Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/06/2008US20080272364 Insulating film and electronic device
11/06/2008US20080272363 Selectively Conducting Devices, Diode Constructions, Constructions, and Diode Forming Methods
11/06/2008US20080272361 High Density Nanotube Devices
11/06/2008US20080272360 Programmable metallization cell structures including an oxide electrolyte, devices including the structure and method of forming same
11/06/2008US20080272355 Phase change memory device and method for forming the same
11/06/2008US20080272354 Phase change diode memory
11/06/2008US20080272180 Method of manufacturing heat spreader module
11/06/2008US20080272176 Wedge-bonding of wires in electronic device manufacture with reversible wedge bonding
11/06/2008US20080272089 Monitoring etching of a substrate in an etch chamber
11/06/2008US20080271849 Hollow anode plasma reactor and method
11/06/2008US20080271780 Photovoltaic Cell and Production Thereof
11/06/2008US20080271752 Cleaning method, particle removing method, cleaning apparatus, and cleaning liquid
11/06/2008US20080271751 Apparatus and method for cleaning semiconductor wafer
11/06/2008US20080271667 Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same
11/06/2008US20080271640 Mixing of glass with hydrocarbons; chemical vapor deposition; mixing organosilane and/or organosiloxane precursors with porogens; neohexyl-1,3,5,7-tetramethylcyclo-tetrasiloxane
11/06/2008US20080271501 Locking Device
11/06/2008US20080271471 Temperature Controlling Method for Substrate Processing System and Substrate Processing System
11/06/2008US20080271383 Rapid surface treatment of silicon dioxide insulating films without scratching; aqueous slurry containing cerium oxide particles and acrylic acid polymer dispersant
11/06/2008US20080271313 Method, system, and apparatus for transfer of dies using a die plate
11/06/2008US20080271312 Ball grid array rework using a continuous belt furnace
11/06/2008US20080271274 Apparatus for Cleaning of Circuit Substrates
11/06/2008DE19936941B4 Verfahren zur Herstellung dünner Schichten, insbesondere Dünnschichtsolarzellen, auf einem Trägersubstrat A process for the production of thin layers, in particular thin layer solar cell on a support substrate
11/06/2008DE19712796B4 Epitaktischer SiC-Wafer, Verfahren zu seiner Herstellung und Halbleiter-Vorrichtung, die diesen verwendet SiC epitaxial wafer, a process for its preparation and semiconductor device using this
11/06/2008DE112007000210T5 Kontaktvorrichtung und Verfahren zur Herstellung derselben Contact device and method for manufacturing the same
11/06/2008DE112007000161T5 Halbleitergerät für Hochfrequenz Semiconductor device for high frequency
11/06/2008DE112006003599T5 Eingehauste Halbleitervorrichtung mit zwei freiliegenden Oberflächen und Verfahren zur Herstellung Encapsulated semiconductor device having two exposed surfaces and methods for preparing
11/06/2008DE112006003576T5 Verfahren und Struktur zur Reduzierung des äusseren Widerstands eines dreidimensionalen Transistors durch Verwendung von Epitaxie-Schichten Method and structure for reducing the external resistance of a three-dimensional transistor by using epitaxial layers
11/06/2008DE112006003461T5 Verfahren zur Herstellung einer zerlegbaren scheibenförmigen Struktur, insbesondere auf Silizium basierend, und Anwendung des Verfahrens A method of manufacturing a separable disk-shaped structure, in particular based on silicon, and use of the method
11/06/2008DE112006003181T5 Verfahren zum Bonden zwischen elektrischen Bauelementen unter Verwendung von Ultraschallschwingung The method for bonding between electrical devices using ultrasonic vibration
11/06/2008DE10341806B4 Verfahren zur Herstellung einer epitaktischen Silizium-Germanium Basisschicht eines heterobipolaren pnp Transistors A process for producing an epitaxial silicon-germanium base layer of a PNP transistor heterobipolaren
11/06/2008DE102008020452A1 Verfahren zur Erzeugung eines Layouts, Verwendung eines Transistorlayouts und Halbleiterschaltung A method of generating a layout, using a transistor and semiconductor circuit layouts
11/06/2008DE102008019336A1 Halbleiterbausteinpackung zur Verbesserung der Funktion von Wärmeableitung und Erdungsabschirmung Semiconductor device package to improve the function of heat dissipation and ground shield
11/06/2008DE102008015709A1 Elektrische Einrichtung mit Abdeckung An electrical device with cover
11/06/2008DE102008015108A1 Chip-Selbstumverteilungsvorrichtung und Verfahren dafür Chip self redistribution device and method therefor
11/06/2008DE102008000261A1 Semiconductor device has cap electrical conductivity regions that function as draw-out electrical conductivity regions of cap substrate, are electrically connected to movable and fixed base semiconductor regions of base substrate
11/06/2008DE102007053108A1 Thermally treating disk-shaped semiconductor silicon wafer body at a temperature, comprises introducing wafer in treatment chamber having suspension gas stream, and carrying out thermal treatment of wafer under changing wafer temperature
11/06/2008DE102007043097A1 Ein Layout-Verfahren für eine Maske A layout method for a mask
11/06/2008DE102007041397A1 Verstärkte, muldenförmige Ablage für empfindliche Bauelemente Reinforced, trough-shaped storage for sensitive components
11/06/2008DE102007020659A1 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
11/06/2008DE102007020658A1 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
11/06/2008DE102007020657A1 Halbleiterbauelement mit einem Halbleiterkörper und Verfahren zur Herstellung desselben Of the same semiconductor device with a semiconductor body and method for producing
11/06/2008DE102007020656A1 Werkstück mit Halbleiterchips, Halbleiterbauteil und Verfahren zur Herstellung eines Werkstücks mit Halbleiterchips Workpiece with semiconductor chips, semiconductor device and process for the production of a workpiece with semiconductor chips
11/06/2008DE102007020475A1 Verfahren zur Herstellung einer Leiterplatte mit einer Kavität für die Integration von Bauteilen und Leiterplatte und Anwendung A process for producing a circuit board having a cavity for the integration of components and printed circuit board and application
11/06/2008DE102007020269A1 Halbleiterstruktur mit einer elektrischen Verbindung und Verfahren zu ihrer Herstellung Semiconductor structure having an electrical connection and processes for their preparation
11/06/2008DE102007020268B3 Halbleiterbauelement und Verfahren zum Verhindern der Ausbildung von elektrischen Kurzschlüssen aufgrund von Hohlräumen in der Kontaktzwischenschicht A semiconductor device and method for preventing the formation of electrical shorts due to contact cavities in the intermediate layer
11/06/2008DE102007020261A1 Technik zur Erhöhung der Dotierstoffaktivierung unter Anwendung mehrerer sequenzieller fortschrittlicher Laser/Blitzlicht-Ausheizprozesse Technique for increasing the dopant activation using multiple sequential advanced laser / flashlight anneal
11/06/2008DE102007020260A1 Verbessern der Transistoreigenschaften durch eine späte tiefe Implantation in Verbindung mit einem diffusionsfreien Ausheizprozess Improving the transistor characteristics by a late deep implantation in combination with a diffusion anneal free
11/06/2008DE102007020258A1 Technik zur Verbesserung des Transistorleitungsverhaltens durch eine transistorspezifische Kontaktgestaltung Technology to improve the transistor conduction behavior through a transistor-specific contact design
11/06/2008DE102007020257A1 Vereinheitlichte Teststruktur für belastungsabhängige Materialwanderungsprüfungen Standardized test structure for load-dependent migration of material tests
11/06/2008DE102007020252A1 Technik zur Herstellung von Metallleitungen in einem Halbleiter durch Anpassen der Temperaturabhängigkeit des Leitungswiderstands Art for the preparation of metal lines in a semiconductor by adjusting the temperature dependence of the cable resistance
11/06/2008DE102007020249A1 Semiconductor component e.g. power field effect transistor, has contact surface enclosing opening region exhibits transverse opening region with elongated extension that cuts measuring strip transversely or perpendicularly
11/06/2008DE102007020248A1 Vertical power transistor, has recess comprising edge trench laterally limited to recess, where length of part of trench is smaller or equal to length of double spaced adjacent trenches
11/06/2008DE102007019795A1 Chipmodul und Verfahren zum Herstellen dieses Chipmoduls Chip module and method of manufacturing this chip module
11/06/2008DE102007018760A1 Verfahren zur Herstellung einer MOS-Transistorvorrichtung mit vertieftem Gate A method of manufacturing a MOS transistor device with recessed gate
11/06/2008DE102007006151B4 Verfahren zur Verringerung und Homogenisierung der Dicke einer Halbleiterschicht, die sich auf der Oberfläche eines elektrisch isolierenden Materials befindet A process for the reduction and homogenization of the thickness of a semiconductor layer which is located on the surface of an electrically insulating material
11/06/2008DE102007004860B4 Verfahren zur Herstellung einer Kupfer-basierten Metallisierungsschicht mit einer leitenden Deckschicht durch ein verbessertes Integrationsschema A process for preparing a copper-based metallization layer with a conductive outer layer by an improved integration scheme
11/06/2008DE102004040504B4 Testanordnung für molekulare Bauelemente Test arrangement for molecular devices
11/06/2008DE102004036753B4 Verfahren zur Herstellung einer stickstofffreien ARC-Deckschicht A process for preparing a nitrogen-free ARC cap layer
11/06/2008DE102004008218B4 Wiedergewinnen von in einem integrierten Magnetspeicher gespeicherten Daten Retrieving data stored in an integrated magnetic memory data
11/06/2008DE10155023B4 Leitungsanordnung für Bitleitungen zur Kontaktierung mindestens einer Speicherzelle und Verfahren zur Herstellung einer Leitungsanordnung für Bitleitungen Conduit means for bit lines for making contact with at least a memory cell and method for manufacturing a piping arrangement for the bit lines
11/06/2008DE10154658B4 Integrierter Leistungsschaltkreis mit verbessertem elektrischen und thermischen Durchgangswiderstand und Verfahren zu seiner Herstellung Integrated power circuit with enhanced electrical and thermal contact resistance, and process for its preparation
11/06/2008DE10031056B4 Verfahren zur Herstellung eines Kondensators für eine Halbleiterspeichervorrichtung A method of manufacturing a capacitor for a semiconductor memory device
11/06/2008DE10026911B4 Verfahren zur Herstellung eines Halbleiter-Superatoms und eines Aggregats davon A process for producing a semiconductor superatom and an aggregate thereof
11/06/2008CA2685275A1 Polysilicon planarization solution for planarizing low temperature polysilicon thin film panels
11/05/2008EP1988579A2 Power MOSFET having a trench gate electrode
11/05/2008EP1988574A1 Semiconductor device
11/05/2008EP1988573A2 Highly reliable low-cost structure for wafer-level ball grid array packaging
11/05/2008EP1988570A1 Mounting method
11/05/2008EP1988569A2 Method of manufacturing a terminal of a power semiconductor component and electronic component with a terminal manufactured in this manner
11/05/2008EP1988568A1 Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device
11/05/2008EP1988567A1 Semiconductor device manufacturing method and method for reducing microroughness of semiconductor surface
11/05/2008EP1988566A2 Method for creating patterns inside a polymer layer
11/05/2008EP1988193A1 Epitaxial wafer manufacturing method
11/05/2008EP1988188A2 Apparatus and method for producing films
11/05/2008EP1987707A2 Method for producing a layer on a moulding and use thereof
11/05/2008EP1987536A2 Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device
11/05/2008EP1987535A1 Vias and method of making
11/05/2008EP1987534A1 Method for exchanging a semiconductor chip of a flip-chip module and a flip-chip module suitable therefor
11/05/2008EP1987533A1 Non-conductive planarization of substrate surface for mold cap
11/05/2008EP1987532A1 Method for producing planar insulating layers with breakthroughs at the correct position by means of laser cutting and devices produced accordingly
11/05/2008EP1986950A1 Mems components and method for manufacturing same
11/05/2008EP1986832A1 Method of manufacturing a semiconductor device and a semiconductor device produced thereby
11/05/2008EP1986793A2 Single side workpiece processing
11/05/2008EP1874979A4 Reactor
11/05/2008EP1828070A4 Selective high dielectric constant material etchant
11/05/2008EP1800345A4 Method of creating defect free high ge content (25%) sige-on-insulator (sgoi) substrates using wafer bonding techniques
11/05/2008EP1728274A4 Method for forming a semiconductor device having a notched control electrode and structure thereof
11/05/2008EP1668706A4 Structure and method for metal replacement gate of high performance device
11/05/2008EP1540710A4 Nanocrystal electron device
11/05/2008EP1507267B1 Wiring material and wiring board using the same
11/05/2008EP1500143B1 Low input capacitance electrostatic discharge protection circuit utilizing feedback
11/05/2008EP1452917B1 Positive resist composition and method of forming resist pattern from the same
11/05/2008EP1395633B1 Method for producing thin homogeneous layers with the help of screen printing technology
11/05/2008EP1393546B1 A socket contact and feed-through device
11/05/2008EP1198830B1 Process of manufacturing a semiconductor device including a buried channel field effect transistor
11/05/2008CN201146178Y Rectangle suction nozzle for encapsulation manufacturing process
11/05/2008CN201144053Y Transmission encapsulation member for transmitting substrate holders
11/05/2008CN201143798Y Laser marker
11/05/2008CN201143596Y ITO thin film laser etching machine
11/05/2008CN101300685A Semiconductor device and fabrication method thereof
1 ... 2410 2411 2412 2413 2414 2415 2416 2417 2418 2419 2420 2421 2422 2423 2424 2425 2426 2427 2428 2429 2430 ... 6590