Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/30/2008US20080268607 Method of Fabricating Semiconductor Device
10/30/2008US20080268606 Semiconductor device manufacturing method and semiconductor device
10/30/2008US20080268605 Dielectric layers over electrodes; atomic layer deposition; nitriding; topography; mechanical properties; dimensional stability
10/30/2008US20080268604 METHODS OF BASE FORMATION IN A BiCMOS PROCESS
10/30/2008US20080268603 Transistor performance using a two-step damage anneal
10/30/2008US20080268602 Method of fabricating semiconductor device
10/30/2008US20080268601 Semiconductor device and method of manufacturing the same
10/30/2008US20080268600 Mosfet structure with multiple self-aligned silicide contacts
10/30/2008US20080268599 Structure and method for a triple-gate transistor with reverse sti
10/30/2008US20080268598 Semiconductor device having silicide layers and method of fabricating the same
10/30/2008US20080268597 Technique for enhancing dopant activation by using multiple sequential advanced laser/flash anneal processes
10/30/2008US20080268596 Methods Of Fabricating Non-Volatile Memory With Integrated Select And Peripheral Circuitry And Post-Isolation Memory Cell Formation
10/30/2008US20080268595 NAND flash memory devices and methods of fabricating the same
10/30/2008US20080268594 Method of fabricating a flash memory device
10/30/2008US20080268593 Methods for fabricating a capacitor
10/30/2008US20080268592 Flash memory device and method of fabricating the same
10/30/2008US20080268591 Methods of Forming Capacitors
10/30/2008US20080268590 Method for forming a semiconductor device with a single-sided buried strap
10/30/2008US20080268589 Shallow trench divot control post
10/30/2008US20080268588 RECESSED GATE CHANNEL WITH LOW Vt CORNER
10/30/2008US20080268587 Inverse slope isolation and dual surface orientation integration
10/30/2008US20080268586 Switching device for a pixel electrode and methods for fabricating the same
10/30/2008US20080268585 Soi device having a substrate diode with process tolerant configuration and method of forming the soi device
10/30/2008US20080268584 Electronic devices and methods for forming the same
10/30/2008US20080268583 Method of manufacturing SOI substrate and method of manufacturing semiconductor device
10/30/2008US20080268581 Method of manufacturing thin film transistor substrate
10/30/2008US20080268580 Method for low-temperature sealing of a cavity under vacuum or under controlled atmosphere
10/30/2008US20080268579 Semiconductor chip package and method of fabricating the same
10/30/2008US20080268578 Manufacturing method of a semiconductor device
10/30/2008US20080268577 Semiconductor device and method of manufacturing the same
10/30/2008US20080268576 Method of manufacturing a semiconductor device
10/30/2008US20080268575 Orientation-dependent etching of deposited AIN for structural use and sacrificial layers in MEMS
10/30/2008US20080268574 Hermetic seal and reliable bonding structures for 3d applications
10/30/2008US20080268573 Method and system for bonding 3D semiconductor devices
10/30/2008US20080268572 Chip package
10/30/2008US20080268571 Apparatus for heating chip, flip chip bonder having the apparatus, and method for bonding flip chip using the same
10/30/2008US20080268570 Fabricating process of a chip package structure
10/30/2008US20080268569 Phase-change memory device and method of manufacturing the same
10/30/2008US20080268564 industrial scale production of semiconductor silicon film on photovoltaic devices for solar cells, by plasma enhanced chemical vapor deposition; generating a self-bias voltage value at an electrode; uniform thickenss; stable, high productivity, with a high photoelectric conversion efficiency
10/30/2008US20080268562 Compound semiconductor light-emitting device and production method thereof
10/30/2008US20080268560 Method for Producing a Thin-Film Semiconductor Chip
10/30/2008US20080268558 Semiconductor Light Emitting Element and Method for Manufacturing the Same
10/30/2008US20080268557 Method for measuring a thin film thickness
10/30/2008US20080268556 Plate With An Indicator For Discerning Among Pre-Identified Probe Holes In The Plate
10/30/2008US20080268555 Semiconductor device and adjusting method for semiconductor device
10/30/2008US20080268554 lithography step of connecting a plurality of mask patterns to each other to form a pattern image of an area greater than the size of the mask patterns
10/30/2008US20080268553 Electroless plating apparatus with non-liquid heating source
10/30/2008US20080268510 Method for producing l-beta-lysine
10/30/2008US20080268383 Semiconductor wafer production; improving throughput utilizing two processing blocks; easily created substrate carrying computer program
10/30/2008US20080268369 Organic Film Composition and Method for Forming Resist Pattern
10/30/2008US20080268353 Stencil mask having main and auxiliary strut and method of forming the same
10/30/2008US20080268352 Obtaining a flatness of a surfaces of a substrate when a mask pattern is formed; forming a conductive film on the another surface of the substrate; removing the conductive film selectively to form openings in the conductive film based on the flatness
10/30/2008US20080268264 Curing a coating of a siloxane compound and a carbosilane compound using ultraviolet radiation; a low relative dielectric constant, excellent chemical resistance, plasma resistance, mechanical strength
10/30/2008US20080268263 SOI substrate and manufacturing method of the same, and semiconductor device
10/30/2008US20080268248 Nanocrystal, method for preparing the same and electronic device comprising the same
10/30/2008US20080268211 Line end shortening reduction during etch
10/30/2008US20080268176 Method of improving the uniformity of PECVD-deposited thin films
10/30/2008US20080268151 Organometallic compounds and their use as precursors for forming films and powders of metal or metal derivatives
10/30/2008US20080267815 Projects pattern of exposing mask onto substrate with light through an optical element ; using cleaning light to clean contamination such as carbon attached to optical elements installed in projection optical system
10/30/2008US20080267747 Inertial wafer centering end effector and transport apparatus
10/30/2008US20080267745 Positioning Device and Method for Transferring Electronic Components
10/30/2008US20080267743 Apparatus for imprinting and/or embossing substrates
10/30/2008US20080267742 Direct Tool Loading
10/30/2008US20080267741 Substrate attracting device and substrate transfer apparatus
10/30/2008US20080267598 Heat Treating Apparatus
10/30/2008US20080267239 High-Index-Contrast Waveguide
10/30/2008US20080267236 Laser diode with a grating layer
10/30/2008US20080266965 Nonvolatile semiconductor memory having plural data storage portions for a bit line connected to memory cells
10/30/2008US20080266960 Non-volatile memory and manufacturing method and operating method thereof and circuit system including the non-volatile memory
10/30/2008US20080266949 Integrated circuits with substrate protrusions, including (but not limited to) floating gate memories
10/30/2008US20080266940 Air Cell Thermal Isolation for a Memory Array Formed of a Programmable Resistive Material
10/30/2008US20080266938 Magnetoresistive device and method of packaging same
10/30/2008US20080266933 Method and Apparatus for Refreshing Programmable Resistive Memory
10/30/2008US20080266930 Piezoelectrically actuated ultrananocrystalline diamond tip array integrated with ferroelectric or phase change media for high-density memory
10/30/2008US20080266927 Semiconductor integrated circuit device and method of fabricating the semiconductor integrated circuit device
10/30/2008US20080266922 Integrated Circuits and Power Supplies
10/30/2008US20080266821 Housing for an Electronic Circuit and Method for Sealing the Housing
10/30/2008US20080266787 On-Chip Interconnect-Stack Cooling Using Sacrificial Interconnect Segments
10/30/2008US20080266745 Electrostatic chuck with heater
10/30/2008US20080266731 Level conversion circuit and semiconductor integrated circuit device employing the level conversion circuit
10/30/2008US20080266538 Lithographic processing cell, lithographic apparatus, track and device manufacturing method
10/30/2008US20080266533 Exposure Apparatus, Exposure Method, and Method for Producing Device
10/30/2008US20080266508 Liquid Crystal Display and Method for Manufacturing The Same
10/30/2008US20080266480 Multi-domain vertical alignment liquid crystal display
10/30/2008US20080266479 Liquid crystal display panel and method for manufacturing the same
10/30/2008US20080266360 Ink-jet head and manufacturing method thereof
10/30/2008US20080266008 Electromechanical resonator and manufacturing method thereof
10/30/2008US20080265938 Architecture and interconnect scheme for programmable logic circuits
10/30/2008US20080265936 Integrated circuit switching device, structure and method of manufacture
10/30/2008US20080265930 Semiconductor device including analog voltage output driver LSI chip having test circuit
10/30/2008US20080265929 Process Monitor for Monitoring and Compensating Circuit Performance
10/30/2008US20080265462 Panel/wafer molding apparatus and method of the same
10/30/2008US20080265445 Marks for the Alignment of Wafer-Level Underfilled Silicon Chips and Method to Produce Same
10/30/2008US20080265444 Thin-film aluminum nitride encapsulant for metallic structures on integrated circuits and method of forming same
10/30/2008US20080265443 Semiconductor device and method of manufacturing the same
10/30/2008US20080265442 Semiconductor device, electronic device, and method of producing semiconductor device
10/30/2008US20080265441 Semiconductor device and method of manufacturing the same
10/30/2008US20080265440 Semiconductor Device with a Semiconductor Chip and Electrical Connecting Elements to a Conductor Structure
10/30/2008US20080265437 Package Equipped with Semiconductor Chip and Method for Producing Same
10/30/2008US20080265436 Semiconductor for Device and Its Manufacturing Method
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