Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/06/2008US20080273411 Fuse of a semiconductor memory device and repair process for the same
11/06/2008US20080273410 Tungsten digitlines
11/06/2008US20080273404 Semiconductor integrated circuit device
11/06/2008US20080273398 Semiconductor device storage cell structure, method of operation, and method of manufacture
11/06/2008US20080273390 NAND flash memory cell array and method of fabricating the same
11/06/2008US20080273379 Programming a normally single phase chalcogenide material for use as a memory of FPLA
11/06/2008US20080273375 Integrated circuit having a magnetic device
11/06/2008US20080273367 Multi-stack ferroelectric polymer memory device and method for manufacturing same
11/06/2008US20080273363 Semiconductor Constructions, Electronic Systems, And Methods of Forming Cross-Point Memory Arrays
11/06/2008US20080273314 PCB having embedded IC and method for manufacturing the same
11/06/2008US20080273283 Low voltage modular room ionization system
11/06/2008US20080273195 System, method and apparatus for in-situ substrate inspection
11/06/2008US20080273157 Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer
11/06/2008US20080272977 Apparatus and Methods for Constructing Antennas Using Vias as Radiating Elements Formed in a Substrate
11/06/2008US20080272867 Mems device with integral packaging
11/06/2008US20080272794 Method of manufacturing a probe card
11/06/2008US20080272749 High Frequency Device, Power Supply Device and Communication Apparatus
11/06/2008US20080272503 Semiconductor Device and Method for Making Same
11/06/2008US20080272502 Packaging board and manufacturing method therefor, semiconductor module and manufacturing method therefor, and portable device
11/06/2008US20080272501 Semiconductor package substrate structure and manufacturing method thereof
11/06/2008US20080272499 Through-wafer vias
11/06/2008US20080272498 Method of fabricating a semiconductor device
11/06/2008US20080272497 Methods of forming conductive vias through substrates, and structures and assemblies resulting therefrom
11/06/2008US20080272496 Planar interconnect structure for hybrid circuits
11/06/2008US20080272494 Semiconductor device
11/06/2008US20080272492 Method of blocking a void during contact formation process and device having the same
11/06/2008US20080272491 Manufacturing of a semiconductor device and the manufacturing method
11/06/2008US20080272490 Semiconductor device including ruthenium electrode and method for fabricating the same
11/06/2008US20080272487 System for implementing hard-metal wire bonds
11/06/2008US20080272479 Integrated circuit package system with device cavity
11/06/2008US20080272478 Circuit and method for interconnecting stacked integrated circuit dies
11/06/2008US20080272477 Package-on-Package Using Through-Hole Via Die on Saw Streets
11/06/2008US20080272476 Through-Hole Via On Saw Streets
11/06/2008US20080272475 Air Cavity Package for a Semiconductor Die and Methods of Forming the Air Cavity Package
11/06/2008US20080272473 Optical device and method of manufacturing the same
11/06/2008US20080272472 Semiconductor packaging device comprising a semiconductor chip including a MOSFET
11/06/2008US20080272470 Same Size Through-Hole Via Die Stacked Package
11/06/2008US20080272469 Semiconductor die package and integrated circuit package and fabricating method thereof
11/06/2008US20080272468 Grounded shield for blocking electromagnetic interference in an integrated circuit package
11/06/2008US20080272467 Method for Forming Fine Pattern of Semiconductor Device
11/06/2008US20080272465 Semiconductor Die with Through-Hole Via on Saw Streets and Through-Hole Via in Active Area of Die
11/06/2008US20080272464 Semiconductor Wafer Having Through-Hole Vias on Saw Streets with Backside Redistribution Layer
11/06/2008US20080272463 Method and Apparatus for Growing a Group (III) Metal Nitride Film and a Group (III) Metal Nitride Film
11/06/2008US20080272462 Nitride-Based Semiconductor Device and Method for Fabricating the Same
11/06/2008US20080272461 Capture of residual refractory metal within semiconductor device
11/06/2008US20080272459 Semiconductor Device and Manufacturing Method of Semiconductor Device
11/06/2008US20080272457 Formation Of Dummy Features And Inductors In Semiconductor Fabrication
11/06/2008US20080272456 Semiconductor device and method of manufacturing the same
11/06/2008US20080272454 Light-Collecting Device, Solid-State Imaging Apparatus and Method of Manufacturing Thereof
11/06/2008US20080272450 Portable optical detection chip and manufacturing method thereof
11/06/2008US20080272449 Solid-state image pickup device, solid-state image pickup device manufacturing method and camera
11/06/2008US20080272448 Integrated circuit having a magnetic tunnel junction device
11/06/2008US20080272446 Packaged MEMS device assembly
11/06/2008US20080272445 Low-k displacer for overlap capacitance reduction
11/06/2008US20080272444 Method of manufacturing semiconductor device and semiconductor device
11/06/2008US20080272441 Method and circuit for down-converting a signal
11/06/2008US20080272440 Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage
11/06/2008US20080272439 Small geometry mos transistor with thin polycrystalline surface contacts and method for making
11/06/2008US20080272438 CMOS Circuits with High-K Gate Dielectric
11/06/2008US20080272437 Threshold Adjustment for High-K Gate Dielectric CMOS
11/06/2008US20080272436 Semiconductor device and method of fabricating the same
11/06/2008US20080272435 Semiconductor device and method of forming the same
11/06/2008US20080272434 Non-volatile memory device and method of manufacturing the same
11/06/2008US20080272433 Dual metal gates for mugfet device
11/06/2008US20080272429 Superjunction devices having narrow surface layout of terminal structures and methods of manufacturing the devices
11/06/2008US20080272427 Sonos Memory Device With Reduced Short-Channel Effects
11/06/2008US20080272426 Nonvolatile Memory Transistors Including Active Pillars and Related Methods and Arrays
11/06/2008US20080272425 Semiconductor Storage Element and Manufacturing Method Thereof
11/06/2008US20080272424 Nonvolatile Memory Device Having Fast Erase Speed And Improved Retention Characteristics And Method For Fabricating The Same
11/06/2008US20080272423 Conductive structures, non-volatile memory device including conductive structures and methods of manufacturing the same
11/06/2008US20080272422 Transistor Providing Different Threshold Voltages and Method of Fabrication Thereof
11/06/2008US20080272421 Methods, constructions, and devices including tantalum oxide layers
11/06/2008US20080272418 Semiconductor component comprising a buried mirror
11/06/2008US20080272416 Image sensor and method of manufacturing the same
11/06/2008US20080272414 Image sensing cell, device, method of operation, and method of manufacture
11/06/2008US20080272411 Semiconductor device with multiple tensile stressor layers and method
11/06/2008US20080272409 JFET Having a Step Channel Doping Profile and Method of Fabrication
11/06/2008US20080272408 Active area junction isolation structure and junction isolated transistors including igfet, jfet and mos transistors and method for making
11/06/2008US20080272407 Semiconductor device having a fin structure and fabrication method thereof
11/06/2008US20080272406 Double gate jfet with reduced area consumption and fabrication method therefor
11/06/2008US20080272404 Method for applying a stress layer to a semiconductor device and device formed therefrom
11/06/2008US20080272403 JFET Device With Virtual Source and Drain Link Regions and Method of Fabrication
11/06/2008US20080272402 JFET Device With Improved Off-State Leakage Current and Method of Fabrication
11/06/2008US20080272401 Inverted Junction Field Effect Transistor and Method of Forming Thereof
11/06/2008US20080272396 Simplified Method of Producing an Epitaxially Grown Structure
11/06/2008US20080272395 Enhanced hole mobility p-type jfet and fabrication method therefor
11/06/2008US20080272394 Junction field effect transistors in germanium and silicon-germanium alloys and method for making and using
11/06/2008US20080272393 Semiconductor device having strain-inducing substrate and fabrication methods thereof
11/06/2008US20080272392 Nondestructively evaluated by X ray diffraction; quantitatively defining quality of surface layer; epitaxially grown; light emitting devices
11/06/2008US20080272388 Method for fabricating thin film pattern, device and fabricating method therefor, method for fabricating liquid crystal display, liquid crystal display, method for fabricating active matrix substrate, electro-optical apparatus, and electrical apparatus
11/06/2008US20080272383 Side mountable semiconductor light emitting device packages, panels and methods of forming the same
11/06/2008US20080272382 Light emitting device and method of manufacturing the same
11/06/2008US20080272378 Method for forming a nitride semiconductor layer and method for separating the nitride semiconductor layer from the substrate
11/06/2008US20080272377 Gallium Nitride Substrate and Gallium Nitride Film Deposition Method
11/06/2008US20080272376 Semiconductor Device and Method of Manufacturing the Same
11/06/2008US20080272374 Semiconductor display device
11/06/2008US20080272370 Field-effect transistor and method for manufacturing the same
11/06/2008US20080272367 Light-emitting device having improved light output
11/06/2008US20080272366 Field effect transistor having germanium nanorod and method of manufacturing the same
11/06/2008US20080272365 Insulating film and electronic device
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