Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/23/2008WO2008128164A1 Accumulation field effect microelectronic device and process for the formation thereof
10/23/2008WO2008128160A1 Hemts based on si/nitride structures
10/23/2008WO2008128122A2 Formation of photovoltaic absorber layers on foil substrates
10/23/2008WO2008128080A2 Electrostatic dissipative stage for use in forming lcd products
10/23/2008WO2008127985A1 Flip chip with interposer, and methods of making same
10/23/2008WO2008127935A1 Metal complex compositions and methods for making metal-containing films
10/23/2008WO2008127807A1 Systems and methods of laser texturing of material surfaces and their applications
10/23/2008WO2008127643A2 Strain enhanced semiconductor devices and methods for their fabrication
10/23/2008WO2008127628A1 Method of fabricating a self-aligning damascene memory structure
10/23/2008WO2008127484A2 Structure and method for dual work function metal gate electrodes by control of interface dipoles
10/23/2008WO2008127469A2 A novel fabrication technique for high frequency, high power group iii nitride electronic devices
10/23/2008WO2008127452A2 Glue layer for hydrofluorocarbon etch
10/23/2008WO2008127412A2 Radiation hardened lateral mosfet structure
10/23/2008WO2008127395A2 Ceramic high temperature lubricity agent
10/23/2008WO2008127293A2 Memory transistor with nanodot floating gate and carbon nanotube control gate and manufacturing method thereof
10/23/2008WO2008127055A1 Method for forming fine patterns
10/23/2008WO2008126955A1 Apparatus for inspecting semiconductor device
10/23/2008WO2008126954A1 Tool for transferring semiconductor device
10/23/2008WO2008126917A1 Semiconductor device
10/23/2008WO2008126914A1 Electrode structure and semiconductor device
10/23/2008WO2008126891A1 Dry etching method
10/23/2008WO2008126821A1 Semiconductor device having hetero junction
10/23/2008WO2008126818A1 Photosensitive resin composition
10/23/2008WO2008126804A1 Composition for forming under-resist film
10/23/2008WO2008126776A1 Fabrication method of a semiconductor device and a semiconductor device
10/23/2008WO2008126774A1 Semiconductor memory device and method for manufacturing the same
10/23/2008WO2008126729A1 Semiconductor element, method for manufacturing the semiconductor element, and electronic device provided with the semiconductor element
10/23/2008WO2008126718A1 Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film
10/23/2008WO2008126717A1 Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them
10/23/2008WO2008126707A1 Coating solution for surface flat insulating formation, surface flat insulating film covering base material, and process for producing surface flat insulating film covering base material
10/23/2008WO2008126695A1 Nitride semiconductor light emitting device and process for producing the same
10/23/2008WO2008126625A1 Resin for formation of upper antireflective film, composition for formation of upper antireflective film, and resist pattern formation method
10/23/2008WO2008126622A1 Method for film formation, apparatus for film formation, and recording medium
10/23/2008WO2008126611A1 Polishing pad
10/23/2008WO2008126601A1 Probe card
10/23/2008WO2008126595A1 Plasma treatment apparatus and method of plasma treatment
10/23/2008WO2008126588A1 Semiconductor device and its manufacturing method
10/23/2008WO2008126578A1 Polishing pad
10/23/2008WO2008126574A1 Laminate structure and its manufacturing method
10/23/2008WO2008126570A1 Optical integrator, illuminating optical device, exposure apparatus and device manufacturing method
10/23/2008WO2008126556A1 Conveyor
10/23/2008WO2008126541A1 Semiconductor device and method for manufacturing the same
10/23/2008WO2008126532A1 Substrate for epitaxial growth and method for producing nitride compound semiconductor single crystal
10/23/2008WO2008126527A1 Method of compression molding for electronic part and apparatus therefor
10/23/2008WO2008126526A1 Photosensitive resin composition and layered product
10/23/2008WO2008126523A1 Film forming composition for nanoimprinting, process for production of structures, and structures
10/23/2008WO2008126522A1 Copper electrolyte solution and two-layer flexible substrate obtained by using the same
10/23/2008WO2008126497A1 Process for producing polyurethane foam
10/23/2008WO2008126492A1 Field-effect transistor, and process for producing field-effect transistor
10/23/2008WO2008126490A1 Semiconductor device and method for manufacturing the same
10/23/2008WO2008126468A1 Semiconductor device and method for manufacturing semiconductor device
10/23/2008WO2008126454A1 Substrate conveying apparatus
10/23/2008WO2008126447A1 Wiring structure of electronic apparatus and method for manufacturing electronic apparatus package
10/23/2008WO2008126425A1 Patterning method and method for fabricating electronic element
10/23/2008WO2008126313A1 Imprint mold and process for producing the same
10/23/2008WO2008126312A1 Thermal imprinting apparatus and method of thermal imprinting
10/23/2008WO2008126270A1 Semiconductor integrated circuit
10/23/2008WO2008126268A1 Semiconductor device
10/23/2008WO2008126264A1 Semiconductor integrated circuit device
10/23/2008WO2008126255A1 Process for producing semiconductor device
10/23/2008WO2008126239A1 Semiconductor integrated circuit and clock control method
10/23/2008WO2008126229A1 Semiconductor integrated circuit and control signal distributing method
10/23/2008WO2008126213A1 Ultrasonic bonding apparatus
10/23/2008WO2008126212A1 Ultrasonic bonding apparatus
10/23/2008WO2008126211A1 Ultrasonic bonding apparatus and ultrasonic bonding method
10/23/2008WO2008126208A1 Manufacturing system, cassette, and mounting cassette
10/23/2008WO2008126207A1 Semiconductor integrated circuit designing method
10/23/2008WO2008126206A1 Process for producing semiconductor device
10/23/2008WO2008126197A1 Process for producing semiconductor device
10/23/2008WO2008126177A1 Nonvolatile semiconductor storage device, and its manufacturing method
10/23/2008WO2008126173A1 Tcp handling device
10/23/2008WO2008125921A1 Etch method in the manufacture of a semiconductor device
10/23/2008WO2008125638A1 Use of oxidants for the processing of semiconductor wafers, use of a composition and composition therefore
10/23/2008WO2008125551A1 Semiconductor device structure
10/23/2008WO2008125543A2 Method for reducing the thickness of substrates
10/23/2008WO2008125511A1 Method of depositing localized coatings
10/23/2008WO2008125454A1 Device and method for the removal of solder remnants
10/23/2008WO2008125440A1 Electrical interconnect structure and method of forming the same
10/23/2008WO2008125372A1 Method for the production of a signal and potential distribution system for mechatronic modules
10/23/2008WO2008125327A1 Method and system for the reproducible positioning of a target object in the effective volume of a laser beam
10/23/2008WO2008125011A1 Method and apparatus for testing system-in-package devices, micro sd devices
10/23/2008WO2008125010A1 A method of manufacturing the high heat conductive circuit substrate
10/23/2008WO2008125003A1 Low etch cleaning composition for removing resist
10/23/2008WO2008125002A1 Cleaning composition for removing thick film resist
10/23/2008WO2008108783A3 Radio frequency devices with enhanced ground structure
10/23/2008WO2008106520A3 Single wafer anneal processor
10/23/2008WO2008103456A3 Pulsed plasma system with pulsed sample bias for etching semiconductor structures
10/23/2008WO2008103454A3 Pulsed plasma system for etching semiconductor structures
10/23/2008WO2008102259A3 Antireflective coating composition based on a silicon polymer
10/23/2008WO2008101699A3 Method for laser supported bonding substrates bonded thus and use thereof
10/23/2008WO2008100718A3 Substrate heating method and apparatus
10/23/2008WO2008089401A9 Flexible transparent electrodes via nanowires and sacrificial conductive layer
10/23/2008WO2008079684B1 Electron blocking layers for electronic devices
10/23/2008WO2008063785A9 Radio frequency identification (rfid) tag lamination process
10/23/2008WO2008021860A3 Process for precision placement of integrated circuit overcoat material
10/23/2008WO2008013604A3 Solar cell with reduced base diffusion area
10/23/2008WO2008005754A3 Modular chemical vapor deposition (cvd) reactor
10/23/2008WO2007146643A3 Multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same
10/23/2008WO2007140426A9 Process chamber for dielectric gapfill
10/23/2008WO2007126469A3 Method for conditioning a process chamber
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