| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/09/2009 | US20090091035 Highly integrated and reliable DRAM and its manufacture |
| 04/09/2009 | US20090091033 Fabrication of metal oxide films |
| 04/09/2009 | US20090091030 Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device |
| 04/09/2009 | US20090091029 Semiconductor package having marking layer |
| 04/09/2009 | US20090091028 Semiconductor device and method of bump formation |
| 04/09/2009 | US20090091024 Stable Gold Bump Solder Connections |
| 04/09/2009 | US20090091023 Semiconductor Device Package |
| 04/09/2009 | US20090091022 Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device |
| 04/09/2009 | US20090091021 Semiconductor device and method of manufacturing the same |
| 04/09/2009 | US20090091018 Electronic Component Sealing Substrate, Electronic Component Sealing Substrate to be Divided Into a Plurality of Pieces, Electronic Apparatus Including Electronic Component Sealing Substrate, and Method for Producing Electronic Apparatus |
| 04/09/2009 | US20090091016 I/o pad structures for integrated circuit devices |
| 04/09/2009 | US20090091015 Stacked-type chip package structure and method of fabricating the same |
| 04/09/2009 | US20090091012 capable of bonding a semiconductor chip to a lead frame tightly at an adhesion temperature lower than that of the adhesion film of a traditional polyimide resin without generation of voids; reaction of 1,3-bis(3-aminophenoxy)benzene, for example, and an acid component |
| 04/09/2009 | US20090091010 Wireless semiconductor package for efficient heat dissipation |
| 04/09/2009 | US20090091009 Stackable integrated circuit package |
| 04/09/2009 | US20090091007 Semiconductor Device Having Grooved Leads to Confine Solder Wicking |
| 04/09/2009 | US20090091006 Dual Capillary IC Wirebonding |
| 04/09/2009 | US20090091005 Shielding structure for semiconductors and manufacturing method therefor |
| 04/09/2009 | US20090091002 Methods for producing improved epitaxial materials |
| 04/09/2009 | US20090091001 Crack resistant semiconductor package and method of fabricating the same |
| 04/09/2009 | US20090090998 Semiconductor device and manufacturing method thereof |
| 04/09/2009 | US20090090997 Solid electrolytic capacitor element and production method thereof |
| 04/09/2009 | US20090090996 Semiconductor device with contact stabilization between contact plugs and bit lines and method for manufacturing the same |
| 04/09/2009 | US20090090994 Electromigration fuse and method of fabricating same |
| 04/09/2009 | US20090090993 Single crystal fuse on air in bulk silicon |
| 04/09/2009 | US20090090992 Isolation trench structure for high electric strength |
| 04/09/2009 | US20090090990 Formation of nitrogen containing dielectric layers having an improved nitrogen distribution |
| 04/09/2009 | US20090090989 Image Sensor and Method of Manufacturing the Same |
| 04/09/2009 | US20090090987 Mems element, mems device and mems element manufacturing method |
| 04/09/2009 | US20090090986 Fully and uniformly silicided gate structure and method for forming same |
| 04/09/2009 | US20090090985 Semiconductor device and method for fabricating the same |
| 04/09/2009 | US20090090984 Novel Method to Increase Breakdown Voltage of Semiconductor Devices |
| 04/09/2009 | US20090090979 High performance mosfet |
| 04/09/2009 | US20090090978 Semiconductor device and method for fabricating the same |
| 04/09/2009 | US20090090977 Resistor and fet formed from the metal portion of a mosfet metal gate stack |
| 04/09/2009 | US20090090974 Dual stress liner structure having substantially planar interface between liners and related method |
| 04/09/2009 | US20090090973 Semiconductor device and method of manufacturing the same |
| 04/09/2009 | US20090090971 Mosfet devices and methods for making them |
| 04/09/2009 | US20090090969 Electronic device and method of biasing |
| 04/09/2009 | US20090090967 Mosfet active area and edge termination area charge balance |
| 04/09/2009 | US20090090966 High density fet with integrated schottky |
| 04/09/2009 | US20090090965 Non-volatile semiconductor storage device and method of manufacturing the same |
| 04/09/2009 | US20090090964 Semiconductor device and method of manufacturing the same |
| 04/09/2009 | US20090090963 Semiconductor memory device and method of manufacturing the same |
| 04/09/2009 | US20090090961 Non-Volatile Semiconductor Memory Device |
| 04/09/2009 | US20090090960 Non-volatile semiconductor storage device and method of manufacturing the same |
| 04/09/2009 | US20090090959 Non-volatile semiconductor storage device and method of manufacturing the same |
| 04/09/2009 | US20090090956 Flash Memory Device and Method of Manufacturing Flash Memory Device |
| 04/09/2009 | US20090090955 Elevated channel flash device and manufacturing method thereof |
| 04/09/2009 | US20090090954 Nonvolatile memory and manufacturing method thereof |
| 04/09/2009 | US20090090952 Plasma surface treatment for si and metal nanocrystal nucleation |
| 04/09/2009 | US20090090950 Semiconductor devices |
| 04/09/2009 | US20090090949 Semiconductor device and method of manufacturing the same |
| 04/09/2009 | US20090090948 Semiconductor device and a method of manufacturing the same |
| 04/09/2009 | US20090090947 Semiconductor device and method of manufacturing a semiconductor device |
| 04/09/2009 | US20090090945 Pixel with transfer gate with no isolation edge |
| 04/09/2009 | US20090090944 Image Sensor and Method of Fabricating the Same |
| 04/09/2009 | US20090090943 Solid-state imaging device and manufacturing method of the same |
| 04/09/2009 | US20090090942 Wiring structure, array substrate, display device having the same and method of manufacturing the same |
| 04/09/2009 | US20090090941 Semiconductor device and method of manufacturing the same |
| 04/09/2009 | US20090090938 Channel stress engineering using localized ion implantation induced gate electrode volumetric change |
| 04/09/2009 | US20090090937 Unit pixels, image sensor containing unit pixels, and method of fabricating unit pixels |
| 04/09/2009 | US20090090936 Electric field read/write head, method of manufacturing the same, and information storage device comprising electric field read/write head |
| 04/09/2009 | US20090090934 Field Effect Transistor and Method for Manufacturing the Same |
| 04/09/2009 | US20090090933 METHOD OF PRODUCING STRAINED Si-SOI SUBSTRATE AND STRAINED Si-SOI SUBSTRATE PRODUCED BY THE SAME |
| 04/09/2009 | US20090090931 Semiconductor light-emitting device and method of fabricating the same |
| 04/09/2009 | US20090090930 Epitaxial substrate and manufacturing method thereof and manufacturing method of light emitting diode apparatus |
| 04/09/2009 | US20090090929 Light-emitting diode chip and manufacturing method thereof |
| 04/09/2009 | US20090090924 Intermediate optical packages and systems comprising the same, and their uses |
| 04/09/2009 | US20090090923 Method for manufacturing a semiconductor light-emitting device and semiconductor light-emitting device |
| 04/09/2009 | US20090090922 Method of manufacturing gallium nitride-based compound semiconductor light-emitting device, gallium nitride-based compound semiconductor light-emitting device, and lamp |
| 04/09/2009 | US20090090919 Semiconductor device and method of producing the same |
| 04/09/2009 | US20090090918 Transparent nanocrystalline diamond contacts to wide bandgap semiconductor devices |
| 04/09/2009 | US20090090917 GaN single-crystal substrate and method for producing GaN single crystal |
| 04/09/2009 | US20090090916 Thin film transistor, display device having thin film transistor, and method for manufacturing the same |
| 04/09/2009 | US20090090914 Semiconductor thin film, method for producing the same, and thin film transistor |
| 04/09/2009 | US20090090913 Dual-gate memory device with channel crystallization for multiple levels per cell (mlc) |
| 04/09/2009 | US20090090911 Manufacturing thin film transistor array panels for flat panel displays |
| 04/09/2009 | US20090090910 Thin-film element, display device and memory cell using the thin-film element, and their fabrication methods |
| 04/09/2009 | US20090090909 Semiconductor device and manufacturing method thereof |
| 04/09/2009 | US20090090906 Organic thin film transistor device and manufacturing method therefor |
| 04/09/2009 | US20090090902 Optical devices using a penternary iii-v material system |
| 04/09/2009 | US20090090900 Optoelectronic Semiconductor Chip |
| 04/09/2009 | US20090090845 Method and apparatus providing shared pixel architecture |
| 04/09/2009 | US20090090695 Yttria insulator ring for use inside a plasma chamber |
| 04/09/2009 | US20090090653 Low cost wafer box improvements |
| 04/09/2009 | US20090090542 Multilayer printed wiring board |
| 04/09/2009 | US20090090541 Stacked semiconductor device and fabricating method thereof |
| 04/09/2009 | US20090090531 Micromechanical component having a cap having a closure |
| 04/09/2009 | US20090090467 Spin head |
| 04/09/2009 | US20090090397 Substrate processing apparatus and substrate processing method |
| 04/09/2009 | US20090090392 Method of cleaning a semiconductor wafer |
| 04/09/2009 | US20090090274 low dielectric material containing B,B',B''-tris(propylamino)borazine compound or polymer; diglyme or triglyme solvent; used to produce an interlayer dielectric film for semiconductor; spin coating |
| 04/09/2009 | DE202008016765U1 Formgebungsvorrichtung für Siliziumchip und deren Formteil Molding machine for silicon chip and their molding |
| 04/09/2009 | DE19956903B4 HF-Halbleiterbauelement und Verfahren zur Integration von HF-Dioden RF semiconductor device and method for the integration of RF diodes |
| 04/09/2009 | DE19932399B4 Verfahren, bei dem eine Halbleitervorrichtung hergestellt wird Method in which a semiconductor device is fabricated |
| 04/09/2009 | DE112007001134T5 Ausgespartes Austrittsarbeitsmetall in CMOS-Transistor-Gates Recessed workfunction metal CMOS transistor gates |
| 04/09/2009 | DE112007000964T5 Verfahren zur Herstellung einer Halbleiterkomponente mit einem Kondensator mit hoher Kapazität pro Flächeneinheit A method for fabricating a semiconductor component with a capacitor having a large capacitance per unit area |
| 04/09/2009 | DE112007000825T5 Verfahren zum Bonden eines Halbleitersubstrates an ein Metallsubstrat A method for bonding a semiconductor substrate to a metal substrate |
| 04/09/2009 | DE112006001771B4 SRAM-Bauelemente unter Verwendung von zugverspannten Verformungsschichten und zugehöriges Verfahren SRAM devices using tensile-deformation layers and associated method |