Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/23/2008US20080261039 Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device
10/23/2008US20080260982 Sheet to Form a Protective Shield for Chips
10/23/2008US20080260503 Transfer apparatus
10/23/2008US20080260502 Substrate processing apparatus and semiconductor device manufacturing method
10/23/2008US20080260501 Fabrication method for semiconductor device and manufacturing apparatus for the same
10/23/2008US20080260500 Batch substrate handling
10/23/2008US20080260499 Facet adapter for a wafer handler
10/23/2008US20080260498 Atmosphere Purge-Port Connecting Device for Wafer Storage Container
10/23/2008US20080260370 Optical System
10/23/2008US20080259982 Semiconductor laser diode formed with window at cleavage facet and fabricating method thereof
10/23/2008US20080259677 Memory including bipolar junction transistor select devices
10/23/2008US20080259673 Space and process efficient mram and method
10/23/2008US20080259583 Chip Module and Method for Producing a Chip Module
10/23/2008US20080259576 Electronic Device or Circuit and Method for Fabricating the Same
10/23/2008US20080259357 Optical metrology of single features
10/23/2008US20080259323 Reticle defect inspection apparatus and reticle defect inspection method
10/23/2008US20080258748 Method for fabricating a probing pad of an integrated circuit chip
10/23/2008US20080258745 Probe Guard
10/23/2008US20080258721 MTJ sensor including domain stable free layer
10/23/2008US20080258690 Thermal switching element and method for manufacturing the same
10/23/2008US20080258315 Semiconductor device and production method of the same semiconductor device
10/23/2008US20080258314 Fabric type semiconductor device package and methods of installing and manufacturing same
10/23/2008US20080258313 Connecting microsized devices using ablative films
10/23/2008US20080258311 Semiconductor device and method of manufacturing the same
10/23/2008US20080258310 Semiconductor device having a tapered plug
10/23/2008US20080258308 Method of controlled low-k via etch for Cu interconnections
10/23/2008US20080258306 Semiconductor Device and Method for Fabricating the Same
10/23/2008US20080258305 Low fabrication cost, fine pitch and high reliability solder bump
10/23/2008US20080258303 Novel structure for reducing low-k dielectric damage and improving copper EM performance
10/23/2008US20080258302 Methods of forming a denuded zone in a semiconductor wafer using rapid laser annealing
10/23/2008US20080258301 Semiconductor device and manufacturing method of the same
10/23/2008US20080258300 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
10/23/2008US20080258299 Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device
10/23/2008US20080258298 Semiconductor devices and methods of fabricating the same
10/23/2008US20080258297 Method of making solder pad
10/23/2008US20080258296 Cut-Out Heat Slug for Integrated Circuit Device Packaging
10/23/2008US20080258294 Heat-dissipating semiconductor package structure and method for manufacturing the same
10/23/2008US20080258293 Semiconductor device package to improve functions of heat sink and ground shield
10/23/2008US20080258291 Semiconductor Packaging With Internal Wiring Bus
10/23/2008US20080258290 Semiconductor device and method for manufacturing the same
10/23/2008US20080258288 Semiconductor device stack package, electronic apparatus including the same, and method of manufacturing the same
10/23/2008US20080258287 Semiconductor device and method of manufacturing the same
10/23/2008US20080258286 High Input/Output, Low Profile Package-On-Package Semiconductor System
10/23/2008US20080258284 Ultra-thin chip packaging
10/23/2008US20080258283 Wiring board and semiconductor package using the same
10/23/2008US20080258282 Lead frame free package and method of making
10/23/2008US20080258281 Process for Producing and Apparatus for Improving the Bonding Between a Plastic and a Metal
10/23/2008US20080258280 Lead frame, semiconductor device using the lead frame, and methods of manufacturing the same
10/23/2008US20080258279 Leadframe for leadless package, structure and manufacturing method using the same
10/23/2008US20080258278 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
10/23/2008US20080258277 Semiconductor Device Comprising a Semiconductor Chip Stack and Method for Producing the Same
10/23/2008US20080258276 Non-Leaded Semiconductor Package and a Method to Assemble the Same
10/23/2008US20080258275 Controlling warping in integrated circuit devices
10/23/2008US20080258274 Semiconductor Package and Method
10/23/2008US20080258273 Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the Same
10/23/2008US20080258272 Etched leadframe structure
10/23/2008US20080258271 Multi-dielectric films for semiconductor devices and methods of fabricating multi-dielectric films
10/23/2008US20080258270 Mgo-Based Coating for Electrically Insulating Semiconductive Substrates and Production Method Thereof
10/23/2008US20080258269 Semiconductor wafer and method for cutting the same
10/23/2008US20080258268 Trench structure and method of forming the trench structure
10/23/2008US20080258267 Method of Producing Semiconductor Device and Semiconductor Device
10/23/2008US20080258266 Semiconductor device and manufacturing method thereof
10/23/2008US20080258265 Methods for forming an assembly for transfer of a useful layer
10/23/2008US20080258264 Semiconductor device and method for manufacturing the same
10/23/2008US20080258263 High Current Steering ESD Protection Zener Diode And Method
10/23/2008US20080258262 Semiconductor device with improved pads
10/23/2008US20080258260 Semiconductor device and method for manufacturing the same
10/23/2008US20080258256 Semiconductor electrically programmable fuse element with amorphous silicon layer after programming and method of programming the same
10/23/2008US20080258254 Process for realizing an integrated electronic circuit with two active layer portions having different crystal orientations
10/23/2008US20080258248 Image Sensor and Method for Manufacturing the Same
10/23/2008US20080258247 Spin-transfer mram structure and methods
10/23/2008US20080258245 Semiconductor Constructions and Transistor Gates
10/23/2008US20080258242 Low contact resistance ohmic contact for a high electron mobility transistor and fabrication method thereof
10/23/2008US20080258241 Integrated circuits and interconnect structure for integrated circuits
10/23/2008US20080258240 Integrated circuits and interconnect structure for integrated circuits
10/23/2008US20080258239 Methods for manufacturing a trench type semiconductor device having a thermally sensitive refill material
10/23/2008US20080258238 Semiconductor Device Manufactured Using an Oxygenated Passivation Process During High Density Plasma Deposition
10/23/2008US20080258237 Semiconductor device having multi-channel and method of fabricating the same
10/23/2008US20080258236 Method of manufacturing a semiconductor device
10/23/2008US20080258234 Semiconductor structure for low parasitic gate capacitance
10/23/2008US20080258232 Semiconductor device and method for producing the same
10/23/2008US20080258229 Semiconductor device and method for fabricating the same
10/23/2008US20080258228 Contact Scheme for MOSFETs
10/23/2008US20080258226 Methods for manufacturing a trench type semiconductor device having a thermally sensitive refill material
10/23/2008US20080258225 Mos transistors having high-k offset spacers that reduce external resistance and methods for fabricating the same
10/23/2008US20080258224 Trenched MOSFETs with improved gate-drain (GD) clamp diodes
10/23/2008US20080258220 Ion implantation combined with in situ or ex situ heat treatment for improved field effect transistors
10/23/2008US20080258219 Method to selectively modulate gate work function through selective Ge condensation and high-K dielectric layer
10/23/2008US20080258216 Semiconductor device and method for manufacturing the same
10/23/2008US20080258214 Semiconductor Device and Method of Fabricating the Same
10/23/2008US20080258213 Shielded Gate Field Effect Transistor
10/23/2008US20080258212 Trench metal oxide semiconductor with recessed trench material and remote contacts
10/23/2008US20080258211 Semiconductor device and method for manufacturing the same
10/23/2008US20080258210 Semiconductor component and method of manufacture
10/23/2008US20080258209 Semiconductor device and manufaturing method thereof
10/23/2008US20080258208 Semiconductor component including compensation zones and discharge structures for the compensation zones
10/23/2008US20080258206 Self-Aligned Gate Structure, Memory Cell Array, and Methods of Making the Same
10/23/2008US20080258203 Stacked sonos memory
10/23/2008US20080258201 Semiconductor memory device and method of manufacturing the same
10/23/2008US20080258199 Flash memory device and fabricating method thereof
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