Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/01/2014US20140120293 Electrostatic discharge compatible dicing tape with laser scribe capability
05/01/2014US20140119858 Semiconductor Device Manufacturing Line
05/01/2014US20140119857 Automated Material Handling System for Semiconductor Manufacturing Based on a Combination of Vertical Carousels and Overhead Hoists
05/01/2014US20140119856 Substrate transport apparatus with active edge gripper
05/01/2014US20140118880 Performance enhancement of coating packaged esc for semiconductor apparatus
05/01/2014US20140118711 Exposure Device for the Structured Exposure of a Surface
05/01/2014US20140118059 Through-substrate via shielding
05/01/2014US20140118055 Igbt die structure with auxiliary p well terminal
05/01/2014US20140117953 Method and apparatus for a tunable driver circuit
05/01/2014US20140117563 Photoactive Compound Gradient Photoresist
05/01/2014US20140117561 Etch damage and esl free dual damascene metal interconnect
05/01/2014US20140117560 Semiconductor Structures and Methods of Manufacturing the Same
05/01/2014US20140117559 Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (tsvs)
05/01/2014US20140117558 Self-enclosed asymmetric interconnect structures
05/01/2014US20140117557 Package substrate and method of forming the same
05/01/2014US20140117556 Through silicon via stacked structure and a method of manufacturing the same
05/01/2014US20140117555 Integrated Circuit Underfill Scheme
05/01/2014US20140117554 Packaged integrated circuit having large solder pads and method for forming
05/01/2014US20140117553 Packaging substrate, method for manufacturing same, and chip packaging body having same
05/01/2014US20140117551 Processing system for forming film on target object
05/01/2014US20140117550 Semiconductor device including an insulating layer, and method of forming the semiconductor device
05/01/2014US20140117549 Method of manufacturing semiconductor device, and semiconductor device
05/01/2014US20140117548 Semiconductor device and method of manufacturing the same
05/01/2014US20140117547 Barrier layer for copper interconnect
05/01/2014US20140117546 Hybrid bonding mechanisms for semiconductor wafers
05/01/2014US20140117545 Copper hillock prevention with hydrogen plasma treatment in a dedicated chamber
05/01/2014US20140117538 Package structure and fabrication method thereof
05/01/2014US20140117537 Semiconductor package and method of fabricating the same
05/01/2014US20140117535 Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
05/01/2014US20140117534 Interconnection Structure
05/01/2014US20140117533 Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
05/01/2014US20140117532 Bump Interconnection Ratio for Robust CPI Window
05/01/2014US20140117531 Semiconductor device with encapsulant
05/01/2014US20140117530 Semiconductor Devices and Methods for Manufacturing Semiconductor Devices
05/01/2014US20140117529 Semiconductor Constructions, Patterning Methods, and Methods of Forming Electrically Conductive Lines
05/01/2014US20140117525 Power module package and method of manufacturing the same
05/01/2014US20140117523 Stacked dual-chip packaging structure and preparation method thereof
05/01/2014US20140117521 Semiconductor device with thermal dissipation lead frame
05/01/2014US20140117512 Surface profile for semiconductor region
05/01/2014US20140117511 Passivation Layer and Method of Making a Passivation Layer
05/01/2014US20140117510 Semiconductor Bonding Structure and Process
05/01/2014US20140117509 Metal Deposition with Reduced Stress
05/01/2014US20140117507 Double trench well formation in sram cells
05/01/2014US20140117505 Chip Having Backside Metal and Method for Manufacturing Same
05/01/2014US20140117504 Ephemeral bonding
05/01/2014US20140117503 Ephemeral bonding
05/01/2014US20140117502 Method for processing a semiconductor carrier, a semiconductor chip arrangement and a method for manufacturing a semiconductor device
05/01/2014US20140117497 Decoupling Capacitors For Integrated Circuits
05/01/2014US20140117493 Isolation scheme for bipolar transistors in bicmos technology
05/01/2014US20140117490 Semiconductor device including esd protection device
05/01/2014US20140117489 Sub-second annealing lithography techniques
05/01/2014US20140117488 Pattern decomposition lithography techniques
05/01/2014US20140117473 Packages and methods for packaging
05/01/2014US20140117469 Tsv-mems combination
05/01/2014US20140117468 Methods and integrated circuit package for sensing fluid properties
05/01/2014US20140117467 Metal-Oxide-Semiconductor Field-Effect Transistor with Spacer over Gate
05/01/2014US20140117466 Replacement gate electrode with multi-thickness conductive metallic nitride layers
05/01/2014US20140117462 Bulk finfet with punchthrough stopper region and method of fabrication
05/01/2014US20140117461 Connecting Through Vias to Devices
05/01/2014US20140117456 Semiconductor Device and Fabrication Method Thereof
05/01/2014US20140117455 Multigate field effect transistor and process thereof
05/01/2014US20140117454 FinFET with Dummy Gate on Non-Recessed Shallow Trench Isolation (STI)
05/01/2014US20140117446 LDMOS Device with Minority Carrier Shunt Region
05/01/2014US20140117444 Lateral MOSFET
05/01/2014US20140117443 Double diffused metal oxide semiconductor device and manufacturing method thereof
05/01/2014US20140117442 Semiconductor structure
05/01/2014US20140117437 Super Junction Semiconductor Device Comprising a Cell Area and an Edge Area
05/01/2014US20140117436 Semiconductor device and method for fabricating the same
05/01/2014US20140117434 Nonvolatile semiconductor memory device and method for manufacturing same
05/01/2014US20140117426 Semiconductor device and method for fabricating the same
05/01/2014US20140117425 Interlayer dielectric for non-planar transistors
05/01/2014US20140117422 Fin field effect transistors having a nitride containing spacer to reduce lateral growth of epitaxially deposited semiconductor materials
05/01/2014US20140117421 Self-aligned contact structure for replacement metal gate
05/01/2014US20140117420 Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structure
05/01/2014US20140117419 Fin etch and fin replacement for finfet integration
05/01/2014US20140117418 Three-dimensional silicon-based transistor comprising a high-mobility channel formed by non-masked epitaxy
05/01/2014US20140117417 Performance enhancement in transistors by providing a graded embedded strain-inducing semiconductor region with adapted angles with respect to the substrate surface
05/01/2014US20140117415 Junction field effect transistors and associated fabrication methods
05/01/2014US20140117414 Semiconductor device having a triple gate transistor and method for manufacturing the same
05/01/2014US20140117413 Pads and pin-outs in three dimensional integrated circuits
05/01/2014US20140117409 Method and structure for body contacted fet with reduced body resistance and source to drain contact leakage
05/01/2014US20140117407 Power semiconductor device and method of manufacturing the same
05/01/2014US20140117406 Reverse blocking mos semiconductor device and manufacturing method thereof
05/01/2014US20140117382 Epitaxial Wafer, Method for Fabricating the Wafer, and Semiconductor Device Including the Wafer
05/01/2014US20140117381 Epitaxial Wafer, Method for Fabricating the Same, and Semiconductor Device Including the Same
05/01/2014US20140117380 Flat sic semiconductor substrate
05/01/2014US20140117379 Semiconductor device and method of manufacturing the same
05/01/2014US20140117364 Semiconductor Device and Manufacturing Method Thereof
05/01/2014US20140117356 Semiconductor structure for improved oxide fill in
05/01/2014US20140117349 Semiconductor device and manufacturing method of semiconductor device using metal oxide
05/01/2014US20140117345 Optoelectronic component and method for the production thereof
05/01/2014US20140117308 Electronic Device Containing Nanowire(s), Equipped with a Transition Metal Buffer Layer, Process for Growing at Least One Nanowire, and Process for Manufacturing a Device
05/01/2014US20140117301 Wrap around phase change memory
05/01/2014US20140117235 Standard wafer and its fabrication method
05/01/2014US20140117119 Member for semiconductor manufacturing apparatus and method for manufacturing the same
05/01/2014US20140117098 Method for Manufacturing a Data Carrier
05/01/2014US20140117005 Diffusion furnace
05/01/2014US20140116920 Reticle Pod
05/01/2014US20140116623 Etching treatment apparatus
05/01/2014US20140116480 Substrate processing apparatus and substrate processing method
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