Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/22/2008CN101290894A Semiconductor device and its manufacture method
10/22/2008CN101290893A Glue sealing method of sensor chip
10/22/2008CN101290892A Sensing type semiconductor device and its manufacture
10/22/2008CN101290891A Wafer stage encapsulation method of chip dimension
10/22/2008CN101290890A Circuit board with internally embedded conductive wire and manufacturing method therefor
10/22/2008CN101290889A Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
10/22/2008CN101290888A Method of manufacturing printed circuit board for semiconductor package
10/22/2008CN101290887A Manufacturing method of semiconductor device
10/22/2008CN101290886A Manufacturing method of grid dielectric layer and grid
10/22/2008CN101290885A Manufacturing method of separating wall
10/22/2008CN101290884A Etching method capable of enhancing homogeneity of grid flutes on a same wafer
10/22/2008CN101290883A Soft chemistry method for preparing ultrathin HfO* or ZrO* gate dielectric membrane
10/22/2008CN101290882A Manufacturing method of oxide layer of gate capable of enhancing homogeneity
10/22/2008CN101290881A Non-volatile memory device and method for fabricating the same
10/22/2008CN101290880A Method for repairing etching injury on lateral wall of polysilicon gate and manufacturing method of gate
10/22/2008CN101290879A Manufacturing method of gate
10/22/2008CN101290878A Method of manufacturing semiconductor film and method of manufacturing photovoltaic element
10/22/2008CN101290877A Preparing method of polycrystalline silicon thin film
10/22/2008CN101290876A Method of manufacturing soi substrate
10/22/2008CN101290875A Discrete silicon-containing substrate and device low temperature manufacture
10/22/2008CN101290874A Forming method of grooves with shallow groove isolation and semiconductor structure
10/22/2008CN101290873A Hollow anode plasma reactor and method
10/22/2008CN101290872A Method for manufacturing bonded substrate
10/22/2008CN101290871A Vertical furnace having lot-unit transfer function and related transfer control method
10/22/2008CN101290870A Method for forming pattern, method for manufacturing semiconductor device and semiconductor device
10/22/2008CN101290869A Plasma treatment apparatus and short circuit of high frequency current
10/22/2008CN101290868A Preparing method of reference power supply with adjustable voltage
10/22/2008CN101290867A Method of forming micro pattern of semiconductor device
10/22/2008CN101290866A Groove etching method
10/22/2008CN101290865A Method for preventing generating surface blemish in etching process
10/22/2008CN101290864A Supplying system
10/22/2008CN101290639A Semiconductor integrated circuit and layout method for the same
10/22/2008CN101290611A Data abnormal point detection method and device
10/22/2008CN101290481A Etching process for controlling characteristic size shrinkage
10/22/2008CN101290475A Method for improving characteristic line breadth homogeneity
10/22/2008CN101290468A Mask preparation method
10/22/2008CN101290446A TFT-LCD array substrate and method of manufacture
10/22/2008CN101290436A Liquid crystal display panel and manufacturing method thereof
10/22/2008CN101290418A Substrate treating device
10/22/2008CN101290329A Probe unit and checking device
10/22/2008CN101289736A Partial pressure measuring method and partial pressure measuring apparatus
10/22/2008CN101289641A Cleaning agent for polishing wafer
10/22/2008CN101289640A Cleaning agent for grinding wafer
10/22/2008CN101289284A Process for effectively controlling air bubble producing in forming process of fluorine-containing silex glass interlayer medium layer
10/22/2008CN101289000A Guard film module housing container and production method thereof
10/22/2008CN101288868A Removal tool of cementation wax and removal method of cementation wax using the said tool
10/22/2008CN101288863A Conveyer belt of substrate material
10/22/2008CN100428591C Encapsulation structure and method of the high-speed semiconductor light emission component
10/22/2008CN100428525C Organic electroluminescent display panel
10/22/2008CN100428521C Organic semiconductor transistor element
10/22/2008CN100428504C Semiconductor device and its preparing method
10/22/2008CN100428502C Method for preparation of a-b orientated ZnO nanometer linear array
10/22/2008CN100428498C Adhesive of a silicon and silica composite particularly useful for joining silicon parts
10/22/2008CN100428497C Structure and method of making strained semiconductor CMOS transistors
10/22/2008CN100428495C P-type and N-type zinc oxide thin film and producing method thereof
10/22/2008CN100428494C Semiconductor device and method for manufacturing the same
10/22/2008CN100428493C Heat resistance structure on plastic substrate and forming method
10/22/2008CN100428491C Integrate circuit and method producing same
10/22/2008CN100428490C Insulated gate transistor and inverter circuit
10/22/2008CN100428489C Organic light emitting diode and its producing method
10/22/2008CN100428487C Photodiode of cmos image sensor and method for manufacturing the same
10/22/2008CN100428485C Solid-state image sensor and method for fabricating the same
10/22/2008CN100428481C Thin film transistor array base board and its repairing method
10/22/2008CN100428480C Pixel structure and mfg. method thereof
10/22/2008CN100428479C Storage element, semiconductor element and method of manufacture the same
10/22/2008CN100428478C Semiconductor element and forming method thereof
10/22/2008CN100428477C Semiconductor device and semiconductor device manufacturing method
10/22/2008CN100428475C Semiconductor structure having improved carrier mobility and method of manufacture.
10/22/2008CN100428474C Semiconductor device
10/22/2008CN100428473C Semiconductor structure of high voltage side drive and its manufacturing method
10/22/2008CN100428471C Hybrid semiconductor structure and its manufacture method
10/22/2008CN100428470C Capacitor with metal-insulation-metal structure, semiconductor device and manufacturing method
10/22/2008CN100428469C Method and structure for detection of residual liner materials after polishing in damascene process
10/22/2008CN100428466C Organic electroluminescence display and method for manufacturing the same
10/22/2008CN100428465C Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument
10/22/2008CN100428462C Semiconductor integrated circuit device
10/22/2008CN100428461C Semiconductor device and method for manufacturing the same
10/22/2008CN100428457C Light-emitting diodes surface-adhered foundation support and its production
10/22/2008CN100428456C Semiconductor device and manufacturing method of the same
10/22/2008CN100428455C Semiconductor device and manufacturing method of the same
10/22/2008CN100428454C Tape lower chip packaging structure and its producing method
10/22/2008CN100428449C Semiconductor device and method for mfg. same
10/22/2008CN100428448C Circuit apparatus and method of manufacturing the same
10/22/2008CN100428446C Semiconductor devices, semiconductor nano-wire devices and methods of fabrication the same
10/22/2008CN100428445C Method for manufacturing semiconductor storage device
10/22/2008CN100428444C Memory cell arrangement with a folded bit line arrangement and relevant manufacturing method
10/22/2008CN100428443C Method for reducing wafer charge injury
10/22/2008CN100428442C Method for producing semiconductor device with increased effective groove length
10/22/2008CN100428441C Double Damascus structure realizing method for avoiding use of intermediate etched barrier
10/22/2008CN100428440C Use of voids between elements in semiconductor structures for isolation
10/22/2008CN100428439C Substrate processing apparatus and substrate transfer method
10/22/2008CN100428438C Pod swapping internal to tool run time
10/22/2008CN100428437C Feeding device
10/22/2008CN100428436C A test method to determine Schottky barrier height by measuring admittance
10/22/2008CN100428435C Method for detecting position displacement of cutting blades
10/22/2008CN100428434C IC chip mounting method
10/22/2008CN100428433C Structure of electric connection pad
10/22/2008CN100428432C Substrate for bonding element and method of manufacturing the same
10/22/2008CN100428431C Combining method and its device for radiating fin and heat pipe
10/22/2008CN100428430C Copper depression technology applied to selective top and chemical cladding material
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