Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/06/2008WO2008132000A1 Method for forming a semiconductor structure
11/06/2008WO2008131790A1 Process and apparatus for electrolytic metallization of treatment good
11/06/2008WO2008131713A2 Apparatus for the production of a rigid power module
11/06/2008WO2008131513A1 Irradiance pulse heat-treating methods and apparatus
11/06/2008WO2008109654A3 Electrical antifuse, method of manufacture and method of programming
11/06/2008WO2008109236B1 Heterogeneous semiconductor substrate
11/06/2008WO2008103794A3 Conductive pattern formation method
11/06/2008WO2008103331A3 Wide-bandgap semiconductor devices
11/06/2008WO2008101031A3 Light emitting devices made by bio-fabrication
11/06/2008WO2008100846A3 Atomic layer deposition systems and methods
11/06/2008WO2008099327A3 Embedded inductor and method of producing thereof
11/06/2008WO2008091840A3 Stress free package and laminate-based isolator package
11/06/2008WO2008085813A8 Methods for nanopatterning and production of nanostructures
11/06/2008WO2008084364A3 I-mosfet manufacturing method
11/06/2008WO2008084272A3 Compact apparatus
11/06/2008WO2008083411A3 Method and system for creating self-aligned twin wells with co-planar surfaces in a semiconductor device
11/06/2008WO2008083081A3 Sapphire substrates and methods of making same
11/06/2008WO2008080096A3 Compositions and methods for the selective removal of silicon nitride
11/06/2008WO2008076080A3 A clamping assembly
11/06/2008WO2008045591A3 Low power rf tuning using optical and non-reflected power methods
11/06/2008WO2008036104A3 Analog micromirror devices with continuous intermediate states
11/06/2008WO2007136884A3 EPI T-GATE STRUCTURE FOR CoSi2 EXTENDIBILITY
11/06/2008WO2007130728A3 Electronic device including semiconductor islands of different thicknesses over an insulating layer and a process of forming the same
11/06/2008WO2007120293A3 Process for forming an electronic device including a fin-type structure
11/06/2008WO2007115002A3 Self-aligned body contact for an semiconductor-on-insulator trench device and method of fabricating same
11/06/2008WO2007112454A3 Apparatus and method for processing substrates using one or more vacuum transfer chamber units
11/06/2008WO2007094873A3 Back-gated semiconductor device with a storage layer
11/06/2008WO2007092653A3 Method of forming a semiconductor device
11/06/2008WO2007038514B1 Apparatus and method for substrate edge etching
11/06/2008WO2006101897A3 Method and apparatus for monitoring plasma conditions in an etching plasma processing facility
11/06/2008WO2006066100A3 Method and apparatus for laser dicing
11/06/2008US20080276216 Pattern forming method and system, and method of manufacturing a semiconductor device
11/06/2008US20080276215 Mask Pattern Designing Method Using Optical Proximity Correction in Optical Lithography, Designing Device, and Semiconductor Device Manufacturing Method Using the Same
11/06/2008US20080275584 Production management method and production management system
11/06/2008US20080275463 Cystotomy catheter capture device and methods of using same
11/06/2008US20080275181 Having siloxane functionality; continuous printing properties; low temperature dryability; printed circuit board protective films; dimensional stability, flexibility, adhesiveness; heat and chemical resistance
11/06/2008US20080274673 Wafer polishing apparatus, wafer polishing system and wafer polishing method
11/06/2008US20080274670 Substrate Peripheral Portion Measuring Device, and Substrate Peripheral Portion Polishing Apparatus
11/06/2008US20080274627 Silicon-containing film, forming material, making method, and semiconductor device
11/06/2008US20080274626 Method for depositing a high quality silicon dielectric film on a germanium substrate with high quality interface
11/06/2008US20080274625 METHODS OF FORMING ELECTRONIC DEVICES CONTAINING Zr-Sn-Ti-O FILMS
11/06/2008US20080274624 Method for depositing titanium nitride films for semiconductor manufacturing
11/06/2008US20080274623 Methods for fabricating a magnetic head reader using a chemical mechanical polishing (cmp) process for sensor stripe height patterning
11/06/2008US20080274622 Plasma Processing, Deposition and ALD Methods
11/06/2008US20080274621 III-Nitride semiconductor device with trench structure
11/06/2008US20080274620 Chemical mechanical polishing agent kit and chemical mechanical polishing method using the same
11/06/2008US20080274619 CMP compositions containing a soluble peroxometalate complex and methods of use thereof
11/06/2008US20080274618 Removal silicon in preference to silica in semiconductor manufacturing aqueous dispersion containing ceria abrasive; adjusting pH with acid; adding polyethylenimine
11/06/2008US20080274617 Periodic plasma annealing in an ald-type process
11/06/2008US20080274616 Method for depositing titanium nitride films for semiconductor manufacturing
11/06/2008US20080274615 Atomic Layer Deposition Methods, Methods of Forming Dielectric Materials, Methods of Forming Capacitors, And Methods of Forming DRAM Unit Cells
11/06/2008US20080274614 fabricating method of metal line
11/06/2008US20080274613 Method for the Protection of Openings in a Component During a Machining Process
11/06/2008US20080274612 Shielded capacitor structure
11/06/2008US20080274611 Method and process for forming a self-aligned silicide contact
11/06/2008US20080274610 Methods of forming a semiconductor device including a diffusion barrier film
11/06/2008US20080274609 Method and structure for low-K interlayer dielectric layer
11/06/2008US20080274608 Structure and method for enhancing resistance to fracture of bonding pads
11/06/2008US20080274607 Semiconductor device and fabrication process thereof
11/06/2008US20080274606 Method of manufacturing semiconductor device
11/06/2008US20080274605 Method of manufacturing silicon nitride film, method of manufacturing semiconductor device, and semiconductor device
11/06/2008US20080274604 Susceptor with backside area of constant emissivity
11/06/2008US20080274603 Semiconductor Package Having Through-Hole Via on Saw Streets Formed with Partial Saw
11/06/2008US20080274602 Method of manufacturing dynamic random access memory
11/06/2008US20080274601 Method of forming a transistor having multiple types of schottky junctions
11/06/2008US20080274600 Method to improve source/drain parasitics in vertical devices
11/06/2008US20080274599 Method of manufacturing a semiconductor device having a trench surrounding plural unit cells
11/06/2008US20080274598 Doped WGe to form dual metal gates
11/06/2008US20080274597 Method and structure to reduce contact resistance on thin silicon-on-insulator device
11/06/2008US20080274596 Semiconductor device and method of manufacturing the same
11/06/2008US20080274595 Dual substrate orientation or bulk on SOI integrations using oxidation for silicon epitaxy spacer formation
11/06/2008US20080274594 Step height reduction between SOI and EPI for DSO and BOS integration
11/06/2008US20080274593 Semiconductor device package with multi-chips and method of the same
11/06/2008US20080274592 Process and apparatus for wafer-level flip-chip assembly
11/06/2008US20080274591 Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices
11/06/2008US20080274590 Manufacturing method of semiconductor device
11/06/2008US20080274589 Wafer-level flip-chip assembly methods
11/06/2008US20080274588 Semiconductor device and method of fabricating the same, circuit board, and electronic instrument
11/06/2008US20080274587 Method of Assembling Electronic Components of an Electronic System, and System Thus Obtained
11/06/2008US20080274586 Semiconductor device, wafer and method of designing and manufacturing the same
11/06/2008US20080274583 Through-wafer vias
11/06/2008US20080274579 Wafer level image sensor package with die receiving cavity and method of making the same
11/06/2008US20080274578 Method of forming a pixel sensor cell for collecting electrons and holes
11/06/2008US20080274577 Method of the Application of a Zinc Sulfide Buffer Layer on a Semiconductor Substrate
11/06/2008US20080274576 Semiconductor device and manufacturing method thereof
11/06/2008US20080274571 Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device
11/06/2008US20080274570 Inkjet head, method for producing inkjet head, inkjet recorder and inkjet coater
11/06/2008US20080274569 Method for forming semiconductor ball grid array package
11/06/2008US20080274568 Reticle and method of fabricating semiconductor device
11/06/2008US20080274567 Method of forming integrated circuit having a magnetic tunnel junction device
11/06/2008US20080274433 Removal development solution using water based cleaniong solution; then surfactant; rotation; controlling times
11/06/2008US20080274431 Photolithography; miniaturized semiconductors; mixing a resin and crosslinking agent in a solvent
11/06/2008US20080274416 Layout Method for Mask
11/06/2008US20080274415 Layout Method for Mask
11/06/2008US20080274370 Noncontaminating, efficient control of very thin film formation; plasma cleaning and oxidizing substrate in single vessel without air exposure
11/06/2008US20080274334 Dry Etching Gas and Method of Dry Etching
11/06/2008US20080274299 Apparatus and method for hybrid chemical processing
11/06/2008US20080274279 Forming a cobalt layer on a tungsten barrier layer using a cyclical deposition process to sequentially expose the substrate to a precursor gas of cobalt having a cyclopentadienyl ligand and a silicon reducing gas; copper plating to fill high aspect ratio, nano-interconnect semiconductor features
11/06/2008US20080273950 Device and method for turning over electronic components
11/06/2008US20080273413 Semiconductor device
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