Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2009
04/09/2009US20090093908 Target Position detection apparatus for robot
04/09/2009US20090093192 Device for and method of polishing peripheral edge of semiconductor wafer
04/09/2009US20090093135 Semiconductor manufacturing apparatus and method for curing material with uv light
04/09/2009US20090093134 Semiconductor manufacturing apparatus and method for curing materials with uv light
04/09/2009US20090093133 Self-assembled sidewall spacer
04/09/2009US20090093132 Methods to obtain low k dielectric barrier with superior etch resistivity
04/09/2009US20090093131 Low-temperature catalyzed formation of segmented nanowire of dielectric material
04/09/2009US20090093130 Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor device
04/09/2009US20090093129 Gas Baffle and Distributor for Semiconductor Processing Chamber
04/09/2009US20090093128 Methods for high temperature deposition of an amorphous carbon layer
04/09/2009US20090093127 Treatment of a Substrate with a Liquid Medium
04/09/2009US20090093126 Method of and an apparatus for processing a substrate
04/09/2009US20090093125 Chemistry and compositions for manufacturing integrated circuits
04/09/2009US20090093124 Method of manufacturing semiconductor device
04/09/2009US20090093123 Spin head, chuck pin used in the spin head, and method for treating a substrate with the spin head
04/09/2009US20090093122 Method For Producing Group III-V Nitride Semiconductor Substrate
04/09/2009US20090093121 Method for Fabricating a Fine Pattern
04/09/2009US20090093120 Hole pattern forming method and semiconductor device manufacturing method
04/09/2009US20090093119 Method of fabricating semiconductor device
04/09/2009US20090093118 Polishing composition
04/09/2009US20090093117 Method of manufacturing substrate
04/09/2009US20090093116 Method for forming Zener Zap Diodes and Ohmic Contacts in the Same Integrated Circuit
04/09/2009US20090093115 Method for forming metal line of semiconductor device by annealing aluminum and copper layers together
04/09/2009US20090093114 Method of forming a dual-damascene structure using an underlayer
04/09/2009US20090093113 Electrochemical etching of through silicon vias
04/09/2009US20090093112 Methods and apparatus of creating airgap in dielectric layers for the reduction of rc delay
04/09/2009US20090093111 Sprocket opening alignment process and apparatus for multilayer solder decal
04/09/2009US20090093110 BGA package having half-etched bonding pad and cut plating line and method of fabricating same
04/09/2009US20090093109 Method for producing a semiconductor device using a solder alloy
04/09/2009US20090093108 Semiconductor fabrication process including silicide stringer removal processing
04/09/2009US20090093107 Semiconductor substrate cleaning methods, and methods of manufacture using same
04/09/2009US20090093106 Bonded soi substrate, and method for manufacturing the same
04/09/2009US20090093105 Particle deposition apparatus, particle deposition method, and manufacturing method of light-emitting device
04/09/2009US20090093104 Manufacturing method for semiconductor chips
04/09/2009US20090093103 Method and device for controlled cleaving process
04/09/2009US20090093102 Method for manufacturing semiconductor substrate
04/09/2009US20090093101 Method for Manufacturing a Transistor of a Semiconductor Memory Device
04/09/2009US20090093100 Method for forming an air gap in multilevel interconnect structure
04/09/2009US20090093099 Layout method and layout apparatus for semiconductor integrated circuit
04/09/2009US20090093098 Manufacturing method of semiconductor device having trench isolation
04/09/2009US20090093097 Method for Manufacturing Dual Gate in Semiconductor Device
04/09/2009US20090093096 Semiconductor device and manufacturing method thereof
04/09/2009US20090093095 Method to improve transistor tox using si recessing with no additional masking steps
04/09/2009US20090093094 Selective Formation of Silicon Carbon Epitaxial Layer
04/09/2009US20090093093 Method of fabricating thin film transistor
04/09/2009US20090093092 Soi substrate contact with extended silicide area
04/09/2009US20090093091 Method of fabricating semiconductor package
04/09/2009US20090093090 Method for producing a power semiconductor module comprising surface-mountable flat external contacts
04/09/2009US20090093089 Method for fabricating heat dissipating semiconductor package
04/09/2009US20090093088 Roll-on encapsulation method for semiconductor packages
04/09/2009US20090093087 Method of manufacturing semiconductor device
04/09/2009US20090093086 Lead forming apparatus and method of fabricating semiconductor device
04/09/2009US20090093085 Carrier Structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device
04/09/2009US20090093084 Die offset die to bonding
04/09/2009US20090093083 Method of depositing chalcogenide film for phase-change memory
04/09/2009US20090093081 Process of phosphorus diffusion for manufacturing solar cell
04/09/2009US20090093080 Solar cells and methods and apparatuses for forming the same including i-layer and n-layer chamber cleaning
04/09/2009US20090093079 Method of producing an asymmetric architecture semi-conductor device
04/09/2009US20090093078 System and Method for High Temperature Compact Thermoelectric Generator (TEG) Device Construction
04/09/2009US20090093077 METHOD OF MANUFACTURING GaN SUBSTRATE, METHOD OF MANUFACTURING EPITAXIALWAFER, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND EPITAXIALWAFER
04/09/2009US20090093076 Method for manufacturing monolithic semiconductor laser
04/09/2009US20090093075 Method of separating semiconductor dies
04/09/2009US20090093074 Light Emission From Silicon-Based Nanocrystals By Sequential Thermal Annealing Approaches
04/09/2009US20090093073 Method of making circuitized substrate with internal optical pathway using photolithography
04/09/2009US20090093072 Electronic assemblies with hot spot cooling and methods relating thereto
04/09/2009US20090093071 Thermal treatment apparatus, thermal treatment method and method of manufacturing semiconductor device
04/09/2009US20090093070 Capacitor, method of manufacturing the same, method of manufacturing ferroelectric memory device, method of manufacturing actuator, and method of manufacturing liquid jet head
04/09/2009US20090092932 Mixture of photomasks; controlling incline of pattern; lithography; phase shifting; removal of mask by etching
04/09/2009US20090092905 Photomask defect correction device and photomask defect correction method
04/09/2009US20090092748 Electronic device packaging and curable resin composition
04/09/2009US20090092472 Apparatus and system for handling a glass sheet
04/09/2009US20090092470 End effector with sensing capabilities
04/09/2009US20090092469 Substrate processing unit, substrate transfer method, substrate cleansing process unit, and substrate plating apparatus
04/09/2009US20090092468 Inlet port mechanism for introducing object and treatment system
04/09/2009US20090092467 Stage apparatus
04/09/2009US20090092466 Multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same
04/09/2009US20090092166 Nitride semiconductor light-emitting device
04/09/2009US20090092165 Laser diode having nano patterns and method of fabricating the same
04/09/2009US20090092164 Optical semiconductor device and method of manufacturing same
04/09/2009US20090092163 Laser diode and method of manufacturing the same
04/09/2009US20090092162 Means for improved implementation of laser diodes and laser diode arrays
04/09/2009US20090092033 Electric field sensor having vertical structure, fabrication method thereof, and storage unit using the same
04/09/2009US20090091976 Integrated Circuit with Switching Unit for Memory Cell Coupling, and Method for Producing an Integrated Circuit for Memory Cell Coupling
04/09/2009US20090091962 Multi-chip memory device with stacked memory chips, method of stacking memory chips, and method of controlling operation of multi-chip package memory
04/09/2009US20090091752 Apparatus and a method for inspection of a mask blank, a method for manufacturing a reflective exposure mask, a method for reflective exposure, and a method for manufacturing semiconductor integrated circuits
04/09/2009US20090091750 Method For Inspecting Pattern Defect And Device For Realizing The Same
04/09/2009US20090091736 Calculation method, generation method, program, exposure method, and mask fabrication method
04/09/2009US20090091735 Illumination optical system and exposure apparatus having the same
04/09/2009US20090091678 Array substrate for a liquid crystal display device and manufacturing method of the same
04/09/2009US20090091677 Liquid crystal display and method for manufacturing the same
04/09/2009US20090091675 Liquid crystal display device and manufacturing method thereof
04/09/2009US20090091600 Micro-fluid ejection head and stress relieved orifice plate therefor
04/09/2009US20090091352 Nanotube-based switching elements with multiple controls
04/09/2009US20090091245 Method for manufacturing an oled, an intermediate product for manufacturing an oled, as well as an oled
04/09/2009US20090091044 Dicing die attachment film and method for packaging semiconductor using same
04/09/2009US20090091042 Integrated circuit package system including die having relieved active region
04/09/2009US20090091041 Stacked type chip package structure and method of fabricating the same
04/09/2009US20090091039 Semiconductor device, method of manufacturing the same, and semiconductor substrate
04/09/2009US20090091038 Air gap for interconnect application
04/09/2009US20090091037 Methods for Fabricating Contacts to Pillar Structures in Integrated Circuits