Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/22/2008EP1983551A1 Semiconductor production system
10/22/2008EP1983499A1 Reflective tft substrate and method for manufacturing reflective tft substrate
10/22/2008EP1983370A1 Pellicle for high numerical aperture exposure device
10/22/2008EP1983362A1 Catadioptric imaging system, exposure device, and device manufacturing method
10/22/2008EP1983080A2 Single crystal diamond prepared by CVD
10/22/2008EP1983071A1 Method for manufacturing pyrolytic boron nitride composite substrate
10/22/2008EP1983070A2 Metal oxide layer formed on substrates and its fabrication methods
10/22/2008EP1982357A2 Mos device and method of fabricating a mos device
10/22/2008EP1982354A2 Electrical microfilament to circuit interface
10/22/2008EP1982352A1 Production of integrated circuits comprising different components
10/22/2008EP1982351A2 Method for improved growth of semipolar (al,in,ga,b)n
10/22/2008EP1982350A1 Pulsed chemical dispense system
10/22/2008EP1981685A1 Double side wafer grinder and methods for assessing workpiece nanotopology
10/22/2008EP1911096A4 Method and structure for forming slot via bitline for mram devices
10/22/2008EP1856728B1 A method of manufacturing semiconductor packages and packages made
10/22/2008EP1754253A4 A method of base formation in a bicmos process
10/22/2008EP1734647B1 Semiconductor device and module using the same
10/22/2008EP1711961A4 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
10/22/2008EP1690290A4 Gan-based permeable base transistor and method of fabrication
10/22/2008EP1636833A4 Plasma spraying for joining silicon parts
10/22/2008EP1449407B1 Induction heating devices and methods for controllably heating an article
10/22/2008EP1419532A4 Folded bit line dram with vertical ultra thin body transistors
10/22/2008EP1410436B1 Parallel, individually addressable probes for nanolithography
10/22/2008EP1362424B1 Three terminal noninverting transistor switch
10/22/2008EP1230665B1 Plasma processing system with dynamic gas distribution control
10/22/2008EP1060510B1 Method of forming dual field isolation structures
10/22/2008CN201138659Y Monitoring apparatus for wet method process
10/22/2008CN201138658Y Depositing-etching-depositing reaction system
10/22/2008CN201138196Y Measuring apparatus of micro-nano deep groove structure
10/22/2008CN201136908Y Anode chamber and anode assembly for electroplating on wafer
10/22/2008CN201136894Y Device for supplying gaseous hydrogen fluoride
10/22/2008CN201136124Y Locating ring for grinding semiconductor chip
10/22/2008CN101292351A Flash memory with recessed floating gate
10/22/2008CN101292348A Stackable wafer or die packaging with enhanced thermal and device performance
10/22/2008CN101292346A Process for integrating planar and non-planar cmos transistors on a bulk substrate and article made thereby
10/22/2008CN101292345A Field effect transistors (fets) with inverted source/drain metallic contacts, and method of fabricating same
10/22/2008CN101292344A Single crystal based through the wafer connections
10/22/2008CN101292343A Forming covering layer on dual daascence interconnection
10/22/2008CN101292342A Treating a germanium layer bonded to a substrate
10/22/2008CN101292341A Method for the manufacture of a strained silicon-on-insulator structure
10/22/2008CN101292340A Reduced electric field dmos using self-aligned trench isolation
10/22/2008CN101292339A Device for storing contamination-sensitive, flat articles, especially for storing semiconductor wafers
10/22/2008CN101292338A Semiconductor package sorting method
10/22/2008CN101292337A Method to build a wirebond probe card in a many at a time fashion
10/22/2008CN101292336A 电子部件的安装方法 An electronic component mounting method
10/22/2008CN101292335A Redistribution layer for wafer-level chip scale package and method therefor
10/22/2008CN101292334A Strained silicon mos device with box layer between the source and drain regions
10/22/2008CN101292333A Process for modifying dielectric materials
10/22/2008CN101292332A Adaptively coupled plasma source having uniform magnetic field distribution and plasma chamber having the same
10/22/2008CN101292331A Loading device of chemical mechanical polishing equipment for semiconductor wafers
10/22/2008CN101292330A Chemical-enhanced package singulation process
10/22/2008CN101292329A Registration mark within an overlap of dopant regions
10/22/2008CN101292328A Nitride semiconductor device and method for manufacturing same
10/22/2008CN101292327A Method of forming pitch multipled contacts
10/22/2008CN101292326A The statistic analysis of fault detection and classification in semiconductor manufacturing
10/22/2008CN101292325A Spin chuck
10/22/2008CN101292197A Etch features with reduced line edge roughness
10/22/2008CN101292129A Measuring device
10/22/2008CN101292006A Adhesive composition, circuit connecting material, connection structure of circuit connenctors, and semiconductor devices
10/22/2008CN101291973A 热固性树脂组合物和光半导体密封材料 The thermosetting resin composition and an optical semiconductor sealing material
10/22/2008CN101291876A Method of forming metal oxide film, metal oxide film and optical electronic device
10/22/2008CN101291785A Table for cutting sheet
10/22/2008CN101291778A Cerium oxide slurry, cerium oxide polishing slurry and method for polishing substrate using the same
10/22/2008CN101291742A Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation
10/22/2008CN101291563A Method for manufacturing COB circuit board by pole array
10/22/2008CN101291554A Semiconductor device manufacturing method and display device
10/22/2008CN101291551A Life estimating method and treating system for heater wire, heating apparatus, and storage medium
10/22/2008CN101290970A Rewritable electrical storage with inorganic thin film and preparing method thereof
10/22/2008CN101290968A Memory unit possessing side wall contact side electrode
10/22/2008CN101290948A 4F square self-aligning side wall active phase change memory
10/22/2008CN101290947A Magnetic memory and method of manufacturing the same
10/22/2008CN101290945A Imager photodiode capacitor structure for reducing process change sensitivity
10/22/2008CN101290944A Solid-state image capturing device, method of manufacturing the same, and electronic information device
10/22/2008CN101290942A 光电转换器件及其制造方法 The photoelectric conversion device and manufacturing method thereof
10/22/2008CN101290941A Image sensor and method for manufacturing the same
10/22/2008CN101290938A Stack type SONOS memory
10/22/2008CN101290937A Display device and its manufacture method
10/22/2008CN101290936A Semiconductor device and method for manufactruing of the same
10/22/2008CN101290931A Self-cooled thyristor valve of high power and mounting vehicle
10/22/2008CN101290930A Semiconductor device comprising a semiconductor chip stack and method for producing the same
10/22/2008CN101290923A Test base, test base mask and forming method of test base
10/22/2008CN101290914A Semiconductor device and method for manufacturing the same
10/22/2008CN101290912A 半导体装置及其制造方法 Semiconductor device and manufacturing method
10/22/2008CN101290911A Flash memory and preparation method thereof
10/22/2008CN101290910A Semiconductor element and its manufacture method
10/22/2008CN101290909A Manufacture of dielectric layer of grid
10/22/2008CN101290908A Method of obtaining high-quality boundary for manufacturing semiconductor device on divided substrate
10/22/2008CN101290907A Fabrication method of semiconductor integrated circuit device
10/22/2008CN101290906A Method of producing semiconductor device
10/22/2008CN101290905A Display panel and wire manufacturing method thereof
10/22/2008CN101290904A Method for correcting layout design for correcting metallic coating of contact hole
10/22/2008CN101290903A Forming method of shallow groove isolation construction
10/22/2008CN101290902A Manufacturing method of support pin, support pin, heat treatment device and base board sintering furnace
10/22/2008CN101290901A Wafer quality analysis method and device
10/22/2008CN101290900A Monitoring methods of etching
10/22/2008CN101290899A Thermal pressing board
10/22/2008CN101290898A Mask manufacturing method of base board using the mask
10/22/2008CN101290897A Contact mat and method of manufacturing the same
10/22/2008CN101290896A Stackable semiconductor device and manufacture thereof
10/22/2008CN101290895A Manufacturing method of semiconductor package and applied heat radiating structure therein
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