Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/16/2008US20080254594 Strained silicon cmos on hybrid crystal orientations
10/16/2008US20080254593 Method for Fabricating Isolation Layer in Semiconductor Device
10/16/2008US20080254592 Method of forming isolation structure for semiconductor integrated circuit substrate
10/16/2008US20080254591 Method for Making a Thin-Film Element
10/16/2008US20080254590 Fabrication process for silicon-on-insulator field effect transistors using high temperature nitrogen annealing
10/16/2008US20080254589 Method for manufacturing collars of deep trench capacitors
10/16/2008US20080254588 Methods for forming transistors with high-k dielectric layers and transistors formed therefrom
10/16/2008US20080254587 Method for manufacturing semiconductor devices using self-aligned process to increase device packing density
10/16/2008US20080254586 Soi semiconductor device with body contact and method thereof
10/16/2008US20080254585 Method for fabricating semiconductor memory
10/16/2008US20080254584 Method of manufacturing flash memory device
10/16/2008US20080254583 Method of fabricating semiconductor device
10/16/2008US20080254582 Semiconductor integrated circuit device having single-element type non-volatile memory elements
10/16/2008US20080254581 Semiconductor device and method for manufacturing the same
10/16/2008US20080254580 Realization of Self-Positioned Contacts by Epitaxy
10/16/2008US20080254579 Semiconductor device and fabrication thereof
10/16/2008US20080254578 Method for fabricating thin film transistors
10/16/2008US20080254577 Sectional Field Effect Devices and Method of Fabrication
10/16/2008US20080254576 Method of fabricating a self-aligning damascene memory structure
10/16/2008US20080254575 Encapsulation method and apparatus
10/16/2008US20080254574 Semiconductor device and a manufacturing method of the same
10/16/2008US20080254573 Integrated circuit thermal management method and apparatus
10/16/2008US20080254572 Vertical system integration
10/16/2008US20080254571 System in package (SIP) with dual laminate interposers
10/16/2008US20080254570 Angle control of multi-cavity molded components for mems and nems group assembly
10/16/2008US20080254569 Semiconductor Device
10/16/2008US20080254566 Surface-emission semiconductor laser device
10/16/2008US20080254563 Method for manufacturing semiconductor optical device
10/16/2008US20080254562 Method of making a light emitting element
10/16/2008US20080254561 Method of fabricating vertical structure compound semiconductor devices
10/16/2008US20080254560 Display device, method for manufacturing display device, and SOI substrate
10/16/2008US20080254559 Method of Fabricating Liquid Crystal Display Device
10/16/2008US20080254555 Patterning method for light-emitting devices
10/16/2008US20080254553 In Situ, Ex Situ and Inline Process Monitoring, Optimization and Fabrication
10/16/2008US20080254220 Tubal container with openings; dielectric top plate; transmitting electromagnetic waves; discharge prevention member
10/16/2008US20080254216 complex capable of being used for chemical vapor deposition of thin metal , or metal oxide films
10/16/2008US20080254211 Filter window manufacturing method
10/16/2008US20080253869 Insert for carrier board of test handler
10/16/2008US20080253868 Fast swap dual substrate transport for load lock
10/16/2008US20080253867 Apparatus for Placing Battery Plates in a Line
10/16/2008US20080253186 Bit line structure for a multilevel, dual-sided nonvolatile memory cell array
10/16/2008US20080253178 MRAM with enhanced programming margin
10/16/2008US20080253176 Nonvolatile magnetic memory device and photomask
10/16/2008US20080253175 Nonvolatile magnetic memory device and photomask
10/16/2008US20080253167 Integrated Circuit, Method of Operating an Integrated Circuit, Method of Manufacturing an Integrated Circuit, Active Element, Memory Module, and Computing System
10/16/2008US20080253166 Integrated Circuit, Method for Manufacturing an Integrated Circuit, Memory Cell Array, Memory Module, and Device
10/16/2008US20080253160 Integrated circuit having a memory cell array and method of forming an integrated circuit
10/16/2008US20080253103 Manufacturing method of a tray, a socket for inspection, and a semiconductor device
10/16/2008US20080253098 Damage Prevention Interposer for Electronic Package and Electronic Interconnect Structure
10/16/2008US20080253047 Semiconductor Device and Electronic Device
10/16/2008US20080252978 Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
10/16/2008US20080252898 Method for optically testing semiconductor devices
10/16/2008US20080252888 Apparatus for polarization-specific examination, optical imaging system, and calibration method
10/16/2008US20080252869 Exposure apparatus and device fabrication method using the same
10/16/2008US20080252865 Exposure apparatus, method for cleaning member thereof, maintenance method for exposure apparatus, maintenance device, and method for producing device
10/16/2008US20080252864 Immersion exposure technique
10/16/2008US20080252837 Liquid crystal display device and manufacturing method thereof
10/16/2008US20080252834 Thin film transistor, method for fabricating same and liquid crystal display using same
10/16/2008US20080252806 Thin film transistor array panel and manufacturing method thereof
10/16/2008US20080252775 Camera module and method of manufacturing the same
10/16/2008US20080252696 Inkjet Printer Having A Printhead With A Bi-Layer Thermal Actuator Coil
10/16/2008US20080252410 Resistor structure and fabricating method thereof
10/16/2008US20080252407 Multi-Layer Inductive Element for Integrated Circuit
10/16/2008US20080252210 Electrode Patterning
10/16/2008US20080251950 Semiconductor device and processing method of the same
10/16/2008US20080251949 Molding apparatus, molded semiconductor package using multi-layered film, fabricating and molding method for fabricating the same
10/16/2008US20080251947 Cof flexible printed wiring board and semiconductor device
10/16/2008US20080251946 Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
10/16/2008US20080251945 Semiconductor package that has electronic component and its fabrication method
10/16/2008US20080251943 Flip chip with interposer, and methods of making same
10/16/2008US20080251942 Semiconductor Device and Manufacturing Method Thereof
10/16/2008US20080251941 Vertical system integration
10/16/2008US20080251937 Stackable semiconductor device and manufacturing method thereof
10/16/2008US20080251935 Low shrinkage polyester thermosetting resins
10/16/2008US20080251934 Semiconductor Device Structures and Methods of Fabricating Semiconductor Device Structures for Use in SRAM Devices
10/16/2008US20080251931 Multi cap layer and manufacturing method thereof
10/16/2008US20080251928 Carbonization of metal caps
10/16/2008US20080251927 Electromigration-Resistant Flip-Chip Solder Joints
10/16/2008US20080251926 Method of Fabricating Organic Silicon Film, Semiconductor Device Including the Same, and Method of Fabricating the Semiconductor Device
10/16/2008US20080251921 Structure for a Semiconductor Device and a Method of Manufacturing the Same
10/16/2008US20080251920 Dielectric film forming method
10/16/2008US20080251916 UBM structure for strengthening solder bumps
10/16/2008US20080251912 Multi-Chip Module
10/16/2008US20080251910 Fabricating method of semiconductor package and heat-dissipating structure applicable thereto
10/16/2008US20080251908 Semiconductor device package having multi-chips with side-by-side configuration and method of the same
10/16/2008US20080251906 Package-on-package secure module having BGA mesh cap
10/16/2008US20080251904 Curing layers of a semiconductor product using electromagnetic fields
10/16/2008US20080251903 Semiconductor module
10/16/2008US20080251902 Half-etching a processed sheet; attaching the sheet to a semiconductor device supporting tape; connecting the inner terminals to the semiconductor device with bond wires;sealing the processed sheet and the semiconductor device held between a pair of flat molding plates, removing plates
10/16/2008US20080251901 Stacked integrated circuit package system
10/16/2008US20080251898 Semiconductor device
10/16/2008US20080251894 Mounted Body and Method for Manufacturing the Same
10/16/2008US20080251891 Semiconductor having passivated sidewalls
10/16/2008US20080251890 Method of Forming Buffer Layer for Nitride Compound Semiconductor Light Emitting Device and Nitride Compound Semiconductor Light Emitting Device Having the Buffer Layer
10/16/2008US20080251886 Fuse structure, and semiconductor device
10/16/2008US20080251885 Fuse structure, semiconductor device, and method of forming the semiconductor device
10/16/2008US20080251882 Semiconductor device and method of fabricating the same
10/16/2008US20080251880 Mixed orientation and mixed material semiconductor-on-insulator wafer
10/16/2008US20080251879 Method for Manufacturing Simox Substrate and Simox Substrate Obtained by this Method
10/16/2008US20080251877 Methods for fabricating complex micro and nanoscale structures and electronic devices and components made by the same
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