Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/01/2014US20140116478 Substrate processing apparatus and substrate processing method
05/01/2014US20140116476 Systems for Surface Treatment of Semiconductor Substrates using Sequential Chemical Applications
05/01/2014US20140116466 Substrate cleaning apparatus and substrate cleaning method
05/01/2014US20140116464 Method for cleaning metal gate semiconductor
05/01/2014US20140116335 UV Irradiation Apparatus with Cleaning Mechanism and Method for Cleaning UV Irradiation Apparatus
05/01/2014US20140116328 Method and system for carbon doping control in gallium nitride based devices
04/2014
04/30/2014EP2725622A1 Silicon carbide semiconductor element and method for producing same
04/30/2014EP2725619A1 Semiconductor device and method of manufacturing same
04/30/2014EP2725615A1 Semiconductor device comprising a diode and method for producing such a device
04/30/2014EP2725607A2 Method of making a logic transistor and a non-volatile memory (nvm) cell
04/30/2014EP2725606A1 High-voltage integrated circuit device
04/30/2014EP2725605A2 Temporary wafer bonding
04/30/2014EP2725587A1 Method for forming conductive film, conductive film, insulation method, and insulation film
04/30/2014EP2725124A1 N-type conductive aluminum nitride semiconductor crystal and manufacturing method thereof
04/30/2014EP2725043A1 Resin composition for nano concave-convex structure, transparent member for monitor of vehicle navigation device and transparent member for cover of vehicle meter using same composition
04/30/2014EP2724378A2 Dmos transistor with cavity below drift region
04/30/2014EP2724377A2 Dmos transistor with a slanted super junction drift structure
04/30/2014EP2724376A1 Integrated circuit comprising a mosfet having ballast resistors and corresponding manufacturing method
04/30/2014EP2724372A1 High-reliability high-speed memristor
04/30/2014EP2724366A2 Etching a laser-cut semiconductor before dicing a die attach film (daf) or other material layer
04/30/2014EP2724365A1 Semiconductor cleaner systems and methods
04/30/2014EP2724364A2 Novel thermal processing apparatus
04/30/2014EP2724363A1 Wet chemistry processes for fabricating a semiconductor device with increased channel mobility
04/30/2014EP2724362A2 Semiconductor device and method for growing semiconductor crystal
04/30/2014EP2724361A2 Illumination control
04/30/2014EP2724197A1 Method and system for forming patterns with charged particle beam lithography
04/30/2014DE112012003423T5 Vorrichtung zum Fertigen eines Halbleiter- oder Metalloxidblocks Apparatus for fabricating a semiconductor or Metalloxidblocks
04/30/2014DE112012003394T5 Optische Kopplung mit Linsenanordnung mit einem photonischen Chip Optical coupling with lens array with a photonic chip
04/30/2014DE112012003382T5 Mikroelektronische Einheit Microelectronic unit
04/30/2014DE112012003360T5 Verfahren zum Berechnen der Stickstoffkonzentration in einem Silizium-Einkristall und Verfahren zur Berechnung des Betrags der Widerstandsänderung Method for computing the nitrogen concentration in a silicon single crystal and method for calculating the amount of change in resistance
04/30/2014DE112012003282T5 Siliciumcarbidhalbleitervorrichtung und Verfahren zum Herstellen derselben Siliciumcarbidhalbleitervorrichtung and method for manufacturing the same
04/30/2014DE112012003246T5 Siliziumkarbid-Halbleitervorrichtung Silicon carbide semiconductor device
04/30/2014DE112012003188T5 Leckstrommessung von Siliciumdurchkontaktierungen Leakage current measurement of Siliciumdurchkontaktierungen
04/30/2014DE112012002437T5 Verfahren zum Reinigen eines Halbleiterwafers A method for cleaning a semiconductor wafer
04/30/2014DE112012002411T5 Polierkopf, Poliervorrichtung und Verfahren zum Polieren eines Werkstücks Polishing head, the polishing apparatus and method of polishing a workpiece
04/30/2014DE112010002352B4 Verfahren zur Herstellung von FinFET-Strukturen mit verspannungsinduzierenden Source/Drain-biIdenden Abstandshaltern und FinFET-Strukturen Process for the preparation of FinFET structures with stress-inducing source / drain biIdenden spacers and FinFET structures
04/30/2014DE112009005044B4 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation
04/30/2014DE10256200B4 Flash-Speicherzelle und Verfahren zur Herstellung dieser, sowie ein Programmier-/Lösch-/Lese-Verfahren in der Flash-Speicherzelle Flash memory cell and method for producing these, and a program / erase / read process in the flash memory cell
04/30/2014DE102013211552B3 Method for producing hetero-structure-type transistor e.g. power transistor for use in control device for electromotor in hybrid or electric car, involves connecting hetero-structure comprising carrier layer for dissipating heat
04/30/2014DE102013112029A1 Halbleiterbauelement mit Kapselung Semiconductor component with encapsulation
04/30/2014DE102013112012A1 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
04/30/2014DE102013112009A1 Superjunction-Halbleitervorrichtung mit einem Zellengebiet und einem Randgebiet Superjunction semiconductor device having a cell region and a peripheral area
04/30/2014DE102013111848A1 Passivierungsschicht und Verfahren zum Herstellen einer Passivierungsschicht Passivation layer and process for producing a passivation layer
04/30/2014DE102013111792A1 Verfahren zum verarbeiten eines halbleiterträgers, halbleiterchipanordnung und verfahren zum herstellen eines halbleiterbauelements A method for processing a semi-conductor carrier, semiconductor chip assembly and method of manufacturing a semiconductor device
04/30/2014DE102013111772A1 Halbleiterbauelemente und Verfahren zur Herstellung von Halbleiterbauelementen Semiconductor devices and methods of manufacturing of semiconductor devices
04/30/2014DE102013111744A1 Elektronenstrahl-Belichtungsverfahren Electron beam exposure method
04/30/2014DE102013111548A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
04/30/2014DE102013104268A1 Integrierte Schaltkreisstrukturen, die Basiswiderstandsabstimmungsbereiche aufweisen, und Verfahren zum Ausbilden derselben Integrated circuit structures having base resistance voting regions, and method of forming same
04/30/2014DE102013100645A1 Halbleiterbauteile, Verfahren zur Herstellung dieser sowie gepackte Halbleiterbauteile Semiconductor devices, processes for preparing these and packaged semiconductor devices
04/30/2014DE102012219879A1 Verfahren zum Herstellen eines LED-Moduls mit Kühlkörper A method for manufacturing an LED module with heat sink
04/30/2014DE102012219769A1 Verfahren zum Herstellen einer elektrischen Durchkontaktierung in einem Substrat sowie Substrat mit einer elektrischen Durchkontaktierung A method of making an electrical plated-through hole in a substrate as well as substrate to an electrical through-contact
04/30/2014DE102012219661A1 Individualisierte Spannungsversorgung von Bauelementen integrierter Schaltungen alsSchutzmaßnahme gegen Seitenkanalangriffe Individualized supply of components integrated circuits alsSchutzmaßnahme against side channel attacks
04/30/2014DE102012219622A1 Micro-technological component e.g. acceleration sensor, has interlayer arranged between substrate and multi-layer, where side surfaces of interlayer are covered by cover and bond is arranged between multi-layer and silicon layer
04/30/2014DE102012219582A1 Method for forming contact of electrode stack for micro-electromechanical component used in e.g. mobile telephone, involves etching functional layers at exposed portion of interfaces for exposing the surface portions of the electrodes
04/30/2014DE102009012878B4 Schauerkopf und Substratbearbeitungsvorrichtung Shower head and substrate processing apparatus
04/30/2014DE102008046226B4 U-förmige Zweibit-Speichereinrichtung und Verfahren zu deren Herstellung U-shaped two-bit memory device and methods for their preparation
04/30/2014DE102007057728B4 Verfahren zur Herstellung eines Halbleiterbauelements mit einer Kurzschlusstruktur A process for producing a semiconductor device with a Kurzschlusstruktur
04/30/2014DE102007054222B4 Halbleiterbauteil mit Trench-Transistoren und Verfahren zur Herstellung eines solchen Bauteils A semiconductor device with trench transistors and methods for producing such a component
04/30/2014DE102007022533B4 Verfahren zum Herstellen eines Halbleiterelements und Halbleiterelement A method of manufacturing a semiconductor element and semiconductor element
04/30/2014DE102006033222B4 Modul mit flachem Aufbau und Verfahren zur Bestückung Module having a flat structure and method for mounting
04/30/2014DE102006030880B4 Laserbearbeitungsverfahren für einen Wafer A laser processing method for a wafer
04/30/2014DE102005047124B4 Laserstrahl-Bearbeitungsmaschine Laser beam processing machine
04/30/2014DE10165081B4 Verfahren zur Herstellung einer Halbton-Phasenverschiebungsmaske A method for producing a halftone phase shift mask
04/30/2014CN203573977U IC chip stacking packaging part with high packaging density and good high-frequency performance
04/30/2014CN203573965U Mechanical arm capable of carrying out precise transportation operation under high vacuum
04/30/2014CN203573964U Vacuum mechanical arm for handling wafer
04/30/2014CN203573963U Dustproofing magazine
04/30/2014CN203573962U Overflow material removing device
04/30/2014CN203573961U Intelligent card packaging machine
04/30/2014CN203573960U Silicon chip subfissure detection device
04/30/2014CN203573959U Flexibility detecting device for axial type rectifying chip pins
04/30/2014CN203573958U Surface mount diode appearance detection jig
04/30/2014CN203573957U Surface mount diode carrier tap sealing tool
04/30/2014CN203573956U Transistor
04/30/2014CN203573955U Semiconductor process air feeding device
04/30/2014CN103766013A Pattern forming apparatus and method, and method of manufacturing substrate formed with pattern
04/30/2014CN103766005A Switched electron beam plasma source array for uniform plasma production
04/30/2014CN103766004A Antenna for plasma processing apparatus, and plasma processing apparatus using antenna
04/30/2014CN103766003A Electron beam plasma source with segmented beam dump for uniform plasma generation
04/30/2014CN103766002A Plasma-generating source comprising a belt-type magnet, and thin-film deposition system using same
04/30/2014CN103766001A Plasma generator and CVD device
04/30/2014CN103766000A CVD device, and CVD film production method
04/30/2014CN103765597A TFT (Thin Film Transistor), manufacturing method thereof, array substrate, display device and barrier layer
04/30/2014CN103765596A Thin-film transistor
04/30/2014CN103765595A Semiconductor device structures including vertical transistor devices, arrays of vertical transistor devices, and methods of fabrication
04/30/2014CN103765593A Ga2o3 semiconductor element
04/30/2014CN103765583A Memory cells
04/30/2014CN103765582A 半导体装置 Semiconductor device
04/30/2014CN103765580A Integrated circuit device and method of identifying a presence of a broken connection within an external signal path
04/30/2014CN103765578A Integrated circuit package
04/30/2014CN103765575A Vertical memory cell
04/30/2014CN103765574A 半导体装置 Semiconductor device
04/30/2014CN103765573A Susceptor
04/30/2014CN103765572A Device and system for processing flat substrates
04/30/2014CN103765571A Vacuum processing device
04/30/2014CN103765570A Horizontal displacement mechanism for cleanroom material transfer systems
04/30/2014CN103765569A Wafer container with particle shield
04/30/2014CN103765568A System for the heat treatment of substrates, and method for detecting measurement data in said system
04/30/2014CN103765567A Method and apparatus for inspection of light emitting semiconductor devices using photoluminescence imaging
04/30/2014CN103765566A Flip chip bonding device