| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 11/11/2008 | US7449380 Method of fabricating isolated semiconductor devices in epi-less substrate |
| 11/11/2008 | US7449379 Semiconductor device and method for fabricating the same |
| 11/11/2008 | US7449378 Structure and method for improved stress and yield in pFETS with embedded SiGe source/drain regions |
| 11/11/2008 | US7449377 Method of fabricating poly silicon layer |
| 11/11/2008 | US7449376 Method of manufacturing a semiconductor device |
| 11/11/2008 | US7449375 Fin semiconductor device and method for fabricating the same |
| 11/11/2008 | US7449374 Methods of manufacturing semiconductor devices with rotated substrates |
| 11/11/2008 | US7449373 Method of ion implanting for tri-gate devices |
| 11/11/2008 | US7449372 Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device |
| 11/11/2008 | US7449371 VIA configurable architecture for customization of analog circuitry in a semiconductor device |
| 11/11/2008 | US7449370 Production process for manufacturing such semiconductor package |
| 11/11/2008 | US7449369 Integrated circuit package system with multiple molding |
| 11/11/2008 | US7449368 Technique for attaching die to leads |
| 11/11/2008 | US7449367 Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device |
| 11/11/2008 | US7449366 Wafer level packaging cap and fabrication method thereof |
| 11/11/2008 | US7449365 Wafer-level flipchip package with IC circuit isolation |
| 11/11/2008 | US7449364 Device and method for including passive components in a chip scale package |
| 11/11/2008 | US7449363 Semiconductor package substrate with embedded chip and fabrication method thereof |
| 11/11/2008 | US7449362 One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
| 11/11/2008 | US7449361 Semiconductor substrate with islands of diamond and resulting devices |
| 11/11/2008 | US7449360 Phase change memory devices and fabrication methods thereof |
| 11/11/2008 | US7449358 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 11/11/2008 | US7449357 Method for fabricating image sensor using wafer back grinding |
| 11/11/2008 | US7449356 Process of forming a microphone using support member |
| 11/11/2008 | US7449355 Anti-stiction technique for electromechanical systems and electromechanical device employing same |
| 11/11/2008 | US7449354 Trench-gated FET for power device with active gate trenches and gate runner trench utilizing one-mask etch |
| 11/11/2008 | US7449353 Co-doping for fermi level control in semi-insulating Group III nitrides |
| 11/11/2008 | US7449352 Mask and manufacturing method of a semiconductor device and a thin film transistor array panel using the mask |
| 11/11/2008 | US7449349 Processing schedule creating method, coating and developing apparatus, pattern forming apparatus and processing system |
| 11/11/2008 | US7449348 Feedback control of imprint mask feature profile using scatterometry and spacer etchback |
| 11/11/2008 | US7449347 Repairing method of a thin film transistor array |
| 11/11/2008 | US7449346 Method of manufacturing ferroelectric thin film for data storage and method of manufacturing ferroelectric recording medium using the same method |
| 11/11/2008 | US7449281 Photosensitive resin composition for black matrix |
| 11/11/2008 | US7449276 Positive photoresist composition and method for forming resist pattern |
| 11/11/2008 | US7449230 Topography; forming a thin, conformal layer on substrate surface, removing layer from bottomwalls so as to yield holes, trenches; gate layers, dopes, dielectric patterning, damascene processes, packaging, electrodeposition, chemical vapor deposition, sputtering |
| 11/11/2008 | US7449226 Dicing die-bonding film, method of fixing chipped work and semiconductor device |
| 11/11/2008 | US7449127 Cleaning method and solution for cleaning a wafer in a single wafer process |
| 11/11/2008 | US7449124 Method of polishing a wafer |
| 11/11/2008 | US7449091 Wafer electroplating apparatus |
| 11/11/2008 | US7449071 Wafer holder with peripheral lift ring |
| 11/11/2008 | US7449067 Method and apparatus for filling vias |
| 11/11/2008 | US7448940 Polishing apparatus and polishing method |
| 11/11/2008 | US7448861 Resin molded semiconductor device and mold |
| 11/11/2008 | US7448604 Heat treatment apparatus |
| 11/11/2008 | US7448397 Apparatus for applying disparate etching solutions to interior and exterior surfaces |
| 11/11/2008 | US7448396 Apparatus and method of removing particles |
| 11/11/2008 | US7448233 Method for manufacturing optical waveguide, optical waveguide device, electro-optical apparatus and electronic apparatus |
| 11/11/2008 | US7448129 Peel-off plate for an electronic-part delivery system |
| 11/06/2008 | WO2008134691A1 Junction-fet-based dram-type storage cell, method of operation, and method of manufacture |
| 11/06/2008 | WO2008134686A2 Silicon germanium heterojunction bipolar transistor structure and method |
| 11/06/2008 | WO2008134536A1 Method for electrochemically depositing metal onto a microelectronic workpiece |
| 11/06/2008 | WO2008134498A1 Embossing |
| 11/06/2008 | WO2008134427A1 Leadframe configuration to enable strip testing of sot-23 packages and the like |
| 11/06/2008 | WO2008134426A2 Leadframe configuration to enable strip testing of sot-23 packages and the like |
| 11/06/2008 | WO2008134412A1 Selective etch of tiw for capture pad formation |
| 11/06/2008 | WO2008134405A1 Test plate pocket for electronic handler |
| 11/06/2008 | WO2008134205A1 Semiconductor constructions, electronic systems, and methods of forming cross-point memory arrays |
| 11/06/2008 | WO2008134148A1 Junction field effect transistors in germanium and silicon-germanium alloys and method for making and using |
| 11/06/2008 | WO2008134075A1 Magnetic floating gate flash memory structures |
| 11/06/2008 | WO2008134041A1 Inertial wafer centering and effector and transport apparatus |
| 11/06/2008 | WO2008133865A1 Die-cut and method of manufacturing or assembling die-cuts from the components thereof |
| 11/06/2008 | WO2008133832A1 A technique for enhancing transistor performance by transistor specific contact design |
| 11/06/2008 | WO2008133817A1 A self-aligned pattering method by using non-conformal film and etch back for sonos memory |
| 11/06/2008 | WO2008133767A2 Polysilicon planarization solution for planarizing low temperature polysilicon thin film panels |
| 11/06/2008 | WO2008133756A1 Efficient light extraction method and device |
| 11/06/2008 | WO2008133752A2 Nanoscale oxide coatings |
| 11/06/2008 | WO2008133719A2 Methodology and apparatus for the detection of biological substances |
| 11/06/2008 | WO2008133593A2 Cleaning process and apparatus |
| 11/06/2008 | WO2008133418A1 Detecting materials on wafer and repair system and method thereof |
| 11/06/2008 | WO2008133311A1 Resist protective film composition for immersion lithography |
| 11/06/2008 | WO2008133300A1 Polyimide precursor, polyimide, and coating solution for under layer film for image formation |
| 11/06/2008 | WO2008133286A1 Polishing apparatus and program for the same |
| 11/06/2008 | WO2008133275A1 Surface emission type electron source and drawing device |
| 11/06/2008 | WO2008133270A1 Radiation-sensitive resin composition |
| 11/06/2008 | WO2008133234A1 Optical element holding device, lens barrel, exposure device, and device manufacturing method |
| 11/06/2008 | WO2008133215A1 Semiconductor integrated circuit |
| 11/06/2008 | WO2008133186A1 Circuit connecting adhesive film, connecting structure and method for manufacturing the connecting structure |
| 11/06/2008 | WO2008133167A1 Semiconductor device and method for manufacturing semiconductor device |
| 11/06/2008 | WO2008133149A1 Supporting member, carrier and supporting method |
| 11/06/2008 | WO2008133107A1 Magnetoresistive element, mram, and magnetic sensor |
| 11/06/2008 | WO2008133104A1 Pressure-sensitive adhesive sheet for water jet laser dicing |
| 11/06/2008 | WO2008132983A1 Polishing agent composition and method for manufacturing semiconductor integrated circuit device |
| 11/06/2008 | WO2008132960A1 Novel polyimide precursor composition and use thereof |
| 11/06/2008 | WO2008132933A1 Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure |
| 11/06/2008 | WO2008132919A1 Highly reliable gold alloy bonding wire and semiconductor device |
| 11/06/2008 | WO2008132901A1 Plasma processing apparatus |
| 11/06/2008 | WO2008132895A1 Method for manufacturing soi substrate and semiconductor device |
| 11/06/2008 | WO2008132894A1 Display device, method for manufacturing display device, and soi substrate |
| 11/06/2008 | WO2008132878A1 Method for forming organic semiconductor layer and method for manufacturing organic thin film transistor |
| 11/06/2008 | WO2008132862A1 Semiconductor device, and its manufacturing method |
| 11/06/2008 | WO2008132852A1 Dicing/die bonding tape and method for manufacturing semiconductor chip |
| 11/06/2008 | WO2008132809A1 Semiconductor integrated circuit, semiconductor integrated circuit control method, and terminal system |
| 11/06/2008 | WO2008132799A1 Measuring method, exposure method, and device fabricating method |
| 11/06/2008 | WO2008132734A2 Focused ion beam deep nano- patterning method |
| 11/06/2008 | WO2008132703A1 High-voltage metal-oxide semiconductor device and corresponding manufacturing method and implantation mask |
| 11/06/2008 | WO2008132569A1 Method for transferring an epitaxial layer |
| 11/06/2008 | WO2008132564A1 Method for manufacturing compound materialn wafer and corresponding compound material wafer |
| 11/06/2008 | WO2008132559A1 Semiconductor wafer processing |
| 11/06/2008 | WO2008132204A2 Nitride semi-conductor component layer structure on a group iv substrate surface |
| 11/06/2008 | WO2008132026A1 Threshold adjustment for high-k gate dielectric cmos |