| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/02/2009 | WO2009042476A1 Improved cmos fabrication process |
| 04/02/2009 | WO2009042475A1 Integrated circuit formation using a silicon carbon film |
| 04/02/2009 | WO2009042463A1 Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate |
| 04/02/2009 | WO2009042462A2 Techniques for optical ion beam metrology |
| 04/02/2009 | WO2009042461A2 Techniques for optical ion beam metrology |
| 04/02/2009 | WO2009042459A1 Single wafer implanter for silicon-on-insulator wafer fabrication |
| 04/02/2009 | WO2009042458A1 Electrical contacts for integrated circuits and methods of forming using gas cluster ion beam processing |
| 04/02/2009 | WO2009042453A2 Profile control in dielectric etch |
| 04/02/2009 | WO2009042447A1 A bonding pad structure allowing wire bonding over an active area in a semiconductor die and method of manufacturing same |
| 04/02/2009 | WO2009042443A1 Method to improve electrical leakage peformance and to minimize electromigration in semiconductor devices |
| 04/02/2009 | WO2009042438A1 Line width roughness control with arc layer open |
| 04/02/2009 | WO2009042345A1 Nand strings with offset charge storage layers and manufacturing method thereof |
| 04/02/2009 | WO2009042218A1 Lateral two-terminal nanotube devices and method for their formation |
| 04/02/2009 | WO2009042146A1 Deposition system for thin film formation |
| 04/02/2009 | WO2009042144A2 Process for making doped zinc oxide |
| 04/02/2009 | WO2009042137A2 Temperature control modules for showerhead electrode assemblies for plasma processing apparatuses |
| 04/02/2009 | WO2009042059A1 Process for making thin film transistors by atomic layer deposition |
| 04/02/2009 | WO2009042051A2 Process for depositing organic materials |
| 04/02/2009 | WO2009042029A2 Back gated sram cell |
| 04/02/2009 | WO2009042028A2 Lanthanide dielectric with controlled interfaces |
| 04/02/2009 | WO2009041916A1 A method of generating a pattern on a substrate |
| 04/02/2009 | WO2009041861A1 Device and method for lifting and handling of objects |
| 04/02/2009 | WO2009041802A1 Method in eliminating polycide stringer in double poly analog mixed signal (ams) device |
| 04/02/2009 | WO2009041774A2 Electrospray vaporizer |
| 04/02/2009 | WO2009041743A1 Trench gate type transistor and method for manufacturing the same |
| 04/02/2009 | WO2009041742A1 Trench gate type transistor and method for manufacturing the same |
| 04/02/2009 | WO2009041741A1 Dmos transistor and method for manufacturing the same |
| 04/02/2009 | WO2009041697A1 Polishing composition |
| 04/02/2009 | WO2009041646A1 Photocurable composition, method for producing fine patterned body, and optical device |
| 04/02/2009 | WO2009041637A1 Apparatus and method for inspecting semiconductor, and semiconductor device to be inspected |
| 04/02/2009 | WO2009041631A1 Zno semiconductor and zno semiconductor element |
| 04/02/2009 | WO2009041629A1 Plasma processing device |
| 04/02/2009 | WO2009041620A1 Photosensitive resin composition, pattern-forming method using the composition, and electronic device |
| 04/02/2009 | WO2009041619A1 Positive-type photosensitive resin composition, and method for formation of cured film using the same |
| 04/02/2009 | WO2009041578A1 Wafer supporting jig, method for measuring temperature of wafer supporting jig, and system for measuring temperature of wafer supporting jig |
| 04/02/2009 | WO2009041560A1 Plasma etching method |
| 04/02/2009 | WO2009041558A1 Electrostatic discharge failure protective element, electrostatic discharge failure protective circuit, semiconductor device and semiconductor device manufacturing method |
| 04/02/2009 | WO2009041556A1 Radiation-sensitive composition |
| 04/02/2009 | WO2009041551A1 Mask blank, and method for production of imprint mold |
| 04/02/2009 | WO2009041510A1 Process for producing resin molded product, resin molded product produced by the process, optical device, microlens, microlens array, and microfluid device |
| 04/02/2009 | WO2009041499A1 Plasma processing apparatus and gas exhaust method |
| 04/02/2009 | WO2009041490A1 Charging apparatus |
| 04/02/2009 | WO2009041466A1 Annealing apparatus |
| 04/02/2009 | WO2009041422A1 Polishing pad |
| 04/02/2009 | WO2009041421A1 Substrate transfer apparatus and observation apparatus |
| 04/02/2009 | WO2009041407A1 Resin composition for formation of fine pattern, and method for formation of fine pattern |
| 04/02/2009 | WO2009041400A1 Negative resist composition and resist pattern-forming method using the same |
| 04/02/2009 | WO2009041397A1 Raw gas supply system, and filming apparatus |
| 04/02/2009 | WO2009041388A1 Mask blank, and transferring mask |
| 04/02/2009 | WO2009041373A1 Method and device for manufacturing sheet having fine shape transferred thereon |
| 04/02/2009 | WO2009041365A1 Organic transistor and process for producing the same |
| 04/02/2009 | WO2009041357A1 Photosensitive composition and method of forming pattern from the same |
| 04/02/2009 | WO2009041329A1 Laser processing method |
| 04/02/2009 | WO2009041306A1 Method and apparatus for manufacturing semiconductor device and resist material |
| 04/02/2009 | WO2009041304A1 Oscillation circuit |
| 04/02/2009 | WO2009041295A1 Surface inspection method and surface inspection device |
| 04/02/2009 | WO2009041283A1 Gas supplying apparatus |
| 04/02/2009 | WO2009041282A1 Film forming apparatus, film forming method, storage medium and gas supplying apparatus |
| 04/02/2009 | WO2009041277A1 Semiconductor wafer manufacturing method |
| 04/02/2009 | WO2009041270A1 Composition for forming upper layer film for immersion exposure, upper layer film for immersion exposure, and method of forming photoresist pattern |
| 04/02/2009 | WO2009041266A1 Solar cell wafer manufacturing method |
| 04/02/2009 | WO2009041235A1 Electronic part mounting method and device |
| 04/02/2009 | WO2009041219A1 Method for sr-ti-o-base film formation and recording medium |
| 04/02/2009 | WO2009041214A1 Method of plasma treatment and plasma treatment apparatus |
| 04/02/2009 | WO2009041189A1 Vaporizer and film forming apparatus |
| 04/02/2009 | WO2009041053A1 Process for producing group iii element nitride crystal and apparatus for producing group iii element nitride crystal |
| 04/02/2009 | WO2009041044A1 Semiconductor module, method for manufacturing semiconductor module, and portable device |
| 04/02/2009 | WO2009041010A1 Semiconductor integrated circuit device, communication device, information reproducing device, image display device, electronic device, electronic control device, and mobile body |
| 04/02/2009 | WO2009040986A1 Probe needle material, probe needle and probe card each using the same, and inspection process |
| 04/02/2009 | WO2009040973A1 Gas feeding device for semiconductor manufacturing facilities |
| 04/02/2009 | WO2009040972A1 Sheet plasma film forming apparatus |
| 04/02/2009 | WO2009040580A1 Non-polar iii-v nitride semiconductor and growth method |
| 04/02/2009 | WO2009040579A1 Non-polar iii-v nitride material and production method |
| 04/02/2009 | WO2009040337A1 Method of manufacturing a structure comprising a substrate and a layer deposited on one of its faces |
| 04/02/2009 | WO2009040328A1 Process for forming a wire portion in an integrated electronic circuit |
| 04/02/2009 | WO2009039921A1 Method for the production of a device, use of a mechanical alternating field during the production of a device, and device |
| 04/02/2009 | WO2009039802A1 Method for producing a semiconductor component, and semiconductor component |
| 04/02/2009 | WO2009039631A1 Carrier chip with cavity |
| 04/02/2009 | WO2009039552A1 Reactive ion etching process for etching metals |
| 04/02/2009 | WO2009023387A3 Compositions and methods for modifying a surface suited for semiconductor fabrication |
| 04/02/2009 | WO2009021207A3 Apparatus and method for wafer edge exclusion measurement |
| 04/02/2009 | WO2009020755A3 Intermetallic conductors |
| 04/02/2009 | WO2009020678A3 Method using low temperature wafer bonding to fabricate transistors with heterojunctions of si(ge) to iii-n materials |
| 04/02/2009 | WO2009019642A3 Iii-nitride device grown on edge-dislocation template |
| 04/02/2009 | WO2009019187A3 Circuit structure with metal gate and high-k dielectric |
| 04/02/2009 | WO2009018059A3 Process of semiconductor fabrication with mask overlay on pitch multiplied features and associated structures |
| 04/02/2009 | WO2009017982A3 Methods for device fabrication using pitch reduction and associated structures |
| 04/02/2009 | WO2009017758A3 Reconstituted wafer stack packaging with after-applied pad extensions |
| 04/02/2009 | WO2009015298A3 Nonvolatile memory elements |
| 04/02/2009 | WO2009014337A3 Method of manufacturing crystalline semiconductor thin film |
| 04/02/2009 | WO2009013315A3 Semiconductor substrate with through-contact and method for production thereof |
| 04/02/2009 | WO2009012346A4 Methods for fabricating p-type cadmium selenide |
| 04/02/2009 | WO2009007943A4 Hetero-structure field effect transistor, integrated circuit including a hetero-structure field effect transistor and method for manufacturing a hetero-structure field effect transistor |
| 04/02/2009 | WO2009003646A3 Method and apparatus for drying a substrate surface |
| 04/02/2009 | WO2009002888A3 Method and apparatus for wafer marking |
| 04/02/2009 | WO2008130375A3 Liquid films containing nanostructured materials |
| 04/02/2009 | WO2008088599A8 Forced ion migration for chalcogenide phase change memory device |
| 04/02/2009 | WO2008060642A3 High density coupling of quantum dots to carbon nanotube surface for efficient photodetection |
| 04/02/2009 | WO2008014391A3 Avalanche protection for wide bandgap devices |
| 04/02/2009 | WO2007136582A3 Indented structure for encapsulated devices and method of manufacture |