Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2009
04/08/2009CN100477276C Film transistor for driving organic light-emitting-diode and producing method thereof
04/08/2009CN100477275C Body-contacting SOI transistor and method for fabrication thereof
04/08/2009CN100477274C Thin film transistor and method for fabricating the same
04/08/2009CN100477273C Thin film transistor substrate and method of manufacture
04/08/2009CN100477272C TFT array substrate, liquid crystal display device, manufacturing methods of TFT array substrate and liquid crystal display device, and electronic device
04/08/2009CN100477271C Silicon-on-insulator field effect transistor element having a recombination region and method of forming same
04/08/2009CN100477270C VDMOS and IGBT power unit using the PSG doping technology and making process thereof
04/08/2009CN100477269C Semiconductor device and making method thereof
04/08/2009CN100477267C Iusulated gate semiconductor device and method for producing the same
04/08/2009CN100477266C Non-volatile memory devices including barrier layers and methods of manufacturing the same
04/08/2009CN100477265C Method for fabricating field effect transistor and field effect transistor manufactured with the method
04/08/2009CN100477264C Transistor and method for manufacturing the same
04/08/2009CN100477263C Super-junction semiconductor element and method for fabricating the same
04/08/2009CN100477262C Metal oxide semiconductor transistor with 3-D channels and making method thereof
04/08/2009CN100477261C Semiconductor device
04/08/2009CN100477259C Vertical semiconductor device and manufacturing method thereof
04/08/2009CN100477258C Double-silicon-layer fin field effect transistor for chemical mechanical polishing planarization
04/08/2009CN100477257C Silicon carbide semiconductor device and method for manufacturing the same
04/08/2009CN100477255C Trench MOSFET with structure having low gate charge
04/08/2009CN100477254C High aspect-ratio PN-junction and method for manufacturing the same
04/08/2009CN100477253C Dielectric-separation type semiconductor device and manufacturing method thereof
04/08/2009CN100477252C Organic electroluminescent device and manufacture method thereof
04/08/2009CN100477251C Method for manufacturing organic el element
04/08/2009CN100477250C Electro-optical device and an electronic apparatus
04/08/2009CN100477248C LED array microdisplay device and manufacturing method thereof
04/08/2009CN100477246C Image sensor and production method thereof
04/08/2009CN100477245C CMOS image sensor and method for manufacturing the same
04/08/2009CN100477241C Grounded gate and isolation techniques for reducing dark current in CMOS image sensors
04/08/2009CN100477240C Semiconductor device and method for making same
04/08/2009CN100477238C 图像传感器以及图像传感器模块 An image sensor and an image sensor module
04/08/2009CN100477237C Electro-optical device and manufacturing method thereof, electronic apparatus, and capacitor
04/08/2009CN100477236C Semiconductor device and manufacturing method thereof
04/08/2009CN100477235C Method for forming semiconductor device
04/08/2009CN100477232C Non-volatile storage, producing method and operation method thereof
04/08/2009CN100477230C Nonvolatile memory device and method for fabricating the same
04/08/2009CN100477229C Multi-bit non-volatile memory device, method of operating the same, and method of manufacturing the same
04/08/2009CN100477228C Semiconductor device and method for fabricating the same
04/08/2009CN100477227C Semiconductor memory device and method for fabricating the same
04/08/2009CN100477224C Semiconductor structure and manufacturing method thereof
04/08/2009CN100477223C Semiconductor device
04/08/2009CN100477220C Semiconductor structure
04/08/2009CN100477219C Semiconductor structure of high voltage side driver and manufacturing method thereof
04/08/2009CN100477218C Semiconductor structure of high-pressure side driver and manufacturing method thereof
04/08/2009CN100477217C Plasma damage protection circuit
04/08/2009CN100477216C Integrated small thermal sediment system and making method thereof
04/08/2009CN100477214C Capacitor structure of an integrated circuit and method for manufacturing same
04/08/2009CN100477208C Method for manufacturing a semiconductor device
04/08/2009CN100477205C Transistors for electrostatic discharge protection and method for forming two transistors close to each other
04/08/2009CN100477204C Wafer with optical control modules in IC fields
04/08/2009CN100477203C Offset dependent resistor for measuring misalignment of stitched masks
04/08/2009CN100477202C Electrically programmable fuse structure and manufacturing method thereof
04/08/2009CN100477201C Semiconductor structure and forming method thereof
04/08/2009CN100477200C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
04/08/2009CN100477199C Semiconductor package with lead directly adhered to chip and producing method thereof
04/08/2009CN100477198C Chip packaging structure and manufacturing method thereof
04/08/2009CN100477194C Circuit board, manufacturing method thereof and semiconductor package and manufacturing method thereof
04/08/2009CN100477193C Multilayer wiring board and manufacturing method thereof
04/08/2009CN100477192C Semiconductor device and manufacturing method for the same
04/08/2009CN100477188C Display device installed with driving element
04/08/2009CN100477187C Semiconductor chip, semiconductor device, and method for manufacturing semiconductor device
04/08/2009CN100477186C High frequency integrated circuit (HFIC) microsystem assembly and method for fabricating the same
04/08/2009CN100477184C Semiconductor chip having polished and ground bottom surface portions
04/08/2009CN100477179C Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulation
04/08/2009CN100477177C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
04/08/2009CN100477176C Integrated circuit package and assembling method thereof
04/08/2009CN100477175C Semiconductor structure and manufacturing method thereof
04/08/2009CN100477174C Electronic device and method for fabricating the same
04/08/2009CN100477173C Optical device and method for fabricating the same
04/08/2009CN100477172C Substrate manufacturing method and substrate washing device
04/08/2009CN100477171C Method for manufacturing thin film transistor display array with dual-layer metal line
04/08/2009CN100477170C Method of manufacturing electro-optical device
04/08/2009CN100477169C Method for manufacturing nand flash memory device
04/08/2009CN100477168C Method and apparatus for improving stability of a 6T CMOS SRAM cell
04/08/2009CN100477167C Method for forming gate dielectric layers
04/08/2009CN100477166C Processing method of integrated circuit and method for forming metal-insulator-metal capacitor
04/08/2009CN100477165C Method for making the organic electronic device
04/08/2009CN100477164C Method for forming piezo-resistance device and for forming circuit layout
04/08/2009CN100477163C High-voltage integrated circuit and method for manufacturing the same
04/08/2009CN100477162C Wafer cutting method
04/08/2009CN100477161C Method for cutting integrated circuit chip from wafer
04/08/2009CN100477160C Process for producing semiconductor integrated circuit device
04/08/2009CN100477159C Method for forming storagenonode contact plug in semiconductor device
04/08/2009CN100477158C Method for fabricating semiconductor device and semiconductor device thereof
04/08/2009CN100477157C Method for forming electrical connections for semiconductor constructions
04/08/2009CN100477156C Process for manufacturing a contact plug on a region of an integrated circuit, in particular on the electrodes of a transistor
04/08/2009CN100477155C Method for manufacturing semiconductor device having multilevel wiring
04/08/2009CN100477154C Method for manufacturing isolation structure of shallow groove
04/08/2009CN100477153C Shallow trench isolation method and structure
04/08/2009CN100477152C Method for manufacturing a multilayer structure made from semiconducting materials
04/08/2009CN100477151C Trench isolation technology and method
04/08/2009CN100477150C Method for fabricating a structure comprising a thin semiconductor layer, intermediate structure obtained and application of the method
04/08/2009CN100477149C Method for reducing electric leakage of transistor in active zone edge junction
04/08/2009CN100477148C Method for manufacturing device isolation film of semiconductor device
04/08/2009CN100477147C Substrate table and substrate processing apparatus
04/08/2009CN100477146C Mounting apparatus
04/08/2009CN100477145C Electrostatic absorption electrode and treating apparatus
04/08/2009CN100477144C Measurement method for low-dielectric-constant material
04/08/2009CN100477143C Wafer chuck
04/08/2009CN100477142C Method and apparatus for inspecting semiconductor wafer
04/08/2009CN100477141C Semiconductor package device and method of formation and testing