Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2009
04/02/2009WO2007001100A9 Multiple fluid supplying apparatus for carrier of semiconductor wafer polishing system
04/02/2009WO2006137878A3 Flow method and reactor for manufacturing nanocrystals
04/02/2009WO2006058262A3 Semiconductor integrated injection logic device and method
04/02/2009WO2006058034A3 Molecular self-assembly in substrate processing
04/02/2009WO2006042231A3 Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby
04/02/2009WO2006036334A3 Programming and erasing structure for a floating gate memory cell and method of making
04/02/2009WO2006023263A3 Atmospheric pressure chemical vapor deposition
04/02/2009WO2006023262A3 Atmospheric pressure chemical vapor deposition
04/02/2009WO2006007336A3 Atmospheric glow discharge with concurrent coating deposition
04/02/2009WO2005118914A3 Substrate support system and method
04/02/2009WO2005089440A3 Multiple dielectric finfet structure and method
04/02/2009WO2005048670A3 Method for verifying hairline cracks in a soldered joint between a component and a printed circuit board
04/02/2009WO2005048307A3 Flip chip interconnection pad layout
04/02/2009WO2005038863A3 Method and system for treating a dielectric film
04/02/2009WO2005029548A3 System and process for providing multiple beam sequential lateral solidification
04/02/2009WO2005020648A3 Copper-faced modules, imprinted copper circuits, and their application to suptercomputers
04/02/2009WO2005017957A3 Nanowire array and nanowire solar cells and methods for forming the same
04/02/2009WO2004095532A3 A barrier layer for a processing element and a method of forming the same
04/02/2009US20090089727 Method for dimension conversion difference prediction, method for manufacturing photomask, method for manufacturing electronic component, and program for dimension conversion difference prediction
04/02/2009US20090088997 Data processing system
04/02/2009US20090088002 Method of fabricating a nitrogenated silicon oxide layer and mos device having same
04/02/2009US20090088001 Substrate processing apparatus and manufacturing method of semiconductor device
04/02/2009US20090088000 Method for growing an oxynitride film on a substrate
04/02/2009US20090087999 Technique for compensating for a difference in deposition behavior in an interlayer dielectric material
04/02/2009US20090087998 Diffusion barrier layer and method for manufacturing a diffusion barrier layer
04/02/2009US20090087997 Passivation film and method of forming the same
04/02/2009US20090087996 Line width roughness control with arc layer open
04/02/2009US20090087995 Method of substrate treatment, process for producing semiconductor device, substrate treating apparatus, and recording medium
04/02/2009US20090087994 Method of forming fine patterns and manufacturing semiconductor light emitting device using the same
04/02/2009US20090087993 Methods and apparatus for cost-effectively increasing feature density using a mask shrinking process with double patterning
04/02/2009US20090087992 Method of minimizing via sidewall damages during dual damascene trench reactive ion etching in a via first scheme
04/02/2009US20090087991 Manufacturing method, manufacturing apparatus, control program and program recording medium of semicontructor device
04/02/2009US20090087990 Manufacturing method, manufacturing apparatus, control program and program recording medium of semiconductor device
04/02/2009US20090087989 Polishing liquid and polishing method using the same
04/02/2009US20090087988 Polishing liquid and polishing method
04/02/2009US20090087987 Method of making a semiconductor device having improved contacts
04/02/2009US20090087986 Semiconductor devices using fine patterns and methods of forming fine patterns
04/02/2009US20090087985 Selective formation of a compound comprising a semi-conducting material and a metallic material in a substrate through a germanium oxide layer
04/02/2009US20090087984 Forming method of electrode and manufacturing method of semiconductor device
04/02/2009US20090087983 Aluminum contact integration on cobalt silicide junction
04/02/2009US20090087982 Selective ruthenium deposition on copper materials
04/02/2009US20090087981 Void-free copper filling of recessed features for semiconductor devices
04/02/2009US20090087980 Methods of low-k dielectric and metal process integration
04/02/2009US20090087979 Dual damascene with amorphous carbon for 3d deep via/trench application
04/02/2009US20090087978 Interconnect manufacturing process
04/02/2009US20090087977 Low temperature conformal oxide formation and applications
04/02/2009US20090087976 Conductive Spacers Extended Floating Gates
04/02/2009US20090087975 Method for manufacturing a memory
04/02/2009US20090087974 Method of forming high-k gate electrode structures after transistor fabrication
04/02/2009US20090087973 Retention improvement in dual-gate memory
04/02/2009US20090087972 Formation of carbon and semiconductor nanomaterials using molecular assemblies
04/02/2009US20090087971 Method for fabricating semiconductor devices with reduced junction diffusion
04/02/2009US20090087970 Method of producing a dopant gas species
04/02/2009US20090087969 Method to improve a copper/dielectric interface in semiconductor devices
04/02/2009US20090087968 Method for fabricating fine pattern in semiconductor device
04/02/2009US20090087967 Precursors and processes for low temperature selective epitaxial growth
04/02/2009US20090087966 Method for manufacturing semiconductor device
04/02/2009US20090087965 Structure and method for manufacturing phase change memories
04/02/2009US20090087964 Manufacturing Method of Semiconductor Device and Substrate Processing Apparatus
04/02/2009US20090087963 Method for reducing pillar structure dimensions of a semiconductor device
04/02/2009US20090087962 Method of fabricating semiconductor device having alignment key and semiconductor device fabricated thereby
04/02/2009US20090087961 Process for fabricating semiconductor structures useful for the production of semiconductor-on-insulator substrates, and its applications
04/02/2009US20090087960 Method for fabricating recess gate in semiconductor device
04/02/2009US20090087959 Method for forming a pattern of a semiconductor device
04/02/2009US20090087958 Semiconductor device and manufacturing method thereof
04/02/2009US20090087957 Method of fabricating semiconductor device
04/02/2009US20090087956 Dummy Contact Fill to Improve Post Contact Chemical Mechanical Polish Topography
04/02/2009US20090087955 Method for removing hard masks on gates in semiconductor manufacturing process
04/02/2009US20090087954 Method for fabricating pixel structure
04/02/2009US20090087953 Manufacturing process of leadframe-based BGA packages
04/02/2009US20090087952 Void free soldering semiconductor chip attachment method for wafer scale chip size
04/02/2009US20090087951 Method of manufacturing wafer level package
04/02/2009US20090087950 Wafer packaging method
04/02/2009US20090087949 Method of Making a Microelectronic Package Using an IHS Stiffener
04/02/2009US20090087947 Flip chip package process
04/02/2009US20090087946 Structure and method for thin single or multichip semiconductor qfn packages
04/02/2009US20090087944 Electronic devices with hybrid high-k dielectric and fabrication methods thereof
04/02/2009US20090087943 Method for forming large grain polysilicon thin film material
04/02/2009US20090087942 Manufacture of Photovoltaic Devices
04/02/2009US20090087938 Method for Manufacturing Microdevices or Integrated Circuits on Continuous Sheets
04/02/2009US20090087937 Method for manufacturing nitride based single crystal substrate and method for manufacturing nitride based light emitting diode using the same
04/02/2009US20090087936 Deposition method of iii group nitride compound semiconductor laminated structure
04/02/2009US20090087935 Fabricating method for quantum dot of active layer of LED by nano-lithography
04/02/2009US20090087933 Thin Film Transistor Substrate for a Liquid Crystal Display Wherein a Black Matrix Formed on the Substrate Comprises an Inner Aperture Formed Completely Within the Black Matrix
04/02/2009US20090087932 Substrate supporting apparatus, substrate supporting method, semiconductor manufacturing apparatus and storage medium
04/02/2009US20090087930 Inspection System, Inspection Method, and Method for Manufacturing Semiconductor Device
04/02/2009US20090087929 Method and system for improving wet chemical bath process stability and productivity in semiconductor manufacturing
04/02/2009US20090087928 Copper contamination detection method and system for monitoring copper contamination
04/02/2009US20090087796 Cyclopentene As A Precursor For Carbon-Based Films
04/02/2009US20090087793 Method of nano-patterning using surface plasmon effect and method of manufacturing nano-imprint master and discrete track magnetic recording media using the nano-patterning method
04/02/2009US20090087757 Method for feature prediction, method for manufacturing photomask, method for manufacturing electronic component, and program for feature prediction
04/02/2009US20090087630 Carbon nanotube films, layers, fabrics, ribbons, elements and articles
04/02/2009US20090087564 Substrate processing system
04/02/2009US20090087288 Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
04/02/2009US20090087287 Apparatus and method for semiconductor wafer transfer
04/02/2009US20090087286 Semiconductor manufacturing systems
04/02/2009US20090087285 Substrate processing apparatus
04/02/2009US20090087082 Pattern inspection apparatus and method
04/02/2009US20090087081 Method of manufacturing photo mask, mask pattern shape evaluation apparatus, method of judging photo mask defect corrected portion, photo mask defect corrected portion judgment apparatus, and method of manufacturing a semiconductor device
04/02/2009US20090086784 Quantum well intermixing