Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2009
04/07/2009US7514331 Method of manufacturing gate sidewalls that avoids recessing
04/07/2009US7514330 Semiconductor device having an under stepped gate for preventing gate failure and method of manufacturing the same
04/07/2009US7514329 Robust DEMOS transistors and method for making the same
04/07/2009US7514328 Method for making a semiconductor device including shallow trench isolation (STI) regions with a superlattice therebetween
04/07/2009US7514327 Electronically scannable multiplexing device
04/07/2009US7514326 Organic thin film transistor, display device using the same and method of fabricating the same
04/07/2009US7514325 Fin-FET having GAA structure and methods of fabricating the same
04/07/2009US7514324 Selective epitaxy in vertical integrated circuit
04/07/2009US7514322 Shielded gate field effect transistor
04/07/2009US7514321 Method of making three dimensional NAND memory
04/07/2009US7514320 Semiconductor device having increased capacitance of capacitor for data storage and method of manufacturing semiconductor device
04/07/2009US7514319 Copolymers, polymer resin composition for buffer layer method of forming a pattern using the same and method of manufacturing a capacitor using the same
04/07/2009US7514318 Method for fabricating non-volatile memory cells
04/07/2009US7514317 Strained semiconductor device and method of making same
04/07/2009US7514316 Semiconductor device and method of manufacturing the same
04/07/2009US7514315 Methods of forming capacitor structures having aluminum oxide diffusion barriers
04/07/2009US7514314 Method of manufacturing semiconductor device and semiconductor memory device
04/07/2009US7514313 Process of forming an electronic device including a seed layer and a semiconductor layer selectively formed over the seed layer
04/07/2009US7514312 Method of manufacturing semiconductor device
04/07/2009US7514311 Method of manufacturing a SONOS memory
04/07/2009US7514310 Dual work function metal gate structure and related method of manufacture
04/07/2009US7514309 Methods to selectively protect NMOS regions, PMOS regions, and gate layers during EPI process
04/07/2009US7514308 CMOS device having different amounts of nitrogen in the NMOS gate dielectric layers and PMOS gate dielectric layers
04/07/2009US7514307 Method of manufacturing a semiconductor apparatus
04/07/2009US7514306 Method for manufacturing semiconductor device
04/07/2009US7514305 Apparatus and methods for improving the intensity profile of a beam image used to process a substrate
04/07/2009US7514304 MOSFET having channel in bulk semiconductor and source/drain on insulator, and method of fabrication
04/07/2009US7514303 Method of fabricating reflection type liquid crystal display
04/07/2009US7514302 Semiconductor device and manufacturing method thereof
04/07/2009US7514301 Method for fabricating nanocoils
04/07/2009US7514300 Mold compound cap in a flip chip multi-matrix array package and process of making same
04/07/2009US7514299 Chip package structure and manufacturing method thereof
04/07/2009US7514298 Printed wiring board for mounting semiconductor
04/07/2009US7514297 Methods for a multiple die integrated circuit package
04/07/2009US7514296 Method for manufacturing semiconductor device
04/07/2009US7514295 Method for processing a base that includes connecting a first base to a second base with an insulating film
04/07/2009US7514294 Semiconductor device and a manufacturing method of the same
04/07/2009US7514293 Method of manufacturing a semiconductor device
04/07/2009US7514292 Individualized low parasitic power distribution lines deposited over active integrated circuits
04/07/2009US7514291 Methods relating to singulating semiconductor wafers and wafer scale assemblies
04/07/2009US7514290 Chip-to-wafer integration technology for three-dimensional chip stacking
04/07/2009US7514289 Methods and structures for facilitating proximity communication
04/07/2009US7514288 Manufacturing methods for thin film fuse phase change ram
04/07/2009US7514287 Method of forming a cavity by two-step etching and method of reducing dimension of a MEMS device
04/07/2009US7514286 Method for forming individual semi-conductor devices
04/07/2009US7514285 Isolation scheme for reducing film stress in a MEMS device
04/07/2009US7514284 Image sensor and method of fabricating the same
04/07/2009US7514282 Patterned silicon submicron tubes
04/07/2009US7514281 Method for manufacturing organic electroluminescence device and electronic apparatus
04/07/2009US7514280 Method for packaging organic light emitting display with frit seal and reinforcing structure
04/07/2009US7514279 Optoelectronic component and method for producing it
04/07/2009US7514278 Test-key for checking interconnect and corresponding checking method
04/07/2009US7514277 Etching method and apparatus
04/07/2009US7514276 Aligning stacked chips using resistance assistance
04/07/2009US7514273 Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel
04/07/2009US7514272 Method of manufacturing ferroelectric memory device
04/07/2009US7514271 Method of forming high density planar magnetic domain wall memory
04/07/2009US7514205 Copolymer of an unsaturated sulfonic acid, particularly vinylsulfonic acid, allylsulfonic acid, or 2-acrylamido-2-methylpropanesulfonic acid and a 3-perfluoroalkyl-2-hydroxypropyl or 2-perfluroalkyl-1-methylolethyl (alk or F)acrylate, e.g., 3-(perfluoro-n-butyl)-2-hydroxypropyl acrylate
04/07/2009US7514185 Forming a light-absorbing film on a transparent substrate, and irradiating the light-absorbing film with light from a flash lamp; flatness
04/07/2009US7514183 Generating a mask for use in a photolithography process; tuning the transmittance of features in a target mask pattern
04/07/2009US7514160 Tunnel magnetoresistance element having a double underlayer of amorphous MgO and crystalline MgO(001)
04/07/2009US7514151 Substrate covered with polysiloxane insulating film, a polycarbosilane insulating film , and an insulating film (such as SiO2, SiN, SiC, SiCN, or SiOC) formed by chemical vapor deposition; excellent resistance against processing such as etching, ashing, or wet cleaning; low relative dielectric constant
04/07/2009US7514143 Re-peelable pressure-sensitive adhesive sheet
04/07/2009US7514120 Titanium nitride film; titanium chloride precursor; ammonia reducing agent; oxygen, water, oxidants; thermal CVD means forming a film by thermochemical reaction without using a plasma
04/07/2009US7514016 Methodology of chemical mechanical nanogrinding for ultra precision finishing of workpieces
04/07/2009US7514015 Method for surface cleaning
04/07/2009US7514014 High density plasma chemical vapor deposition process
04/07/2009US7514013 Devices with thermoelectric and thermodiodic characteristics and methods for manufacturing same
04/07/2009US7514012 Pre-oxidization of deformable elements of microstructures
04/07/2009US7513981 Manufacturing apparatus of semiconductor device
04/07/2009US7513971 Flat style coil for improved precision etch uniformity
04/07/2009US7513954 Plasma processing apparatus and substrate mounting table employed therein
04/07/2009US7513949 Method and apparatus for producing semiconductor device
04/07/2009US7513284 Compression device
04/07/2009US7513265 High pressure processing method and apparatus
04/07/2009US7513262 Substrate meniscus interface and methods for operation
04/07/2009US7513182 Integrated circuit package separators
04/07/2009US7513063 Substrate processing apparatus
04/07/2009US7513062 Single wafer dryer and drying methods
04/07/2009US7513037 Method of embedding components in multi-layer circuit boards
04/07/2009US7513022 Method for manufacturing surface acoustic wave device
04/07/2009CA2359225C Method and device for vibration control
04/06/2009WO2009069248A1 Method for manufacturing flexible semiconductor device and flexible semiconductor device
04/02/2009WO2009043018A2 Offset correction techniques for positioning substrates within a processing chamber
04/02/2009WO2009043008A2 Methods and arrangement for creating models for fine-tuning recipes
04/02/2009WO2009043001A1 Methods and apparatus for a hybrid capacitively-coupled and an inductively-coupled plasma processing system
04/02/2009WO2009042997A2 Wafer bow metrology arrangements and methods thereof
04/02/2009WO2009042983A2 Method of achieving atomically smooth sidewalls in deep trenches, and high aspect ratio silicon structure containing atomically smooth sidewalls
04/02/2009WO2009042982A1 Methods for the deposition of ternary oxide gate dielectrics and structures formed thereby
04/02/2009WO2009042976A2 Apparatus for testing devices
04/02/2009WO2009042946A2 Reduced scrub contact element
04/02/2009WO2009042940A2 Component assembly and alignment
04/02/2009WO2009042784A1 Methods of producing high uniformity in thin film transistor devices fabricated on laterally crystallized thin films
04/02/2009WO2009042741A2 Method of enabling selective area plating on a substrate
04/02/2009WO2009042713A1 Vapor deposition of tungsten materials
04/02/2009WO2009042679A2 Stiffener assembly for use with testing devices
04/02/2009WO2009042551A1 Method for growing an epitaxial layer
04/02/2009WO2009042534A1 Processing system for producing a negative ion plasma
04/02/2009WO2009042495A2 Methods of forming nitride stressing layer for replacement metal gate and structures formed thereby
04/02/2009WO2009042490A2 Improved nitrogen profile in high-k dielectrics using ultrathin disposable capping layers