Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2014
04/30/2014CN103765565A Semiconductor device
04/30/2014CN103765564A Crystallization methods
04/30/2014CN103765563A 金属充填装置 Metal filling device
04/30/2014CN103765562A Selective suppression of dry-etch rate of materials containing both silicon and nitrogen
04/30/2014CN103765561A Method for cleaning metal gate semiconductor
04/30/2014CN103765560A Metal filling apparatus
04/30/2014CN103765559A SiC epitaxial wafer and method for manufacturing same
04/30/2014CN103765558A Film forming method and storage medium
04/30/2014CN103765557A Vapor deposition apparatus
04/30/2014CN103765556A Discontinuous patterned bonds for semiconductor devices and associated systems and methods
04/30/2014CN103765555A Exposure device, exposure method, method for manufacturing device, program and recording medium
04/30/2014CN103765554A Mobile device, exposure device, method for producing flat panel display, and method for producing device
04/30/2014CN103765553A Screening process for manufacturing a Z-directed component for a printed circuit board
04/30/2014CN103765313A Photosensitive alkali-soluble silicone resin composition
04/30/2014CN103765307A Active matrix display device
04/30/2014CN103765202A Wiring defect detection method and wiring defect detection device
04/30/2014CN103765143A Furnace system with case integrated cooling system
04/30/2014CN103765113A Integrated building based air handler for server farm cooling system
04/30/2014CN103764881A Semiconductor formation by lateral diffusion liquid phase epitaxy
04/30/2014CN103764776A Adhesive composition and connection body
04/30/2014CN103764385A Function-transferring object, method for transferring functional layer, package and function-transferring film roll
04/30/2014CN103764361A Resin mold bonding method and roll-to-roll continuous mold composition using same
04/30/2014CN103764346A Polishing pad
04/30/2014CN103764345A Resin-coated saw wire and cut body
04/30/2014CN103763868A Method for soldering 0201 capacitor row
04/30/2014CN103762291A Sheet arrangement device and sheet feeding device suitable for EMC package of LED supports
04/30/2014CN103762280A Multi-cavity texturing system
04/30/2014CN103762273A Method for manufacturing battery through wet etching equipment
04/30/2014CN103762271A Method for planarization of double faces of mercury-cadmium-telluride infrared material device
04/30/2014CN103762266A Photovoltaic module quality automatic detection method
04/30/2014CN103762263A Photosensitive unit, array substrate of display panel and manufacturing method of array substrate
04/30/2014CN103762246A Thin film transistor field-effect transistor and manufacturing method thereof
04/30/2014CN103762245A Thin film transistor, array substrate, manufacturing method and display device of thin film transistor and manufacturing method and display device of array substrate
04/30/2014CN103762244A Thin film transistor, manufacturing method of thin film transistor, thin film transistor array substrate and liquid crystal panel
04/30/2014CN103762243A Superjunction structures for power devices and methods of manufacture
04/30/2014CN103762240A LDMOS device and manufacturing method thereof
04/30/2014CN103762239A Radio-frequency power LDMOS device and manufacturing method thereof
04/30/2014CN103762238A Radio-frequency power LDMOS device with field plate and preparation method thereof
04/30/2014CN103762235A AlGaN/GaN high-voltage device based on super junction leakage field plate and manufacturing method thereof
04/30/2014CN103762234A AlGaN/GaN MISHEMT high-voltage device based on super junction leakage field plate and manufacturing method thereof
04/30/2014CN103762233A Novel HEMT for improving piezoelectric polarization intensity
04/30/2014CN103762227A Oxide thin film, transistor with same and preparation method of transistor
04/30/2014CN103762223A Light-emitting device with oxide thin-film transistor and manufacturing method thereof
04/30/2014CN103762218A Array substrate, manufacturing method thereof and display device
04/30/2014CN103762217A Manufacturing method of ferroelectric memory
04/30/2014CN103762216A Data cells with drivers and methods of making and operating the same
04/30/2014CN103762205A Multifunctional base plate based on PCB technology and manufacturing method thereof
04/30/2014CN103762203A Heat dissipation structure based on rigid-flexible printed circuit board three-dimensional packaging and manufacturing method
04/30/2014CN103762202A Chip packaging method and structure
04/30/2014CN103762201A MEMS sensor, semiconductor package device and method
04/30/2014CN103762200A Chip packaging part and packaging method of chip packaging part
04/30/2014CN103762199A Method for manufacturing array base plate of liquid crystal display
04/30/2014CN103762198A TSV pore filling method
04/30/2014CN103762197A Method for manufacturing novel Damascus copper and copper bonding structure
04/30/2014CN103762196A Disk clamping device and disk rotating platform
04/30/2014CN103762195A Double-workpiece table macro and micro fast connecting mechanism
04/30/2014CN103762194A Method for manufacturing flexible display device
04/30/2014CN103762193A Methods of and apparatus for reducing amounts of particles on a wafer during wafer de-chucking
04/30/2014CN103762192A High precision chip mounting machine
04/30/2014CN103762191A Precise moving device and control method based on packaging hot press head
04/30/2014CN103762190A PCB automatic feeding method
04/30/2014CN103762189A System capable of improving silicon wafer uniformity
04/30/2014CN103762188A Method for identifying temperature of electrostatic chuck and wafer in semiconductor long film process
04/30/2014CN103762187A Chip packaging method and structure
04/30/2014CN103762186A Laminated packaging method for semiconductor
04/30/2014CN103762185A Laminated packaging method for semiconductor
04/30/2014CN103762184A Chip package and a method for manufacturing a chip package
04/30/2014CN103762183A Manufacturing technology for fan-out-type square chip level packaging
04/30/2014CN103762182A TSV packaging redistribution layer preparing method based on water glass-ceramic composite medium
04/30/2014CN103762181A Method for preparing aluminium nitride copper-coated ceramic substrate
04/30/2014CN103762180A Method for improving thickness of bottom oxide of groove-type MOS
04/30/2014CN103762179A Structure and method for forming a thick bottom dielectric (TBD) for trench-gate devices
04/30/2014CN103762178A LTPS TFT and manufacturing method thereof
04/30/2014CN103762177A Reduction of proximity effects in field-effect transistors with embedded silicon-germanium source and drain regions
04/30/2014CN103762176A Preparation method for polysilicon thin film with bridged crystal-grain structure
04/30/2014CN103762175A Preparation method for polysilicon thin film with bridged crystal-grain structure
04/30/2014CN103762174A Preparation method for thin-film transistor
04/30/2014CN103762173A Method for preparing polysilicon thin film
04/30/2014CN103762172A Preparation method of polysilicon thin film with bridged-grain structure
04/30/2014CN103762171A Manufacturing method of polysilicon thin film
04/30/2014CN103762170A Manufacturing method of bridged-grain polysilicon thin film
04/30/2014CN103762169A Bottom gate thin film transistor and manufacturing method thereof
04/30/2014CN103762168A Manufacture method of bottom gate thin film transistor
04/30/2014CN103762167A Bridged-grain polysilicon thin film transistor and manufacturing method thereof
04/30/2014CN103762166A Manufacturing method of precisely-aligned bridged-grain polysilicon thin film transistor
04/30/2014CN103762165A Simplified manufacturing method of bridged-grain polysilicon thin film transistor
04/30/2014CN103762164A Heat treatment device capable of rapidly achieving air cooling
04/30/2014CN103762163A Method for manufacturing mask used for indium antimonide heat diffusion technology
04/30/2014CN103762162A Double-end-controllable groove type insulated gate bipolar transistor and preparation method thereof
04/30/2014CN103762161A Method and apparatus for processing a semiconductor workpiece
04/30/2014CN103762160A Deep silicon etching method and device
04/30/2014CN103762159A Method for graphing conductive polymer film by using metal protecting layer
04/30/2014CN103762158A Method for inducing quantum well mixing through plasmas in laser microcell
04/30/2014CN103762157A Method for manufacturing capacitors with large unit capacitance in ordinary LOGIC process
04/30/2014CN103762156A Manufacturing method of semiconductor substrate, semiconductor substrate and high-voltage transistor
04/30/2014CN103762155A Silicon wafer cleaning process
04/30/2014CN103761562A Double-interface IC manufacturing method and automatic production device of double-interface IC
04/30/2014CN103760934A Method and system used for monitoring temperature of semiconductor heat treatment equipment
04/30/2014CN103760721A Thin film transistor array substrate, preparation method for same and display device of thin film transistor array substrate
04/30/2014CN103759860A Thermocouple fault diagnosis and processing method and system of semiconductor heat treatment device
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