| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/02/2009 | US20090086782 Semiconductor laser device and method for manufacturing the same |
| 04/02/2009 | US20090086779 Semiconductor laser diode with reduced parasitic capacitance |
| 04/02/2009 | US20090086540 Method of operating non-volatile memory array |
| 04/02/2009 | US20090086528 Back gated sram cell |
| 04/02/2009 | US20090086527 Non-volatile memory device having threshold switching resistor, memory array including the non-volatile memory device and methods of manufacturing the same |
| 04/02/2009 | US20090086523 Integrated circuit and method of forming an integrated circuit |
| 04/02/2009 | US20090086521 Multiple antifuse memory cells and methods to form, program, and sense the same |
| 04/02/2009 | US20090086446 Electronic circuit device and method of making the same |
| 04/02/2009 | US20090086445 Electronic circuit device and method of making the same |
| 04/02/2009 | US20090086401 Electrostatic chuck apparatus |
| 04/02/2009 | US20090086400 Electrostatic chuck apparatus |
| 04/02/2009 | US20090086307 Gray level method for slm-based optical lithography |
| 04/02/2009 | US20090086182 Apparatus for slm-based optical lithography with gray level capability |
| 04/02/2009 | US20090086177 Lithographic apparatus having a lorentz actuator with a composite carrier |
| 04/02/2009 | US20090086176 Method of operation for slm-based optical lithography tool |
| 04/02/2009 | US20090086153 Strip-shaped base metal for liquid cell, multi-face chamfered base material for liquid cell, substrate for array substrate, and liquid cell manufacturing method |
| 04/02/2009 | US20090086066 Solid-state imaging device, method of manufacturing the same, and camera |
| 04/02/2009 | US20090085747 Rfid tag and manufacturing method thereof |
| 04/02/2009 | US20090085716 Semiconductor device and method of fabricating the same |
| 04/02/2009 | US20090085608 Systems, methods and devices for arbitrating die stack position in a multi-bit stack device |
| 04/02/2009 | US20090085597 Process Monitor for Monitoring an Integrated Circuit Chip |
| 04/02/2009 | US20090085541 Semiconductor Device, Method for Fabricating the Same, and Transformer Circuit Using the Same |
| 04/02/2009 | US20090085233 Alignment features for proximity communication |
| 04/02/2009 | US20090085232 Method of reducing memory card edge roughness by edge coating |
| 04/02/2009 | US20090085231 Method of reducing memory card edge roughness by particle blasting |
| 04/02/2009 | US20090085228 Die warpage control |
| 04/02/2009 | US20090085227 Flip-chip mounting body and flip-chip mounting method |
| 04/02/2009 | US20090085226 Method and arrangement for contact-connecting semiconductor chips on a metallic substrate |
| 04/02/2009 | US20090085225 Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same |
| 04/02/2009 | US20090085224 Stack-type semiconductor package |
| 04/02/2009 | US20090085222 Electronic apparatus and manufacturing method thereof |
| 04/02/2009 | US20090085221 Multi-host interface controller with USB PHY/analog functions integrated in a single package |
| 04/02/2009 | US20090085220 Semiconductor component and method of manufacturing |
| 04/02/2009 | US20090085219 Power semiconductor arrangement |
| 04/02/2009 | US20090085218 Flash memory device and fabricating method thereof |
| 04/02/2009 | US20090085217 Semiconductor device and method of making semiconductor device |
| 04/02/2009 | US20090085214 Semiconductor device and method of fabricating the same |
| 04/02/2009 | US20090085212 Cladded silver and silver alloy metallization for improved adhesion electromigration resistance |
| 04/02/2009 | US20090085211 Electrical contacts for integrated circuits and methods of forming using gas cluster ion beam processing |
| 04/02/2009 | US20090085210 Structures and methods for reduction of parasitic capacitances in semiconductor integrated circuits |
| 04/02/2009 | US20090085209 Semiconductor device with copper wirebond sites and methods of making same |
| 04/02/2009 | US20090085207 Ball grid array substrate package and solder pad |
| 04/02/2009 | US20090085206 Method of forming solder bumps on substrates |
| 04/02/2009 | US20090085205 Method for manufacturing an electronic component package and electronic component package |
| 04/02/2009 | US20090085204 Wafer-level package and method of manufacturing the same |
| 04/02/2009 | US20090085203 Method for Exchanging Semiconductor Chip of Flip-Chip Module and Flip-Chip Module Suitable Therefor |
| 04/02/2009 | US20090085202 Methods and Apparatus for Assembling Integrated Circuit Device Utilizing a Thin Si Interposer |
| 04/02/2009 | US20090085201 Direct device attachment on dual-mode wirebond die |
| 04/02/2009 | US20090085198 Nanotube based vapor chamber for die level cooling |
| 04/02/2009 | US20090085196 Integrated circuit chip manufaturing method and semiconductor device |
| 04/02/2009 | US20090085195 Method of Making Microelectronic Package Using Integrated Heat Spreader Stiffener Panel and Microelectronic Package Formed According to the Method |
| 04/02/2009 | US20090085194 Wafer level packaged mems device |
| 04/02/2009 | US20090085192 Packaging substrate structure having semiconductor chip embedded therein and fabricating method thereof |
| 04/02/2009 | US20090085191 Environment-Resistant Module, Micropackage And Methods Of Manufacturing Same |
| 04/02/2009 | US20090085190 Semiconductor Device and Method for Making Same |
| 04/02/2009 | US20090085189 Power semiconductor module |
| 04/02/2009 | US20090085187 Loading mechanism for bare die packages and lga socket |
| 04/02/2009 | US20090085186 Semiconductor Device and Methods of Manufacturing Semiconductor Devices |
| 04/02/2009 | US20090085183 Integrated-circuit package for proximity communication |
| 04/02/2009 | US20090085182 Semiconductor device and method for manufacturing the same |
| 04/02/2009 | US20090085181 Integrated circuit package system with multiple die |
| 04/02/2009 | US20090085180 Packaging carrier with high heat dissipation and method for manufacturing the same |
| 04/02/2009 | US20090085177 Integrated circuit package system with leadframe array |
| 04/02/2009 | US20090085176 Glass-based soi structures |
| 04/02/2009 | US20090085175 Semiconductor device containing a buried threshold voltage adjustment layer and method of forming |
| 04/02/2009 | US20090085174 Structural body and manufacturing method thereof |
| 04/02/2009 | US20090085173 Sidewall protection layer |
| 04/02/2009 | US20090085172 Deposition Method, Deposition Apparatus, Computer Readable Medium, and Semiconductor Device |
| 04/02/2009 | US20090085171 Oxide film formation method and image sensing apparatus |
| 04/02/2009 | US20090085170 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device |
| 04/02/2009 | US20090085169 Method of achieving atomically smooth sidewalls in deep trenches, and high aspect ratio silicon structure containing atomically smooth sidewalls |
| 04/02/2009 | US20090085167 Methods for Forming Metal-Germanide Layers and Devices Obtained Thereby |
| 04/02/2009 | US20090085166 Gallium nitride semiconductor device and manufacturing method thereof |
| 04/02/2009 | US20090085165 Group 3-5 Nitride Semiconductor Multilayer Substrate, Method for Manufacturing Group 3-5 Nitride Semiconductor Free-Standing Subtrate, and Semiconductor Element |
| 04/02/2009 | US20090085164 Wiring board |
| 04/02/2009 | US20090085163 Vertical diode using silicon formed by selective epitaxial growth |
| 04/02/2009 | US20090085159 Semiconductor device and method for manufacturing the same |
| 04/02/2009 | US20090085158 Package with improved connection of a decoupling capacitor |
| 04/02/2009 | US20090085157 Manufacturing method for an integrated circuit, corresponding intermediate integrated circuit structure and corresponding integrated circuit |
| 04/02/2009 | US20090085156 Metal surface treatments for uniformly growing dielectric layers |
| 04/02/2009 | US20090085154 Vertical diode based memory cells having a lowered programming voltage and methods of forming the same |
| 04/02/2009 | US20090085153 Diode array and method of making thereof |
| 04/02/2009 | US20090085152 Three dimensional vertical e-fuse structures and methods of manufacturing the same |
| 04/02/2009 | US20090085151 Semiconductor fuse structure and method |
| 04/02/2009 | US20090085150 Semiconductor device having silicon-on-insulator (SOI) structure and method of forming semiconductor device |
| 04/02/2009 | US20090085149 Semiconductor device and method of processing the same |
| 04/02/2009 | US20090085148 Multi-directional trenching of a plurality of dies in manufacturing superjunction devices |
| 04/02/2009 | US20090085147 Multi-directional trenching of a die in manufacturing superjunction devices |
| 04/02/2009 | US20090085145 Semiconductor structure comprising an electrically conductive feature and method of forming a semiconductor structure |
| 04/02/2009 | US20090085139 Solid-state image sensing device and method for manufacturing the same |
| 04/02/2009 | US20090085138 Glass cap molding package, manufacturing method thereof and camera module |
| 04/02/2009 | US20090085134 Wafer-level image sensor module, method of manufacturing the same, and camera module |
| 04/02/2009 | US20090085133 On Chip Antenna And Method Of Manufacturing The Same |
| 04/02/2009 | US20090085131 Semiconductor device and manufacturing method thereof |
| 04/02/2009 | US20090085130 Semiconductor device |
| 04/02/2009 | US20090085129 Defect-free source/drain extensions for mosfets having germanium based channel regions |
| 04/02/2009 | US20090085128 Semiconductor device and method for manufacturing same |
| 04/02/2009 | US20090085124 Semiconductor storage device and manufacturing method of the same |
| 04/02/2009 | US20090085123 Semiconductor device and method for fabricating the same |
| 04/02/2009 | US20090085122 Poly profile engineering to modulate spacer induced stress for device enhancement |