Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/28/2008US7442637 Method for processing IC designs for different metal BEOL processes
10/28/2008US7442636 Method of inhibiting copper corrosion during supercritical CO2 cleaning
10/28/2008US7442635 Method for producing a semiconductor device and resulting device
10/28/2008US7442634 Method for constructing contact formations
10/28/2008US7442633 Decoupling capacitor for high frequency noise immunity
10/28/2008US7442632 Semiconductor device n-channel type MOS transistor with gate electrode layer featuring small average polycrystalline silicon grain size
10/28/2008US7442631 Doping method and method of manufacturing field effect transistor
10/28/2008US7442630 Method for fabricating forward and reverse blocking devices
10/28/2008US7442629 Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
10/28/2008US7442628 Semiconductor laser manufacturing method
10/28/2008US7442627 Transparent conductive layer forming method, transparent conductive layer formed by the method, and material comprising the layer
10/28/2008US7442626 Rectangular contact used as a low voltage fuse element
10/28/2008US7442625 Apparatus for annealing, method for annealing, and method for manufacturing a semiconductor device
10/28/2008US7442624 Deep alignment marks on edge chips for subsequent alignment of opaque layers
10/28/2008US7442623 Method for manufacturing bonded substrate and bonded substrate manufactured by the method
10/28/2008US7442622 Silicon direct bonding method
10/28/2008US7442621 Semiconductor process for forming stress absorbent shallow trench isolation structures
10/28/2008US7442620 Methods for forming a trench isolation structure with rounded corners in a silicon substrate
10/28/2008US7442619 Method of forming substantially L-shaped silicide contact for a semiconductor device
10/28/2008US7442618 Method to engineer etch profiles in Si substrate for advanced semiconductor devices
10/28/2008US7442617 Method for manufacturing bipolar transistor
10/28/2008US7442616 Method of manufacturing a bipolar transistor and bipolar transistor thereof
10/28/2008US7442615 Semiconductor processing system and method
10/28/2008US7442614 Silicon on insulator devices having body-tied-to-source and methods of making
10/28/2008US7442613 Methods of forming an asymmetric field effect transistor
10/28/2008US7442612 Nitride-encapsulated FET (NNCFET)
10/28/2008US7442611 Method of applying stresses to PFET and NFET transistor channels for improved performance
10/28/2008US7442610 Low thermal budget fabrication method for a mask read only memory device
10/28/2008US7442609 Method of manufacturing a transistor and a method of forming a memory device with isolation trenches
10/28/2008US7442608 Methods of fabricating a semiconductor device using angled implantation
10/28/2008US7442607 Method of manufacturing transistor having recessed channel
10/28/2008US7442606 Method of manufacturing a semiconductor device
10/28/2008US7442605 Resistively switching memory
10/28/2008US7442604 Methods and batch type atomic layer deposition apparatus for forming dielectric films and methods of manufacturing metal-insulator-metal capacitors including the dielectric films
10/28/2008US7442602 Methods of fabricating phase change memory cells having a cell diode and a bottom electrode self-aligned with each other
10/28/2008US7442601 Stress enhanced CMOS circuits and methods for their fabrication
10/28/2008US7442600 Methods of forming threshold voltage implant regions
10/28/2008US7442599 Silicon/germanium superlattice thermal sensor
10/28/2008US7442598 Method of forming an interlayer dielectric
10/28/2008US7442597 Systems and methods that selectively modify liner induced stress
10/28/2008US7442596 Methods of manufacturing fin type field effect transistors
10/28/2008US7442595 Bipolar transistor with collector having an epitaxial Si:C region
10/28/2008US7442594 Method for manufacturing a flat panel display with improved white balance
10/28/2008US7442593 Method of manufacturing semiconductor device having conductive thin films
10/28/2008US7442592 Manufacturing a semiconductor device
10/28/2008US7442591 Method of making a multi-gate device
10/28/2008US7442590 Method for forming a semiconductor device having a fin and structure thereof
10/28/2008US7442589 System and method for uniform multi-plane silicon oxide layer formation for optical applications
10/28/2008US7442588 Method for fabricating thin film transistor using local oxidation and transparent thin film transistor
10/28/2008US7442587 Processes for forming backplanes for electro-optic displays
10/28/2008US7442586 SOI substrate and SOI device, and method for forming the same
10/28/2008US7442585 MOSFET with laterally graded channel region and method for manufacturing same
10/28/2008US7442584 Isolated vertical power device structure with both N-doped and P-doped trenches
10/28/2008US7442583 Using electrically programmable fuses to hide architecture, prevent reverse engineering, and make a device inoperable
10/28/2008US7442582 Method for producing a chip-substrate connection
10/28/2008US7442581 Flexible carrier and release method for high volume electronic package fabrication
10/28/2008US7442580 Manufacturing method of a package structure
10/28/2008US7442579 Methods to achieve precision alignment for wafer scale packages
10/28/2008US7442578 Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices
10/28/2008US7442577 Method of fabricating a patterned device using sacrificial spacer layer
10/28/2008US7442576 Placement of absorbing material in a semiconductor device
10/28/2008US7442575 Method of manufacturing semiconductor nanowires
10/28/2008US7442573 Scaffold-organized clusters and electronic devices made using such clusters
10/28/2008US7442572 CMOS image sensor and method for manufacturing the same
10/28/2008US7442571 Semiconductor probe with resistive tip and method of fabricating the same, and information recording apparatus, information reproducing apparatus, and information measuring apparatus having the semiconductor probe
10/28/2008US7442570 Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
10/28/2008US7442569 Vertical GaN-based LED and method of manufacturing the same
10/28/2008US7442568 Method to fabricate combined UV light emitter and phosphor for white light generation
10/28/2008US7442567 Method for fabricating transflective liquid crystal display
10/28/2008US7442566 Liquid crystal display device and manufacturing method for the same
10/28/2008US7442565 Method for manufacturing vertical structure light emitting diode
10/28/2008US7442564 Dispensed electrical interconnections
10/28/2008US7442563 Method for manufacturing and semiconductor light emitting device
10/28/2008US7442562 Method for manufacturing optical module
10/28/2008US7442561 Method of piping defect detection
10/28/2008US7442559 Method for producing an optical or electronic module provided with a plastic package
10/28/2008US7442473 Method for forming mask pattern of semiconductor device
10/28/2008US7442415 very uniform deposition of dense metal oxide films at low temperatures; efficiently removing excess ligands before the ligand buildup is so great that the ligands cannot all be removed by a post deposition anneal
10/28/2008US7442324 Etching reagent, and method for manufacturing electronic device substrate and electronic device
10/28/2008US7442275 Lateral temperature equalizing system for large area surfaces during processing
10/28/2008US7442274 Plasma etching method and apparatus therefor
10/28/2008US7442273 Apparatus using hybrid coupled plasma
10/28/2008US7442272 Apparatus for manufacturing semiconductor device
10/28/2008US7442271 Miniature microwave plasma torch application and method of use thereof
10/28/2008US7442257 Substrate processing apparatus and substrate processing method
10/28/2008US7442254 Nitride semiconductor device having a nitride semiconductor substrate and an indium containing active layer
10/28/2008US7442253 Process for forming low defect density, ideal oxygen precipitating silicon
10/28/2008US7442252 Method for producing single crystal of multi-element oxide single crystal containing bismuth as constituting element
10/28/2008US7442116 Chemical mechanical polishing pad
10/28/2008US7442112 Nozzle for spraying sublimable solid particles entrained in gas for cleaning surface
10/28/2008US7442111 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
10/28/2008US7442038 Heat treatment jig for semiconductor silicon substrate
10/28/2008US7442028 Molding apparatus and molding method
10/28/2008US7442000 Method and device for extracting electronic components from tubes and electronic component feeding device
10/28/2008US7441999 Overhead travelling carriage system
10/28/2008US7441711 Semiconductor device and IC card
10/28/2008US7441500 Method for forming printing roll patterns
10/28/2008US7441329 Fabrication process circuit board with embedded passive component
10/28/2008US7441299 Apparatuses and methods for cleaning a substrate
10/23/2008WO2008128181A1 Method for deposition of (al,in,ga,b)n
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