Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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04/02/2009 | US20090085121 Condensed Memory Cell Structure Using a FinFET |
04/02/2009 | US20090085120 Method for Reduction of Resist Poisoning in Via-First Trench-Last Dual Damascene Process |
04/02/2009 | US20090085119 Double-gate transistor structure equipped with a multi-branch channel |
04/02/2009 | US20090085116 Semiconductor device and method of manufacturing the same |
04/02/2009 | US20090085114 Semiconductor Structure |
04/02/2009 | US20090085111 Semiconductor device and method of manufacturing the same |
04/02/2009 | US20090085110 Semiconductor device employing precipitates for increased channel stress |
04/02/2009 | US20090085109 Semiconductor device and method of manufacturing semiconductor device |
04/02/2009 | US20090085108 Semiconductor device having cell transistor with recess channel structure |
04/02/2009 | US20090085107 Trench MOSFET with thick bottom oxide tub |
04/02/2009 | US20090085106 Semiconductor device and semiconductor device manufacturing method |
04/02/2009 | US20090085105 Trench mosfet and method of manufacture utilizing two masks |
04/02/2009 | US20090085104 Semiconductor device and method for manufacturing |
04/02/2009 | US20090085103 Semiconductor device and method |
04/02/2009 | US20090085099 Trench mosfet and method of manufacture utilizing three masks |
04/02/2009 | US20090085097 Methods of forming nitride stressing layer for replacement metal gate and structures formed thereby |
04/02/2009 | US20090085096 Nonvolatile Memory Devices and Methods of Forming the Same |
04/02/2009 | US20090085095 Profile Engineered Thin Film Devices and Structures |
04/02/2009 | US20090085094 Floating gate having multiple charge storing layers, method of fabricating the floating gate, non-volatile memory device using the same, and fabricating method thereof |
04/02/2009 | US20090085093 Semiconductor devices and method of fabricating the same |
04/02/2009 | US20090085087 Liner for tungsten/silicon dioxide interface in memory |
04/02/2009 | US20090085086 Capacitive electrode having semiconductor layers with an interface of separated grain boundaries |
04/02/2009 | US20090085084 Integrated Circuit and Methods of Manufacturing the Same |
04/02/2009 | US20090085083 Semiconductor memory device and method of forming the same |
04/02/2009 | US20090085082 Controlled intermixing of hfo2 and zro2 dielectrics enabling higher dielectric constant and reduced gate leakage |
04/02/2009 | US20090085081 Semiconductor device and method for manufacturing the same |
04/02/2009 | US20090085080 Image Sensor and Method for Manufacturing The Same |
04/02/2009 | US20090085077 Photo Sensor and a Method for Manufacturing Thereof |
04/02/2009 | US20090085075 Method of fabricating mos transistor and mos transistor fabricated thereby |
04/02/2009 | US20090085074 Trench mosfet and method of manufacture utilizing four masks |
04/02/2009 | US20090085073 Mosfet structure and method of manufacture |
04/02/2009 | US20090085072 Biosensor using nanoscale material as transistor channel and method of fabricating the same |
04/02/2009 | US20090085071 Sensor device comprising elongated nanostructures |
04/02/2009 | US20090085070 Solid-state image pickup device, method of manufacturing solid-state image pickup device, and image pickup device |
04/02/2009 | US20090085069 NAND-type Flash Array with Reduced Inter-cell Coupling Resistance |
04/02/2009 | US20090085067 Semiconductor device and layout design method therefor |
04/02/2009 | US20090085066 Method for integrating high voltage and high speed bipolar transistors on a substrate and related structure |
04/02/2009 | US20090085065 Method to fabricate iii-n semiconductor devices on the n-face of layers which are grown in the iii-face direction using wafer bonding and substrate removal |
04/02/2009 | US20090085064 Heterojunction semiconductor device and method |
04/02/2009 | US20090085063 Compound semiconductor device with t-shaped gate electrode and its manufacture |
04/02/2009 | US20090085062 Method to introduce uniaxial strain in multigate nanoscale transistors by self aligned si to sige conversion processes and structures formed thereby |
04/02/2009 | US20090085058 Electronic device including a magneto-resistive memory device and a process for forming the electronic device |
04/02/2009 | US20090085056 Optical semiconductor device and method for fabricating the same |
04/02/2009 | US20090085050 Island submount and a method thereof |
04/02/2009 | US20090085045 Method for producing a matrix of individual electronic components and matrix produced thereby |
04/02/2009 | US20090085042 Display device having thin film semiconductor device and manufacturing method of thin film semiconductor device |
04/02/2009 | US20090085040 Liquid crystal display device and fabricating method thereof |
04/02/2009 | US20090085039 Image display system and fabrication method thereof |
04/02/2009 | US20090085038 Substrate for display device, manufacturing method for same and display device |
04/02/2009 | US20090085037 Array substrate for liquid crystal display and method for fabricating the same |
04/02/2009 | US20090085035 Method of Producing a Semiconductor Element in a Substrate and a Semiconductor Element |
04/02/2009 | US20090085033 Thin film transistor, pixel structure and fabrication methods thereof |
04/02/2009 | US20090085032 Pixel structure and fabricating method thereof |
04/02/2009 | US20090085031 Wafer-Shaped Measuring Apparatus and Method for Manufacturing the Same |
04/02/2009 | US20090085030 Increased reliability for a contact structure to connect an active region with a polysilicon line |
04/02/2009 | US20090085027 Three dimensional strained quantum wells and three dimensional strained surface channels by ge confinement method |
04/02/2009 | US20090085025 Memory device including resistance-changing function body |
04/02/2009 | US20090084989 Beam irradiation apparatus with deep ultraviolet light emission device for lithographic pattern inspection system |
04/02/2009 | US20090084985 Cadmium sulfide quantum dot lasing in room temperature liquid solution |
04/02/2009 | US20090084785 Opening/closing structure for container for conveying thin plate |
04/02/2009 | US20090084758 Method and apparatus for shaping gas profile near bevel edge |
04/02/2009 | US20090084501 Processing system for producing a negative ion plasma |
04/02/2009 | US20090084500 Processing apparatus, exhaust processing process and plasma processing process |
04/02/2009 | US20090084433 Thin-film solar battery module and method of producing the same |
04/02/2009 | US20090084409 Cleaning apparatus, cleaning system using cleaning apparatus, cleaning method of substrate-to-be-cleaned |
04/02/2009 | US20090084403 Substrate cleaning apparatus, substrate processing apparatus, substrate cleaning method, substrate processing method and storage medium |
04/02/2009 | US20090084288 Vapor deposition using amine containing organosilicon compound; integrated circuits; disilane derivative compound that is fully substituted with alkylamino and/or dialkylamino functional groups |
04/02/2009 | US20090084181 Integrally fabricated micromachine and logic elements |
04/02/2009 | US20090084162 Chemical sensor |
04/02/2009 | US20090083978 End face sensor and method of producing the same |
04/02/2009 | DE4216218B4 Verfahren und Vorrichtung zum elektrostatischen Halten eines Körpers mittels einer elektrostatischen Haltevorrichtung Method and apparatus for electrostatically retaining a body by means of an electrostatic chuck |
04/02/2009 | DE19921230B4 Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten A method of handling of the thinned chip for insertion into chip cards |
04/02/2009 | DE19841650B4 Verfahren zur Darstellung von nanokristallinen oder nanokristallinhaltigen Metalloxid- und Metallmischoxidschichten auf sperrschichtbildenden Metallen Process for the preparation of nanocrystalline or nanocrystalline metal oxide-containing and Metallmischoxidschichten to form a barrier layer metals |
04/02/2009 | DE112007001281T5 Rückseiten-Waferzertrennen Back Waferzertrennen |
04/02/2009 | DE112007001152T5 Vorrichtung und Verfahren zum Erzeugen von Atmosphärendruckplasma Apparatus and method for generating atmospheric pressure plasma |
04/02/2009 | DE112007000793T5 Verfahren zur Feinbehandlung eines Substrats, Verfahren zur Fertigung eines Substrats und lichtemittierende Vorrichtung A process for the fine treatment of a substrate, method for the production of a substrate and light emitting device |
04/02/2009 | DE112007000405T5 Lacksubstrat-Behandlungslösung und Verfahren zur Behandlung von Lacksubstrat unter Verwendung derselben Resist substrate-treating solution and method for the treatment of paint substrate using the same |
04/02/2009 | DE10350703B4 Verfahren zum Bilden einer Speicherzelle A method of forming a memory cell |
04/02/2009 | DE10334832B4 Steuerkreis zum Ansteuern eines Leistungshalbleiterbauelements Control circuit for driving a power semiconductor device |
04/02/2009 | DE10215773B4 Verfahren zur Herstellung einer Halbleitervorrichtung mit einer Isolierschicht A process for producing a semiconductor device with an insulating layer |
04/02/2009 | DE102008046864A1 Halbleiterbauelement mit Kondensator A semiconductor device having capacitor |
04/02/2009 | DE102008046863A1 Integrierter Schaltkreis mit einem ersten und einem zweiten Gatestapel und Verfahren zu dessen Herstellung An integrated circuit comprising a first and a second gate stack, and process for its preparation |
04/02/2009 | DE102008046862A1 Semiconductor structure has inductor that overlies in magnetic region which is outside boundary of semiconductor chip |
04/02/2009 | DE102008046282A1 Gruppe-III-Nitrid-Leistungshalbleiter-Bauteil Group III-nitride power semiconductor component |
04/02/2009 | DE102008046101A1 Bildsensor und Verfahren zu dessen Herstellung Image sensor and method for its production |
04/02/2009 | DE102008045744A1 Halbleiterbauelement mit einer an eine Rückseite eines Chips gekoppelten Elektronikkomponente A semiconductor device having a coupled to a backside of a chip electronic component |
04/02/2009 | DE102008045338A1 Halbleiterbauelement Semiconductor device |
04/02/2009 | DE102008044649A1 Herstellungsverfahren für SIMOX-Wafer und SIMOX-Wafer Manufacturing process for SIMOX wafer and SIMOX wafer |
04/02/2009 | DE102008039939A1 Integriertes Schaltungsbauelement mit einer aus der Gasphase abgeschiedenen Isolationsschicht An integrated circuit device having a deposited from the gas phase insulation layer |
04/02/2009 | DE102008039881A1 Graben-Transistor und Verfahren zur Herstellung desselben Trench transistor and method of manufacturing the same |
04/02/2009 | DE102008038815A1 Integrierte Schaltung mit einer Parylen-Materialschicht Integrated circuit comprising a parylene material layer |
04/02/2009 | DE102008037663A1 Aufbau eines Impulslaser-Ausheilsystems Construction of a pulsed laser Ausheilsystems |
04/02/2009 | DE102008036744A1 Verfahren zum Herstellen von einer Siliziumcarbid-Halbleitervorrichtung A method for producing a silicon carbide semiconductor device |
04/02/2009 | DE102008011254A1 Carrier element's recess closing method for semiconductor component i.e. LED, involves providing screen with openings, filling of recess of carrier element by screen through screen printing of viscous mass, and hardening viscous mass |
04/02/2009 | DE102007053067A1 Verfahren zur Herstellung eines Halbleiterbauelementes und Halbleiterbauelement A process for producing a semiconductor device and semiconductor device |
04/02/2009 | DE102007046969B3 Elektronische Schaltung aus Teilschaltungen und Verfahren zu deren Herstellung und demgemäßer Umrichter oder Schalter Electronic circuit part from circuits and methods for their preparation and demgemäßer converter or switch |
04/02/2009 | DE102007046557A1 Semiconductor structure i.e. DRAM structure, for use as compensation element, has monocrystalline semiconductor layer in recess, and electrically isolating filling material on layer, where filling material fills recess up to narrow gap |
04/02/2009 | DE102007046520A1 Lichtemittierendes Flächenelement und Verfahren zum Herstellen eines lichtemittierenden Flächenelementes The light-emitting surface element and method for manufacturing a light-emitting surface element |
04/02/2009 | DE102007046496A1 Protection encapsulation manufacturing method for Organic LED, involves executing molding process under influence of heat to form cavity at surface of encapsulation element, where cavity accommodates drying agent |
04/02/2009 | DE102007044787A1 Verfahren zum Reinigen einer Halbleiterscheibe A method for cleaning a semiconductor wafer |