| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/09/2009 | DE10353773B4 Verfahren zum Ausbilden eines Gatesockels eines vertikalen Gates A method for forming a gate of a vertical base Gates |
| 04/09/2009 | DE10310161B4 Monolithisch integrierte Schaltkreis-Anordnung The monolithic integrated circuit arrangement |
| 04/09/2009 | DE10230164B4 Verfahren zur Herstellung eines Körpers für einen Induktionsmagneten zur Verwendung bei der Erzeugung eines hoch-dichten Plasmas sowie Halbleiterherstellungsgrät, das einen nach diesem Verfahren hergestellten Induktionsmagneten verwendet A method of producing a body for an induction magnet for use in generating a high-density plasma and Halbleiterherstellungsgrät that uses an induction magnet manufactured according to this method |
| 04/09/2009 | DE102008048890A1 Flüssigkeitsbearbeitungsvorrichtung und Bearbeitungsflüssigkeitszuführverfahren Liquid processing apparatus and Bearbeitungsflüssigkeitszuführverfahren |
| 04/09/2009 | DE102008047916A1 Halbleiterbauelement mit Mehrfachschichtmetallisierung A semiconductor device comprising Mehrfachschichtmetallisierung |
| 04/09/2009 | DE102008047829A1 Verfahren zum Herstellen eines Halbleiterelements in einem Substrat und ein Halbleiterelement A method of fabricating a semiconductor element in a substrate and a semiconductor element |
| 04/09/2009 | DE102008046761A1 Halbleiterbauelement mit leitfähiger Verbindungsanordnung Semiconductor device with conductive connection arrangement |
| 04/09/2009 | DE102008046260A1 Bildsensor und Verfahren zu dessen Herstellung Image sensor and method for its production |
| 04/09/2009 | DE102008045735A1 Gestapelte Halbleiterchips Stacked semiconductor chips |
| 04/09/2009 | DE102008045216A1 Method for in-situ end point detection during chemical-mechanical polishing of semiconductor material layers of semiconductor wafer using polishing machine, involves making potential change to occur during polishing |
| 04/09/2009 | DE102008045023A1 Verfahren zum Ausbilden einer Zwischenisolierschicht in einem Halbleiterbauelement A method of forming an interlayer insulating layer in a semiconductor device |
| 04/09/2009 | DE102008040900A1 Verbindungen mittels Chip-Durchkontaktierungen für gestapelte integrierte Schaltkreisstrukturen Compounds by means of chip-vias for stacked integrated circuit structures |
| 04/09/2009 | DE102008039732A1 Halbleiter-Herstellungsprozess-Ladungsschutz-Schaltkreise Semiconductor manufacturing process overload protection circuits |
| 04/09/2009 | DE102007047680A1 Handhabungsvorrichtung für elektronische Bauelemente, insbesondere IC's, mit temperierbaren Umlaufeinheiten Handling apparatus for electronic components, especially ICs with temperature-bearing units |
| 04/09/2009 | DE102007047186A1 Aufnahmevorrichtung zur Aufnahme eines Objektes Receiving device for receiving an object |
| 04/09/2009 | DE102007046901A1 Production of electrically conductive or heat-conductive component for producing metallic contact between two elements e.g. cooling bodies or solar cells, comprises forming elemental silver from silver compound between contact areas |
| 04/09/2009 | DE102007046851A1 Halbleiterstruktur mit einem elektrisch leitfähigen Strukturelement und Verfahren zum Ausbilden einer Halbleiterstruktur Semiconductor structure having an electrically conductive structural member and method of forming a semiconductor structure |
| 04/09/2009 | DE102007046847A1 Technik zum Kompensieren einer Differenz im Abscheideverhalten in einem dielektrischen Zwischenschichtmaterial Technique for compensating a difference in the precipitation behavior in an interlayer dielectric material |
| 04/09/2009 | DE102007046846A1 Seitenwandschutzschicht Sidewall protection layer |
| 04/09/2009 | DE102007046443A1 Verfahren zur Messnadelüberwachung im Prüfbetrieb A method for measuring needle monitoring in test |
| 04/09/2009 | DE102007046039A1 Integrierte Schaltung mit Strukturen, die in verschiedenen Dichten angeordnet sind, und Verfahren zur Herstellung einer integrierten Schaltung An integrated circuit having structures that are arranged in various densities, and methods of making an integrated circuit |
| 04/09/2009 | DE102007045812A1 Verfahren zum Herstellen einer Speicherzelle, Speicherzelle sowie integrierte Schaltung A method for fabricating a memory cell, memory cell and integrated circuit |
| 04/09/2009 | DE102007045455A1 Verfahren zur Herstellung von Wafern aus Ingots A process for the production of wafers from ingots |
| 04/09/2009 | DE102007045058A1 Integrated circuit for use in flash memory i.e. NAND-type flash memory, of cellular telephone, has gate stacks coupled to other gate stacks, where each gate stack is provided with control electrode that includes layer |
| 04/09/2009 | DE102007042779A1 Kalibrationssubstrat und -verfahren Calibration substrate and method |
| 04/09/2009 | DE102007029820B4 Verfahren zur Aufbringung metallischer Stützstrukturen auf Elektroden von Leuchtdioden aus organischen Materialien A method of applying metal support structures on electrodes of light emitting diodes made of organic materials |
| 04/09/2009 | DE102007025658B4 Bonddrahtanordnung und Verfahren zur Herstellung einer Bonddrahtanordnung Bond wire assembly and method of manufacturing a bonding wire arrangement |
| 04/09/2009 | DE102007022338A1 Leistungshalbleiterbauelement mit Metallkontaktschicht sowie Herstellungsverfahren hierzu Power semiconductor component with metal contact layer and manufacturing method therefor |
| 04/09/2009 | DE102007005161B4 Verfahren zur Metallisierung von Substraten Process for the metallization of substrates |
| 04/09/2009 | DE102006012155B4 Verfahren zum Herstellen eines Halbleiterbauelements A method of manufacturing a semiconductor device |
| 04/09/2009 | DE102005004707B4 Verfahren zur Herstellung integrierter Schaltkreise mit Silizium-Germanium-Heterobipolartransistoren A process for manufacturing integrated circuits with silicon-germanium heterobipolar |
| 04/09/2009 | DE102005000734B4 Verfahren zum Einstellen einer Abweichung einer kritischen Abmessung von Mustern Method for adjusting a deviation of a critical dimension of patterns |
| 04/09/2009 | DE102004055213B4 Verfahren zur Herstellung einer integrierten Schaltung auf einem Halbleiterplättchen A method of fabricating an integrated circuit on a semiconductor chip |
| 04/09/2009 | DE102004036142B4 Halbleiterbauelement mit einer Metallisierung mit mehreren durch zumindest eine Barriereschicht getrennten Metallisierungsschichten sowie Verfahren zu dessen Herstellung A semiconductor device with a plurality of metallization with through at least one barrier layer separate metallization layers as well as methods for its preparation |
| 04/09/2009 | DE10161129B4 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation |
| 04/09/2009 | DE10143919B4 Elekrisch leitende Paste und Verfahren zur Herstellung eines mehrlagigen keramischen elektronischen Bauteils unter verwendung dieser Paste By electricity-conducting paste and method of manufacturing a multilayer ceramic electronic component using this paste |
| 04/09/2009 | DE10130713B4 Halbleiterchip mit Sensorelementen und dynamischer Halbleitersensorchip und Verfahren zu deren Herstellung Semiconductor chip having sensing elements and dynamic semiconductor sensor chip and methods of manufacture |
| 04/09/2009 | DE10085347B4 Verwendung einer MOS-Struktur als Entstörkondensator bei dünnen Gate-Oxiden Use of a MOS structure and interference suppression capacitor with thin gate oxides |
| 04/09/2009 | DE10023539B4 Verfahren zum Herstellen eines Bauteils A method for manufacturing a component |
| 04/09/2009 | CA2701412A1 Profile engineered thin film devices and structures |
| 04/09/2009 | CA2672177A1 Gan epitaxial substrate, semiconductor device and methods for manufacturing gan epitaxial substrate and semiconductor device |
| 04/08/2009 | EP2045888A1 Optical fiber amplifier, light source device, exposure device, object inspection device, and treatment device |
| 04/08/2009 | EP2045844A1 Semiconductor Module |
| 04/08/2009 | EP2045839A1 Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device |
| 04/08/2009 | EP2045838A1 Method for producing zinc oxide semiconductor crystal |
| 04/08/2009 | EP2045837A1 Selective formation of a compound comprising a semiconductor material and a metal material in a substrate, through a layer of germanium oxide |
| 04/08/2009 | EP2045836A1 Method for manufacturing semiconductor substrate |
| 04/08/2009 | EP2045835A1 Method for reducing dislocation in group iii nitride crystal and substrate for epitaxial growth |
| 04/08/2009 | EP2045834A2 Heating apparatus |
| 04/08/2009 | EP2045663A2 Calculation method, generation method, program, exposure method, and mask fabrication method |
| 04/08/2009 | EP2045661A1 Positive resist composition and method of forming resist pattern |
| 04/08/2009 | EP2045659A1 Method of nano-patterning using surface plasmon effect and method of manufacturing nano-imprint master and discrete track magnetic recording media using the nano-patterning method |
| 04/08/2009 | EP2045645A1 Micro actuator, optical unit, exposure device, and device manufacturing method |
| 04/08/2009 | EP2045318A1 Cleaning agent for semiconductor device and cleaning method using the same |
| 04/08/2009 | EP2045307A1 Polishing composition |
| 04/08/2009 | EP2045049A2 Target position detection apparatus for robot |
| 04/08/2009 | EP2045034A1 Flip-chip mounting apparatus |
| 04/08/2009 | EP2044626A1 Silicon level solution for mitigation of substrate noise |
| 04/08/2009 | EP2044625A2 Dielectric deposition and etch back processes for bottom up gapfill |
| 04/08/2009 | EP2044624A1 Isolation structures for integrated circuits and modular methods of forming the same |
| 04/08/2009 | EP2044623A2 Method and system for isolated and discretized process sequence integration |
| 04/08/2009 | EP2044622A2 High-voltage bipolar-cmos-dmos integrated circuit devices and modular methods of forming the same |
| 04/08/2009 | EP2044620A2 Ald of metal silicate films |
| 04/08/2009 | EP2044619A2 Double gate transistor and method of manufacturing same |
| 04/08/2009 | EP2044618A2 Batch processing platform for ald and cvd |
| 04/08/2009 | EP2044601A2 Thermally imageable dielectric layers, thermal transfer donors and receivers |
| 04/08/2009 | EP2043809A2 System and method for laser processing at non-constant velocities |
| 04/08/2009 | EP2001044A9 Plasma generating apparatus and plasma generating method |
| 04/08/2009 | EP1972002B1 Simplified method of producing an epitaxially grown structure |
| 04/08/2009 | EP1829114A4 Reduced channel pitch in semiconductor device |
| 04/08/2009 | EP1779419A4 Direct liquid injection system and method for forming multi-component dielectric films |
| 04/08/2009 | EP1656671A4 Spin coating apparatus and coated substrate manufactured using the same |
| 04/08/2009 | EP1632110A4 Retention mechanism for heating coil of high temperature diffusion furnace |
| 04/08/2009 | EP1598862B1 Semiconductor device and radiation detector employing it |
| 04/08/2009 | EP1583998B1 Method of forming resist pattern, use of a positive resist composition, and layered product |
| 04/08/2009 | EP1547152B1 A cmos aps with stacked avalanche multiplication layer and low voltage readout electronics |
| 04/08/2009 | EP1359621B1 Magnetoresistance storage element |
| 04/08/2009 | EP1014433B1 Dry etching gas |
| 04/08/2009 | CN201219104Y Square and circular piece-compatible mechanical piece clamping apparatus |
| 04/08/2009 | CN201219103Y 酸槽温度控制系统 Acid tank temperature control system |
| 04/08/2009 | CN201218899Y Lifting pin used for plasma reaction chamber |
| 04/08/2009 | CN201217686Y Ionic beam emission source capable of emitting singular ion energy |
| 04/08/2009 | CN101405876A Group III nitride semiconductor light-emitting device, method for manufacturing group III nitride semiconductor light-emitting device, and lamp |
| 04/08/2009 | CN101405867A Modular bipolar-CMOS-DMOS analog integrated circuit and power transistor technology |
| 04/08/2009 | CN101405865A Strained silicon with elastic edge relaxation |
| 04/08/2009 | CN101405863A Semiconductor devices and electrical parts manufacturing using metal coated wires |
| 04/08/2009 | CN101405862A Semiconductor device having post-mold nickel/palladium/gold plated leads |
| 04/08/2009 | CN101405858A Method to produce transistor having reduced gate height |
| 04/08/2009 | CN101405857A Apparatus and method for carrying substrates |
| 04/08/2009 | CN101405856A Octagon transfer chamber |
| 04/08/2009 | CN101405855A Analyzing method and analyzing apparatus |
| 04/08/2009 | CN101405854A Resin sealing/molding apparatus |
| 04/08/2009 | CN101405853A Electronic part mounting device and electronic part mounting method |
| 04/08/2009 | CN101405852A Interconnection of electronic devices with raised leads |
| 04/08/2009 | CN101405851A Method of forming a semiconductor device and structure thereof |
| 04/08/2009 | CN101405850A Semiconductor field effect transistor, and method for manufacturing same |
| 04/08/2009 | CN101405849A Stacked non-volatile memory with silicon carbide-based amorphous silicon thin film transistors |
| 04/08/2009 | CN101405848A Transistor device having an increased threshold stability without drive current degradation |
| 04/08/2009 | CN101405847A Method for treating an oxygen-containing semiconductor wafer, and semiconductor component |
| 04/08/2009 | CN101405846A Method of plasma oxidation processing |