| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/02/2009 | DE102007044685B3 Elektronisches System und Verfahren zur Herstellung eines dreidimensionalen elektronischen Systems The electronic system and method for producing a three-dimensional electronic system |
| 04/02/2009 | DE102007044046A1 Power semiconductor module, has conductor section connected at side of frame, such that connection element is fixed in its position relative to substrate by positioning of element and frame relative to frame and element, respectively |
| 04/02/2009 | DE102007034306B3 Halbleitersubstrat mit Durchkontaktierung und Verfahren zur Herstellung eines Halbleitersubstrates mit Durchkontaktierung Semiconductor substrate having through-hole plating and method for producing a semiconductor substrate with via hole |
| 04/02/2009 | DE102006005645B4 Stapelbarer Baustein, Bausteinstapel und Verfahren zu deren Herstellung Stackable building block, block stack and processes for their preparation |
| 04/02/2009 | DE102005063332B4 Hochschwindigkeitsdiode und Verfahren zu ihrer Herstellung Hochschwindigkeitsdiode and processes for their preparation |
| 04/02/2009 | DE102005058713B4 Verfahren zur Reinigung des Volumens von Substraten, Substrat sowie Verwendung des Verfahrens A process for the purification of the volume of substrates, as well as substrate using the method |
| 04/02/2009 | DE102005048774B4 Substrat, das zumindest bereichsweise an einer Oberfläche mit einer Beschichtung eines Metalls versehen ist, sowie dessen Verwendung Substrate that is at least partially provided on one surface with a coating of a metal, and the use thereof |
| 04/02/2009 | DE102005009000B4 Vertikales Halbleiterbauelement vom Grabenstrukturtyp und Herstellungsverfahren Vertical semiconductor component from the grave type of structure and manufacturing method |
| 04/02/2009 | DE102004064028B4 Verfahren zum Herstellen eines Waferebenenpakets A method of manufacturing a wafer-level package |
| 04/02/2009 | DE102004042167B4 Verfahren zum Ausbilden einer Halbleiterstruktur, die Transistorelemente mit unterschiedlich verspannten Kanalgebieten umfasst, und entsprechende Halbleiterstruktur A method of forming a semiconductor structure which comprises transistor elements with differently strained channel regions, and corresponding semiconductor structure |
| 04/02/2009 | DE102004036220B4 Verfahren zur Laserdotierung von Festkörpern mit einem linienfokussierten Laserstrahl Method of laser doping of solids with a line-focused laser beam |
| 04/02/2009 | DE102004030042B4 Halbleiterbauelement mit einem auf einem Träger montierten Halbleiterchip, bei dem die vom Halbleiterchip auf den Träger übertragene Wärme begrenzt ist, sowie Verfahren zur Herstellung eines Halbleiterbauelementes A semiconductor device with a carrier mounted on a semiconductor chip in which the power transmitted from the semiconductor chip to the heat carrier is limited, and methods for producing a semiconductor device |
| 04/02/2009 | DE102004027663B4 Maskenlose Array-Schutz-Prozessabfolge zur Bildung von Durchgangsverbindungen in magnetischen Zufallszugriffsspeichern Maskless Array protection process sequence for forming vias in magnetic random access memories |
| 04/02/2009 | DE102004009087B4 Verfahren zum Einstellen der Durchbruchspannung eines Thyristors A method of adjusting the breakdown voltage of a thyristor |
| 04/02/2009 | DE102004005948B4 MOS-Transistor und Verfahren zur Herstellung einer MOS-Transistorstruktur MOS transistor and method for making a MOS transistor structure |
| 04/02/2009 | DE102004004045B4 Halbleiterbauelement mit temporärem Feldstoppbereich und Verfahren zu dessen Herstellung A semiconductor device with a temporary field stop area and process for its preparation |
| 04/02/2009 | DE10146176B4 Verfahren zur Umverdrahtung von Pads bei einem Waferlevel-Package, Waferlevel-Package und Halbleiterchip Method for rewiring pads at a wafer level package, wafer level package and semiconductor chip |
| 04/02/2009 | DE10133543B4 Bidirektionales Halbleiterbauelement Bidirectional semiconductor component |
| 04/02/2009 | DE10065224B4 Verfahren zur Herstellung von Kondensatoren für Halbleitereinrichtungen A process for the production of capacitors for semiconductor devices |
| 04/01/2009 | EP2043405A2 Photoirradiation type heat treatment apparatus |
| 04/01/2009 | EP2043263A1 Surface-acoustic-wave divice for flip-chip mounting |
| 04/01/2009 | EP2043167A1 Nitride semiconductor light emitting device and process for producing the same |
| 04/01/2009 | EP2043159A1 Transistor and semiconductor device |
| 04/01/2009 | EP2043158A2 Trench DMOS transistor with trench bottom implant |
| 04/01/2009 | EP2043157A1 Schottky barrier diode and method for manufacturing the same |
| 04/01/2009 | EP2043146A1 Lid or case for sealing package and method for manufacturing the lid or the case |
| 04/01/2009 | EP2043145A1 Nonvolatile semiconductor memory and its drive method |
| 04/01/2009 | EP2043144A2 Electrostatic chuck apparatus |
| 04/01/2009 | EP2043143A2 electrostatic chuck apparatus |
| 04/01/2009 | EP2043142A1 Mounting method using thermocompression head |
| 04/01/2009 | EP2043141A2 Double-gate transistor structure equipped with a channel with several branches |
| 04/01/2009 | EP2043140A2 A wafer and a method for manufacturing a wafer |
| 04/01/2009 | EP2043139A2 Method of preventing etch profile bending and bowing in high aspect ratio openings by treating a polymer formed on the opening sidewalls |
| 04/01/2009 | EP2043138A2 Method of processing an object having an oxide film on its surface and apparatus for performing said method |
| 04/01/2009 | EP2043137A2 Wafer and method for producing a wafer |
| 04/01/2009 | EP2043136A1 Film-forming composition |
| 04/01/2009 | EP2043135A1 Method of manufacturing semiconductor structures useful for the production of semiconductor-on-insulator substrates, and its applications |
| 04/01/2009 | EP2043134A1 Maintenance method, exposure method and apparatus and device manufacturing method |
| 04/01/2009 | EP2043133A1 Exposing method, exposing device, and device manufacturing method |
| 04/01/2009 | EP2043131A2 Minute sample processing method |
| 04/01/2009 | EP2042927A1 Composition containing hydroxylated condensation resin for forming film under resist |
| 04/01/2009 | EP2042272A2 Industrial robot with cam-actuated gripper |
| 04/01/2009 | EP2042267A1 Carrier for double side polishing device, and double side polishing device and double side polishing method using the carrier |
| 04/01/2009 | EP2042245A2 Box cleaner for cleaning wafer shipping box |
| 04/01/2009 | EP2041804A1 Lighting device package |
| 04/01/2009 | EP2041797A2 Methods and apparatus for depositing a microcrystalline silicon film for photovoltaic device |
| 04/01/2009 | EP2041795A2 Semiconductor heterojunction devices based on sic |
| 04/01/2009 | EP2041794A2 Opto-electronic and electronic devices using n-face or m-plane gan substrate prepared with ammonothermal growth |
| 04/01/2009 | EP2041793A2 Non-volatile memory and-array and method for operating the same |
| 04/01/2009 | EP2041789A2 Power amplifier assembly |
| 04/01/2009 | EP2041785A1 Improved cmos devices with stressed channel regions, and methods for fabricating the same |
| 04/01/2009 | EP2041784A2 Wall crawling devices |
| 04/01/2009 | EP2041783A2 Module having a flat structure, and equipment method |
| 04/01/2009 | EP2041782A1 Method of temporarily attaching a rigid carrier to a substrate |
| 04/01/2009 | EP2041781A1 Subresolution silicon features and methods for forming the same |
| 04/01/2009 | EP2041780A2 Semiconductor devices and methods of manufacture thereof |
| 04/01/2009 | EP2041779A1 System and method for delivering chemicals |
| 04/01/2009 | EP2041778A1 Method of producing segmented chips |
| 04/01/2009 | EP2041777A1 Photocathode lighting device, method for manufacturing the same and exposure apparatus using photocathode lighting device |
| 04/01/2009 | EP2041776A2 Cleaning formulation for removing residues on surfaces |
| 04/01/2009 | EP2041775A1 Automatically replaceable apparatus for collecting byproducts and the controlling method thereof in equipment producing semiconductor |
| 04/01/2009 | EP2041774A2 Cluster tool for advanced front-end processing |
| 04/01/2009 | EP2041770A1 Method and device for machining workpieces |
| 04/01/2009 | EP2041622A1 Precise positioning system for dual stage switching exposure |
| 04/01/2009 | EP2041334A2 Process chamber for dielectric gapfill |
| 04/01/2009 | EP2041044A1 Method for the production of a ceramic substrate, and a ceramic substrate |
| 04/01/2009 | EP2040872A1 Apparatus for feeding a wire in a wire bonder, comprising a plurality of channels subjected to compressed air and lying on the arc of a circle |
| 04/01/2009 | EP1946375B1 Highly manufacturable sram cells in substrates with hybrid crystal orientation |
| 04/01/2009 | EP1776719A4 Integrated circuit with multiple spacer insulating region widths |
| 04/01/2009 | EP1745515A4 Tuneable semiconductor device |
| 04/01/2009 | EP1733425A4 Method for integrating sige npn and vertical pnp devices on a substrate and related structure |
| 04/01/2009 | EP1687844A4 Method of forming a low voltage gate oxide layer and tunnel oxide layer in an eeprom cell |
| 04/01/2009 | EP1639634B1 Electronic device, assembly and methods of manufacturing an electronic device |
| 04/01/2009 | EP1627259A4 Compositions suitable for removing photoresist, photoresist byproducts and etching residue, and use thereof |
| 04/01/2009 | EP1618599A4 Method of making a nanogap for variable capacitive elements and device having a nanogap |
| 04/01/2009 | EP1606834A4 Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization |
| 04/01/2009 | EP1556886B1 Atomic layer deposition method and atomic layer deposition tool |
| 04/01/2009 | EP1552344A4 A method for the removal of an imaging layer from a semiconductor substrate stack |
| 04/01/2009 | EP1549475A4 Imprint lithography processes and systems |
| 04/01/2009 | EP1454339A4 An integrated circuit resistant to the formation of cracks in a passivation layer |
| 04/01/2009 | EP1421633B1 Transistor assembly and method for the production thereof |
| 04/01/2009 | EP1387807A4 Integrated substrate handler having pre-aligner and storage pod access mechanism |
| 04/01/2009 | EP1378036B1 Injection seeded laser with precise timing control |
| 04/01/2009 | EP1371091A4 Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics |
| 04/01/2009 | EP1352428B1 A method of manufacturing an active matrix substrate |
| 04/01/2009 | EP1320871B1 Fluid delivery ring and methods for making and implementing the same |
| 04/01/2009 | EP1313785B1 Composition comprising iptycene polymers with high internal volume |
| 04/01/2009 | EP1186033B1 Carrier for electronic components and a method for manufacturing a carrier |
| 04/01/2009 | EP1102061B1 Combinatorial x-ray diffractor |
| 04/01/2009 | EP1016126A4 Optical inspection module and method for detecting particles and defects on substrates in integrated process tools |
| 04/01/2009 | CN201215800Y Upper electrode for semiconductor etching device |
| 04/01/2009 | CN101401496A Circuit board, electronic circuit device, and display |
| 04/01/2009 | CN101401494A Bump forming method and bump forming apparatus |
| 04/01/2009 | CN101401292A Electrostatic holding device vacuum environment device using the device and connection device |
| 04/01/2009 | CN101401212A Insulated gate-type semiconductor device and manufacturing method thereof |
| 04/01/2009 | CN101401211A Method of forming HfSiN metal for n-FET applications |
| 04/01/2009 | CN101401202A 选择性沉积 Selective deposition |
| 04/01/2009 | CN101401201A Electronic device and a process for forming the electronic device |
| 04/01/2009 | CN101401200A Silicided nonvolatile memory and method of making same |
| 04/01/2009 | CN101401199A Method for producing partial SOI structures comprising zones connecting a superficial layer and a substrate |