Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/29/2008CN100429744C Semiconductor device and manufacturing method of the same
10/29/2008CN100429743C Method of making a semiconductor device
10/29/2008CN100429742C Method for replacing cleaning agent in semiconductor manufacture process
10/29/2008CN100429741C Production line management system and method
10/29/2008CN100429740C ICP coil capable of adjusting local coupling strength
10/29/2008CN100429739C Plasma processing apparatus and plasma processing method
10/29/2008CN100429725C Programming method of a non-volatile memory device having a charge storage layer
10/29/2008CN100429723C Semiconductor memory
10/29/2008CN100429721C Magnetic DASD based on vertical current writing and its control method
10/29/2008CN100429670C Fingerprint identification system and method thereof
10/29/2008CN100429579C Manufacturing method for photoetching device and component, substrate fixer
10/29/2008CN100429569C Semi permeable type liquid crystal display, and producing method
10/29/2008CN100429567C Manufacturing device and method for liquid-crystal display, method using the same device and product thereby
10/29/2008CN100429563C Film forming method,distributing pattern forming method,semiconductor device mfg method
10/29/2008CN100429508C Phosphorus-doped amorphous diamond film electrode and preparation method of the same
10/29/2008CN100429299C Cleaning liquid composition after chemical and mechanical grinding
10/29/2008CN100429248C Manufacturing method of acrylic copolymer resin for layer insulation film for TFT-LCD
10/29/2008CN100429133C Wafer carrier door and latching mechanism with hourglass shaped key slot
10/29/2008CN100429047C Superfine grinding wheel for hard and crisp crystal substrate
10/28/2008US7444614 Computer-readable recording medium storing semiconductor designing program for improving both integration and connection of via-contact and metal
10/28/2008US7444607 Method for correcting timing error when designing semiconductor integrated circuit
10/28/2008US7444569 Semiconductor integrated circuit having test circuitry with reduced power consumption
10/28/2008US7444253 Air bridge structures and methods of making and using air bridge structures
10/28/2008US7444196 Optimized characterization of wafers structures for optical metrology
10/28/2008US7444055 Integrated optics arrangement for wavelength (De)multiplexing in a multi-grade vertical stack
10/28/2008US7443725 Floating gate isolation and method of making the same
10/28/2008US7443715 SRAM cells with repressed floating gate memory, low tunnel barrier interpoly insulators
10/28/2008US7443707 Magnetic random access memory array with free layer locking mechanism and method of its use
10/28/2008US7443649 Ferroelectric capacitor
10/28/2008US7443511 Integrated plane mirror and differential plane mirror interferometer system
10/28/2008US7443498 Method and apparatus for inspecting a mura defect, and method of manufacturing a photomask
10/28/2008US7443496 Apparatus and method for testing defects
10/28/2008US7443478 Contact structure
10/28/2008US7443457 Liquid crystal display device having polycrystalline silicon thin film transistor and method of fabricating the same
10/28/2008US7443224 Multi-threshold MIS integrated circuit device and circuit design method thereof
10/28/2008US7443212 Semiconductor integrated circuit controlling output impedance and slew rate
10/28/2008US7443171 Devices and methods for detecting current leakage between deep trench capacitors in DRAM devices
10/28/2008US7443096 Organic electroluminescent device, method of manufacturing the same, and electronic apparatus
10/28/2008US7443043 Circuit device and method of manufacture thereof
10/28/2008US7443041 Packaging of a microchip device
10/28/2008US7443040 Aluminum cap with electroless nickel/immersion gold
10/28/2008US7443039 System for different bond pads in an integrated circuit package
10/28/2008US7443038 Flip-chip image sensor packages
10/28/2008US7443035 Method of forming a penetration electrode and substrate having a penetration electrode
10/28/2008US7443034 Post passivation interconnection schemes on top of the IC chips
10/28/2008US7443033 Post passivation interconnection schemes on top of the IC chips
10/28/2008US7443032 Memory device with chemical vapor deposition of titanium for titanium silicide contacts
10/28/2008US7443031 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
10/28/2008US7443029 Adhesion of copper and etch stop layer for copper alloy
10/28/2008US7443027 Electronic device having coalesced metal nanoparticles
10/28/2008US7443023 High capacity thin module system
10/28/2008US7443022 Board-on-chip packages
10/28/2008US7443019 Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same
10/28/2008US7443015 Integrated circuit package system with downset lead
10/28/2008US7443012 Semiconductor device
10/28/2008US7443010 Matrix form semiconductor package substrate having an electrode of serpentine shape
10/28/2008US7443007 Trench isolation structure having an implanted buffer layer
10/28/2008US7443005 Lens structures suitable for use in image sensors and method for making the same
10/28/2008US7443001 Preparation of microelectromechanical system device using an anti-stiction material and selective plasma sputtering
10/28/2008US7442991 Display including casing and display unit
10/28/2008US7442989 Nonvolatile semiconductor memory device and method of manufacturing thereof
10/28/2008US7442986 Nonvolatile semiconductor memory device with tapered sidewall gate and method of manufacturing the same
10/28/2008US7442985 Semiconductor memory device having memory cell section and peripheral circuit section and method of manufacturing the same
10/28/2008US7442984 Semiconductor memory device and manufacturing method thereof
10/28/2008US7442979 Reduced cell-to-cell shorting for memory arrays
10/28/2008US7442978 Semiconductor memory device including multi-layer gate structure
10/28/2008US7442977 Gated field effect devices
10/28/2008US7442975 CMOS image sensor and method for fabricating the same
10/28/2008US7442969 Top layers of metal for high performance IC's
10/28/2008US7442968 Chip on film (COF) package having test pad for testing electrical function of chip and method for manufacturing same
10/28/2008US7442967 Strained channel complementary field-effect transistors
10/28/2008US7442963 Light emitting apparatus and method for manufacturing the same
10/28/2008US7442960 TFT, method of manufacturing the TFT, flat panel display having the TFT, and method of manufacturing the flat panel display
10/28/2008US7442959 Semiconductor device having identification number, manufacturing method thereof and electronic device
10/28/2008US7442958 Thin film semiconductor device
10/28/2008US7442957 Semiconductor device and manufacturing method thereof
10/28/2008US7442932 High temperature imaging device
10/28/2008US7442908 Method for optically detecting deviations of an image plane of an imaging system from the surface of a substrate
10/28/2008US7442900 Chamber for uniform heating of large area substrates
10/28/2008US7442756 Polymer for sealing porous materials during chip production
10/28/2008US7442675 Mixture of quaternary ammonium hydroxide, water soluble solvent, water, corrosion resistant compound and potassium hydroxide; removal photoresist films, metal residues
10/28/2008US7442657 Producing stress-relaxed crystalline layer on a substrate
10/28/2008US7442656 Method and apparatus for forming silicon oxide film
10/28/2008US7442655 Selective oxidation methods and transistor fabrication methods
10/28/2008US7442654 Method of forming an oxide layer on a compound semiconductor structure
10/28/2008US7442653 Inter-metal dielectric of semiconductor device and manufacturing method thereof including plasma treating a plasma enhanced fluorosilicate glass
10/28/2008US7442652 Method for removing contamination and method for fabricating semiconductor device
10/28/2008US7442650 Methods of manufacturing semiconductor structures using RIE process
10/28/2008US7442649 Etch with photoresist mask
10/28/2008US7442648 Method for fabricating semiconductor device using tungsten as sacrificial hard mask
10/28/2008US7442647 Structure and method for formation of cladded interconnects for MRAMs
10/28/2008US7442646 Slurry, chemical mechanical polishing method using the slurry, and method of forming metal wiring using the slurry
10/28/2008US7442645 Method of polishing a silicon-containing dielectric
10/28/2008US7442644 Method for manufacturing nitride semiconductor wafer or nitride semiconductor device; nitride semiconductor wafer or nitride semiconductor device made by the same; and laser irradiating apparatus used for the same
10/28/2008US7442643 Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials
10/28/2008US7442642 Method of forming electrode for semiconductor device
10/28/2008US7442641 Integrated ball and via package and formation process
10/28/2008US7442640 Semiconductor device manufacturing methods
10/28/2008US7442639 Method of forming plug of semiconductor device
10/28/2008US7442638 Method for forming a tungsten interconnect structure with enhanced sidewall coverage of the barrier layer
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