Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2009
03/26/2009WO2009038168A1 Film forming apparatus and film forming method
03/26/2009WO2009038164A1 Stop detecting method for conveyor apparatus
03/26/2009WO2009038135A1 Method for supporting metal nano particle, and substrate carrying metal nano particle
03/26/2009WO2009038126A1 Resist underlayer film forming composition containing branched polyhydroxystyrene
03/26/2009WO2009038082A1 Photosensitive resin composition and laminate thereof
03/26/2009WO2009038063A1 Etching solution
03/26/2009WO2009038020A1 Adhesive composition for electronic components and adhesive sheet for electronic components using the same
03/26/2009WO2009038011A1 Load lock device and vacuum processing system
03/26/2009WO2009038004A1 Magnetic random access memory
03/26/2009WO2009037991A1 Cleaning method and substrate processing apparatus
03/26/2009WO2009037941A1 Substrate processing method and substrate processing system
03/26/2009WO2009037930A1 Vaporization apparatus, film forming apparatus, film forming method, computer program and storage medium
03/26/2009WO2009037921A1 Imprint lithography mold manufacturing method, and mold
03/26/2009WO2009037910A1 Magnetic random access memory, its writing method, and magnetoresistive effect element
03/26/2009WO2009037909A1 Magnetic random access memory
03/26/2009WO2009037903A1 Cmp slurry for silicon film polishing and polishing method
03/26/2009WO2009037896A1 Semiconductor device manufacturing method and semiconductor device
03/26/2009WO2009037878A1 Semiconductor device and wire bonding method
03/26/2009WO2009037875A1 Method for inspecting line width measuring apparatus
03/26/2009WO2009037814A1 Photovoltaic element and its manufacturing method
03/26/2009WO2009037808A1 Semiconductor integrated circuit
03/26/2009WO2009037797A1 Display device manufacturing method and laminated structure
03/26/2009WO2009037754A1 Substrate transfer system
03/26/2009WO2009037753A1 Substrate transfer system
03/26/2009WO2009037675A2 Transfer mechanism with multiple wafer handling capability
03/26/2009WO2009037674A1 Simultaneous wafer id reading
03/26/2009WO2009037673A2 An integrated wafer transfer mechanism
03/26/2009WO2009037531A1 Improvements for reducing electromigration effect in an integrated circuit
03/26/2009WO2009037119A1 Patternable dielectric film structure with improved lithography and method of fabricating same
03/26/2009WO2009037117A1 Interconnect structures with patternable low-k dielectrics and method of fabricating same
03/26/2009WO2009037108A2 Pick and place system for a semiconductor assembly device
03/26/2009WO2009036995A1 Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp
03/26/2009WO2009036969A1 Electronic system, and method for manufacturing a three-dimensional electronic system
03/26/2009WO2009036950A2 Method for fabricating a mixed orientation substrate
03/26/2009WO2009036604A1 Etching isolation of lpcc/qfn strip
03/26/2009WO2009020245A3 Method of segmenting semiconductor wafer
03/26/2009WO2009018556A3 Method of enhancing drive current in a transistor
03/26/2009WO2009017247A4 Polymer for forming insulating film, composition for forming insulating film, insulating film, and electronic device having insulating film
03/26/2009WO2009012276A3 Asymmetric field effect transistor structure and method
03/26/2009WO2009009566A3 Method for manufacturing semiconductor device
03/26/2009WO2008147432A4 Method of assembling one-dimensional nanostructures
03/26/2009WO2008145512A3 Contact element of device for determining and/or monitoring a process variable
03/26/2009WO2008099767A4 Curable liquid composition, method of coating, inorganic substrate, and semiconductor device
03/26/2009WO2008054832A3 Nanowire device and method of making
03/26/2009WO2008027305A8 Method of tuning thermal conductivity of electrostatic chuck support assembly
03/26/2009WO2007112432A3 Epitaxy of silicon-carbon substitutional solid solutions by ultra-fast annealing of amorphous material
03/26/2009WO2007101228A3 Semiconductor wafer handling and transport
03/26/2009WO2005065238A3 Micro pin grid array with pin motion isolation
03/26/2009WO2005008724A3 Wafer-level chip scale package and method for fabricating and using the same
03/26/2009WO2004109748A3 Supporting shelf for front opening unified pod
03/26/2009WO2004105099A3 Group ii-vi semiconductor devices
03/26/2009US20090083592 Semicondcutor device, memory system and control method of the semiconductor device
03/26/2009US20090082895 Integrated wafer transfer mechanism
03/26/2009US20090081887 Heat treatment method and heat treatment apparatus
03/26/2009US20090081886 System for thin film deposition utilizing compensating forces
03/26/2009US20090081885 Deposition system for thin film formation
03/26/2009US20090081884 Method of improving oxide growth rate of selective oxidation processes
03/26/2009US20090081883 Process for depositing organic materials
03/26/2009US20090081882 Method for manufacturing semiconductor device and method for designing photomask pattern
03/26/2009US20090081881 Substrate processing apparatus and substrate processing method for performing etching process with phosphoric acid solution
03/26/2009US20090081880 Method for manufacturing semiconductor device
03/26/2009US20090081879 Method for manufacturing semiconductor device
03/26/2009US20090081878 Temperature control modules for showerhead electrode assemblies for plasma processing apparatuses
03/26/2009US20090081877 Method of controlling striations and cd loss in contact oxide etch
03/26/2009US20090081876 Method of preventing etch profile bending and bowing in high aspect ratio openings by treating a polymer formed on the opening sidewalls
03/26/2009US20090081875 Chemical removal of oxide layer from chip pads
03/26/2009US20090081874 Method for extending equipment uptime in ion implantation
03/26/2009US20090081873 Methods of Patterning Insulating Layers Using Etching Techniques that Compensate for Etch Rate Variations
03/26/2009US20090081872 Plasma etching method for etching sample
03/26/2009US20090081871 Polishing composition and method utilizing abrasive particles treated with an aminosilane
03/26/2009US20090081870 Method of forming a semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thicknesses formed thereon
03/26/2009US20090081869 Process for producing silicon compound
03/26/2009US20090081868 Vapor deposition processes for tantalum carbide nitride materials
03/26/2009US20090081867 Method of manufacturing substrate
03/26/2009US20090081866 Vapor deposition of tungsten materials
03/26/2009US20090081865 Method for fabricating semiconductor device
03/26/2009US20090081864 SiC Film for Semiconductor Processing
03/26/2009US20090081863 Method of forming metal wiring layer of semiconductor device
03/26/2009US20090081862 Air gap structure design for advanced integrated circuit technology
03/26/2009US20090081861 Manufacturing method of solder ball disposing surface structure of package substrate
03/26/2009US20090081860 Method of forming transistor devices with different threshold voltages using halo implant shadowing
03/26/2009US20090081859 Metallization process
03/26/2009US20090081858 Sputtering-Less Ultra-Low Energy Ion Implantation
03/26/2009US20090081857 Non-polar and semi-polar GaN substrates, devices, and methods for making them
03/26/2009US20090081856 Single crystal silicon wafer for insulated gate bipolar transistors and process for producing the same
03/26/2009US20090081855 Fabrication method of polysilicon layer
03/26/2009US20090081854 Method of forming nanowire and method of manufacturing semiconductor device comprising the nanowire
03/26/2009US20090081853 Process for depositing layers containing silicon and germanium
03/26/2009US20090081852 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure
03/26/2009US20090081851 Laser processing method
03/26/2009US20090081850 Method for manufacturing soi substrate
03/26/2009US20090081849 Method for manufacturing semiconductor wafer
03/26/2009US20090081848 Wafer bonding activated by ion implantation
03/26/2009US20090081847 Method of manufacturing nonvolatile semiconductor memory device
03/26/2009US20090081846 Method of fabricating semiconductor memory device
03/26/2009US20090081845 Manufacturing method of substrate provided with semiconductor films
03/26/2009US20090081844 Method for manufacturing semiconductor substrate and semiconductor device
03/26/2009US20090081843 Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same
03/26/2009US20090081842 Process for atomic layer deposition
03/26/2009US20090081841 Non-Volatile Memory Device and Manufacturing Method Thereof
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