for applying and curing same, and nanomagnetic composite for RF applications |
| 04/30/2014 | CN102045939B Metal layer structure of flexible multilayer base plate and preparation method thereof |
| 04/30/2014 | CN102034712B Method for forming shield gate channel field-effect transistor with three-mask and device therefor |
| 04/30/2014 | CN102024680B Substrate processing system |
| 04/30/2014 | CN101951802B Object comprising a graphics element transferred onto a support wafer and method of producing such an object |
| 04/30/2014 | CN101939819B Semiconductor component comprising a polycrystalline semiconductor layer |
| 04/30/2014 | CN101903998B Method for forming trenches with wide upper portion and narrow lower portion |
| 04/30/2014 | CN101878522B Methods and arrangement for creating models for fine-tuning recipes |
| 04/30/2014 | CN101826446B Film deposition apparatus and film deposition method |
| 04/30/2014 | CN101809709B Mask case, transfer apparatus, exposure apparatus, mask transfer method and device manufacturing method |
| 04/30/2014 | CN101789451B Semiconductor device and method for manufacturing the same |
| 04/30/2014 | CN101728390B Two terminal multi-channel ESD device and method therefor |
| 04/30/2014 | CN101728276B Method for manufacturing semiconductor device |
| 04/30/2014 | CN101714528B Semiconductor device and manufacturing method thereof |
| 04/30/2014 | CN101640220B Semiconductor device and manufacturing method thereof |
| 04/30/2014 | CN101615571B Vacuum chamber for processing substrate and apparatus including the same |
| 04/30/2014 | CN101054673B Light shield plasma etching method using protective cover |
| 04/29/2014 | US8712575 Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder |
| 04/29/2014 | US8712571 Method and apparatus for wireless transmission of diagnostic information |
| 04/29/2014 | US8711532 Integrated advance copper fuse combined with ESD/over-voltage/reverse polarity protection |
| 04/29/2014 | US8711333 Lithographic apparatus and device manufacturing method |
| 04/29/2014 | US8711330 Lithographic apparatus and device manufacturing method |
| 04/29/2014 | US8711323 Lithographic apparatus and device manufacturing method |
| 04/29/2014 | US8711280 Solid-state image sensing apparatus and electronic apparatus |
| 04/29/2014 | US8710859 Method for testing multi-chip stacked packages |
| 04/29/2014 | US8710682 Materials and methods for stress reduction in semiconductor wafer passivation layers |
| 04/29/2014 | US8710677 Multi-chip package with a supporting member and method of manufacturing the same |
| 04/29/2014 | US8710676 Stacked structure and stacked method for three-dimensional chip |
| 04/29/2014 | US8710675 Integrated circuit package system with bonding lands |
| 04/29/2014 | US8710672 Semiconductor device and method of manufacturing the same |
| 04/29/2014 | US8710669 Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer |
| 04/29/2014 | US8710664 Wafer-level chip scale package |
| 04/29/2014 | US8710660 Hybrid interconnect scheme including aluminum metal line in low-k dielectric |
| 04/29/2014 | US8710658 Under bump passive components in wafer level packaging |
| 04/29/2014 | US8710657 Semiconductor assembly and semiconductor package including a solder channel |
| 04/29/2014 | US8710656 Redistribution layer (RDL) with variable offset bumps |
| 04/29/2014 | US8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent |
| 04/29/2014 | US8710652 Embedded package and method for manufacturing the same |
| 04/29/2014 | US8710649 Wafer level package and fabrication method |
| 04/29/2014 | US8710647 Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring board |
| 04/29/2014 | US8710642 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus |
| 04/29/2014 | US8710638 Socket type MEMS device with stand-off portion |
| 04/29/2014 | US8710635 Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die |
| 04/29/2014 | US8710634 Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof |
| 04/29/2014 | US8710632 Compound semiconductor epitaxial structure and method for fabricating the same |
| 04/29/2014 | US8710631 Surface modification |
| 04/29/2014 | US8710629 Apparatus and method for controlling semiconductor die warpage |
| 04/29/2014 | US8710627 Uni-directional transient voltage suppressor (TVS) |
| 04/29/2014 | US8710626 Semiconductor device having trapezoidal shaped trenches |
| 04/29/2014 | US8710623 Integrated circuit having a discrete capacitor mounted on a semiconductor die |
| 04/29/2014 | US8710620 Method of manufacturing semiconductor devices using ion implantation |
| 04/29/2014 | US8710619 Semiconductor device and manufacturing method thereof |
| 04/29/2014 | US8710618 Fibrous laminate interface for security coatings |
| 04/29/2014 | US8710612 Semiconductor device having a bonding pad and shield structure of different thickness |
| 04/29/2014 | US8710611 High sensitivity stress sensor based on hybrid materials |
| 04/29/2014 | US8710609 Semiconductor arrangement with a solder resist layer |
| 04/29/2014 | US8710596 Semiconductor device |
| 04/29/2014 | US8710592 SRAM cells using shared gate electrode configuration |
| 04/29/2014 | US8710587 Lateral double diffused metal oxide semiconductor device and method of manufacturing the same |
| 04/29/2014 | US8710584 FET device having ultra-low on-resistance and low gate charge |
| 04/29/2014 | US8710582 Semiconductor device and method for manufacturing same |
| 04/29/2014 | US8710580 Semiconductor device and method of manufacturing the same |
| 04/29/2014 | US8710575 Semiconductor device, integrated circuit and method of manufacturing an integrated circuit |