Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/04/2008US7445975 Method for the production of a semiconductor component having a metallic gate electrode disposed in a double-recess structure
11/04/2008US7445974 Laser beam irradiating apparatus, laser beam irradiating method, and method of manufacturing a semiconductor device
11/04/2008US7445973 Transistor surround gate structure with silicon-on-insulator isolation for memory cells, memory arrays, memory devices and systems and methods of forming same
11/04/2008US7445972 Fabrication process of memory cell
11/04/2008US7445971 Thin film transistor and method for manufacturing the same
11/04/2008US7445970 Method for manufacturing thin film transistor
11/04/2008US7445969 Method of manufacturing a semiconductor device
11/04/2008US7445968 Methods for integrated circuit module packaging and integrated circuit module packages
11/04/2008US7445967 Method of packaging a semiconductor die and package thereof
11/04/2008US7445965 Method of manufacturing radiating plate and semiconductor apparatus using the same
11/04/2008US7445964 Semiconductor device and method of manufacturing the same
11/04/2008US7445963 Semiconductor package having an interfacial adhesive layer
11/04/2008US7445962 Stacked integrated circuits package system with dense routability and high thermal conductivity
11/04/2008US7445961 Semiconductor chip package and method for fabricating the same
11/04/2008US7445960 Adhesion by plasma conditioning of semiconductor chip
11/04/2008US7445959 Sensor module and method of manufacturing same
11/04/2008US7445958 Semiconductor device having a leading wiring layer
11/04/2008US7445957 Method for fabricating wafer level semiconductor package with build-up layer
11/04/2008US7445956 Flexible MEMS thin film without manufactured substrate and process for producing the same
11/04/2008US7445955 Multichip module package and fabrication method
11/04/2008US7445954 Method of fabricating substrateless thin film field-effect devices and an organic thin film transistor obtainable by the method
11/04/2008US7445953 Low temperature curable materials for optical applications
11/04/2008US7445952 Method of forming laminate and method of manufacturing photovoltaic device
11/04/2008US7445951 Trench photosensor for a CMOS imager
11/04/2008US7445950 Image sensor and method of fabricating the same
11/04/2008US7445949 Method of manufacturing semiconductor laser device structure
11/04/2008US7445948 Method of making a TFT array with photo-imageable insulating layer over address lines
11/04/2008US7445947 Method of manufacturing solid-state imaging device and solid-state imaging device
11/04/2008US7445946 Method of driving a light emitting device
11/04/2008US7445945 Method and apparatus for dynamic adjustment of a sampling plan based on wafer electrical test data
11/04/2008US7445944 Packaging substrate and manufacturing method thereof
11/04/2008US7445943 Magnetic tunnel junction memory and method with etch-stop layer
11/04/2008US7445942 Process for manufacturing segmented MRAM array with patterned segmented magnetic shields
11/04/2008US7445881 Method of manufacturing semiconductor device, acid etching resistant material and copolymer
11/04/2008US7445875 Mask blank and mask for electron beam exposure
11/04/2008US7445810 Creating a tantalum layer disposed on a first layer region of a first layer and on a second layer region of a second layer; tantalum layer has a substantially body-centered-cubic (bcc)-phase tantalum region on the first layer region, and a non-bcc-phase tantalum region on the second layer region
11/04/2008US7445697 Method and apparatus for fluid processing a workpiece
11/04/2008US7445690 Plasma processing apparatus
11/04/2008US7445689 Substrate processing method and substrate processing system
11/04/2008US7445688 Method and apparatus for picking up work piece and mounting machine
11/04/2008US7445675 Sensor for monitoring material deposition
11/04/2008US7445674 Crystallization apparatus, crystallization method, device, optical modulation element, and display apparatus
11/04/2008US7445543 Polishing apparatus
11/04/2008US7445535 Electron source producing apparatus and method
11/04/2008US7445382 Temperature measurement and heat-treating methods and system
11/04/2008US7445119 Chip receptacle, method for fabricating a chip receptacle and chip transport container
11/04/2008US7444734 Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate
11/04/2008US7444727 Method for forming multi-layer embedded capacitors on a printed circuit board
10/2008
10/30/2008WO2008131402A1 Structure and process to prevent peeling of reaction product in semiconductor device manufacture
10/30/2008WO2008131399A1 Semiconductor device manufactured using an oxygenated passivation process during high density plasma deposition
10/30/2008WO2008131395A2 Solder bump interconnect for improved mechanical and thermo mechanical performance
10/30/2008WO2008131287A1 Semiconductor workpiece carriers and methods for processing semiconductor workpieces
10/30/2008WO2008131280A2 Ablation device
10/30/2008WO2008131234A1 A trench structure and method of forming the trench structure
10/30/2008WO2008130975A1 Erosion resistance enhanced quartz used in plasma etch chamber
10/30/2008WO2008130941A1 Method and apparatus for singulated die testing
10/30/2008WO2008130933A1 A high current steering esd protection zener diode and method
10/30/2008WO2008130899A1 Semiconductor device including sti regions and methods of manufacturing the same
10/30/2008WO2008130847A1 Extensions of self-assembled structures to increased dimensions via a 'bootstrap' self-templating method
10/30/2008WO2008130836A1 Method of forming a device wafer with recyclable support
10/30/2008WO2008130818A1 Separate layer formation in a semiconductor device
10/30/2008WO2008130691A2 A high voltage (>100v) lateral trench power mosfet with low specific-on-resistance
10/30/2008WO2008130598A1 Mos transistors having high-k offset spacers that reduce external resistance and methods for fabricating the same
10/30/2008WO2008130519A1 Method and apparatus for wafer electroless plating
10/30/2008WO2008130518A1 Fluid handling system for wafer electroless plating and associated methods
10/30/2008WO2008130517A1 Wafer electroless plating system and associated methods
10/30/2008WO2008130496A1 Methods of forming a denuded zone in a semiconductor wafer using rapid laser annealing
10/30/2008WO2008130493A2 Connecting microsized devices using ablative films
10/30/2008WO2008130490A1 Methods of fabricating glass-based substrates and apparatus employing same
10/30/2008WO2008130455A1 Methods for manufacturing a trench type semiconductor device having a thermally sensitive refill material
10/30/2008WO2008130448A2 Temperature-controlled purge gate valve for chemical vapor deposition chamber
10/30/2008WO2008130433A2 Methods for providing prophylactic surface treatment for fluid processing systems and components thereof
10/30/2008WO2008130396A2 Doped nanoparticle semiconductor charge transport layer
10/30/2008WO2008130375A2 Liquid films containing nanostructured materials
10/30/2008WO2008130369A1 Apparatus and method for atomic layer deposition
10/30/2008WO2008130343A1 Method and apparatus for imaging a moving object
10/30/2008WO2008130215A1 Apparatus and method for cleaning substrates/media disks
10/30/2008WO2008130205A1 Twin target sputter system for thin film passivation and method of forming film using the same
10/30/2008WO2008130173A1 Suction pad for semiconductor package
10/30/2008WO2008130118A1 Plasma monitoring device and method
10/30/2008WO2008130031A1 Conductive reflecting film and method for manufacturing the same
10/30/2008WO2008129999A1 Flotox-type eeprom and method for manufacturing the same
10/30/2008WO2008129992A1 Semiconductor device and its manufacturing method
10/30/2008WO2008129989A1 Substrate holding mechanism and substrate assembling apparatus provided with the same
10/30/2008WO2008129983A1 Conveyor, and film-forming apparatus and maintenance method thereof
10/30/2008WO2008129982A1 Substrate processing method and system, and device manufacturing method
10/30/2008WO2008129977A1 Film forming apparatus
10/30/2008WO2008129976A1 Method for manufacturing chip with adhesive
10/30/2008WO2008129964A1 Method for pattern formation, and resist composition, developing solution and rinsing liquid for use in the method for pattern formation
10/30/2008WO2008129962A1 Molding device and method for controlling the same
10/30/2008WO2008129944A1 Etching solution
10/30/2008WO2008129932A1 Discharge lamp, cable for connection, light source device, and exposure device
10/30/2008WO2008129931A1 Discharge lamp, cable for connection, light source device, and exposure device
10/30/2008WO2008129914A1 Euv mask blank
10/30/2008WO2008129908A1 Reflective mask blank for euv lithography
10/30/2008WO2008129891A1 Composition for etching and method of etching
10/30/2008WO2008129844A1 Plasma etching apparatus
10/30/2008WO2008129776A1 Exposure apparatus and device manufacturing method
10/30/2008WO2008129762A1 Moving body apparatus, apparatus for forming pattern, method of forming pattern, method of producing device, method of producing moving body apparatus, and method of driving moving body
10/30/2008WO2008129755A1 Semiconductor device inspecting method and semiconductor device inspecting apparatus
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