Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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04/14/2009 | US7517742 Area diode formation in SOI application |
04/14/2009 | US7517741 Single transistor memory cell with reduced recombination rates |
04/14/2009 | US7517740 Method of crystallizing/activating polysilicon layer and method of fabricating thin film transistor having the same polysilicon layer |
04/14/2009 | US7517739 Printed electronic device and transistor device and manufacturing method thereof |
04/14/2009 | US7517738 Method for producing a semiconductor integrated circuit including a thin film transistor and a capacitor |
04/14/2009 | US7517737 Structures for and method of silicide formation on memory array and peripheral logic devices |
04/14/2009 | US7517736 Structure and method of chemically formed anchored metallic vias |
04/14/2009 | US7517735 Method of manufacturing active matrix substrate, active matrix substrate, electro-optical device, and electronic apparatus |
04/14/2009 | US7517734 Method of manufacturing a wafer level package with a cap structure for hermetically sealing a micro device |
04/14/2009 | US7517733 Leadframe design for QFN package with top terminal leads |
04/14/2009 | US7517732 Thin semiconductor device package |
04/14/2009 | US7517731 Semiconductor package |
04/14/2009 | US7517730 Coreless substrate and manufacturing method thereof |
04/14/2009 | US7517729 Integrated circuit package system with heat slug |
04/14/2009 | US7517728 Semiconductor light emitting devices including a luminescent conversion element |
04/14/2009 | US7517727 Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement |
04/14/2009 | US7517726 Wire bonded chip scale package fabrication methods |
04/14/2009 | US7517725 System and method for separating and packaging integrated circuits |
04/14/2009 | US7517724 Dicing/die bonding sheet |
04/14/2009 | US7517723 Method for fabricating a flip chip system in package |
04/14/2009 | US7517722 Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds |
04/14/2009 | US7517721 Linear actuator and apparatus utilizing the same |
04/14/2009 | US7517720 Method for producing ZnTe system compound semiconductor single crystal, ZnTe system compound semiconductor single crystal, and semiconductor device |
04/14/2009 | US7517719 Method for fabricating a semiconductor element from a dispersion of semiconductor particles |
04/14/2009 | US7517718 Method for fabricating an inorganic nanocomposite |
04/14/2009 | US7517717 Wide dynamic range sensor having a pinned diode with multiple pinned voltages |
04/14/2009 | US7517715 CMOS image sensor and method of fabricating the same |
04/14/2009 | US7517714 Image sensors for reducing dark current and methods of fabricating the same |
04/14/2009 | US7517713 Solid-state image sensor and method for manufacturing thereof as well as semiconductor device and method for manufacturing thereof |
04/14/2009 | US7517712 Wafer-level hermetic micro-device packages |
04/14/2009 | US7517711 MEMS type resonator, process for fabricating the same and communication unit |
04/14/2009 | US7517710 Method of manufacturing field emission device |
04/14/2009 | US7517709 Method of forming backside point contact structures for silicon solar cells |
04/14/2009 | US7517708 Real-time parameter tuning using wafer temperature |
04/14/2009 | US7517707 Manufacturing method of semiconductor integrated circuit device and probe card |
04/14/2009 | US7517706 Method for evaluating quality of semiconductor substrate and method for manufacturing semiconductor substrate |
04/14/2009 | US7517705 Phosphorus-containing polymers for optical signal transducers |
04/14/2009 | US7517703 Method for forming ferroelectric memory device |
04/14/2009 | US7517702 Method for making an electronic device including a poled superlattice having a net electrical dipole moment |
04/14/2009 | US7517641 High performance curable polymers and processes for the preparation thereof |
04/14/2009 | US7517638 Method of manufacturing a semiconductor apparatus with a tapered aperture pattern to form a predetermined line width |
04/14/2009 | US7517621 first point and the second point being symmetric with respect to the center of the illumination, and to a straight line extending through the center of the illumination in a second direction perpendicular to the first direction; patterning the semiconductor |
04/14/2009 | US7517620 Method for fabricating array substrate having color filter on thin film transistor structure for liquid crystal display device |
04/14/2009 | US7517618 Mask, exposure method and production method of semiconductor device |
04/14/2009 | US7517617 Mask blank for use in EUV lithography and method for its production |
04/14/2009 | US7517560 Method of manufacturing substrate having resist film |
04/14/2009 | US7517550 Methods of making combinational structures for electro-luminescent displays |
04/14/2009 | US7517515 Sintering; high density |
04/14/2009 | US7517468 Etching method |
04/14/2009 | US7517466 Method for manufacturing porous structure and method for forming pattern |
04/14/2009 | US7517464 Making a thin film transistor panel of liquid crystal display by wet etching a multilayer metallic structure including a high melting metal film and an Al or alloy film using side etching technique with a photoresist mask; hot water washing to form a protective oxide film and dry etching using the mask |
04/14/2009 | US7517462 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates |
04/14/2009 | US7517444 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
04/14/2009 | US7517431 Spinning apparatus |
04/14/2009 | US7517429 Plasma treatment apparatus |
04/14/2009 | US7517423 Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate |
04/14/2009 | US7517236 Thin film transistor circuit and display utilizing the same |
04/14/2009 | US7517217 Method and apparatus for heat processing of substrate |
04/14/2009 | US7517141 Simultaneous control of deposition time and temperature of multi-zone furnaces |
04/14/2009 | US7517055 Nozzle arrangement for an inkjet printhead with associated actuator drive circuitry |
04/14/2009 | US7516878 Bump formation method and bump forming apparatus for semiconductor wafer |
04/09/2009 | WO2009046380A2 End effector with sensing capabilities |
04/09/2009 | WO2009046311A2 Composite slurries of nano silicon carbide and alumina |
04/09/2009 | WO2009046241A1 Channel stress engineering using localized ion implantation induced gate electrode volumetric change |
04/09/2009 | WO2009046239A1 High performance mosfet |
04/09/2009 | WO2009046219A2 Mosfet active area and edge termination area charge balance |
04/09/2009 | WO2009046210A1 High density fet with integrated schottky |
04/09/2009 | WO2009046148A1 Profile engineered thin film devices and structures |
04/09/2009 | WO2009046114A2 Two-transistor floating-body dynamic memory cell |
04/09/2009 | WO2009046032A1 Method and apparatus for shaping gas profile near bevel edge |
04/09/2009 | WO2009046026A1 Retention improvement in dual-gate memory |
04/09/2009 | WO2009045964A1 Low temperature conformal oxide formation and applications |
04/09/2009 | WO2009045864A2 Methods of low-k dielectric and metal process integration |
04/09/2009 | WO2009045863A1 Semiconductor device and method for manufacturing thereof |
04/09/2009 | WO2009045859A1 Method and structure for dividing a substrate into individual devices |
04/09/2009 | WO2009045858A1 Structure and method of forming a topside contact to a backside terminal of a semiconductor device |
04/09/2009 | WO2009045844A2 Non contact substrate chuck |
04/09/2009 | WO2009045803A1 Ball grid array assembly and solder pad |
04/09/2009 | WO2009045747A1 Method and material for purifying iron disilicide for photovoltaic application |
04/09/2009 | WO2009045736A1 Charge neutralization in a plasma processing apparatus |
04/09/2009 | WO2009045722A1 Two-diemensional uniformity correction for ion beam assisted etching |
04/09/2009 | WO2009045718A1 Method to improve a copper/dielectric interface in semiconductor devices |
04/09/2009 | WO2009045712A1 Self-assembly of micro-structures |
04/09/2009 | WO2009045711A1 Alignment features for proximity communication |
04/09/2009 | WO2009045635A2 Phase change memory structures |
04/09/2009 | WO2009045565A1 Roll to roll evaporation tool for solar absorber precursor formation |
04/09/2009 | WO2009045394A1 Quantum well intermixing |
04/09/2009 | WO2009045371A2 Flip chip interconnection with double post |
04/09/2009 | WO2009045364A1 Method of forming high-k gate electrode structures after transistor fabrication |
04/09/2009 | WO2009045362A1 Semiconductor structure comprising an electrically conductive feature and method of forming a semiconductor structure |
04/09/2009 | WO2009045347A1 Method for reducing pillar structure dimensions of a semiconductor device |
04/09/2009 | WO2009045293A2 Photovoltaic devices including an interfacial layer |
04/09/2009 | WO2009045250A1 Semiconductor processing |
04/09/2009 | WO2009045217A1 Parasitic particle suppression in the growth of iii-v nitride films using mocvd and hvpe |
04/09/2009 | WO2009045102A2 An electronic circuit element with profiled photopatternable dielectric layer |
04/09/2009 | WO2009045050A2 Fluidic channel system and method for fabricating fine structure |
04/09/2009 | WO2009044975A1 Probe card |
04/09/2009 | WO2009044958A1 Via using zn or zn alloys and its making method, 3d chip stack packages using thereof |
04/09/2009 | WO2009044922A1 Functional base, process for producing thin-film element structure, and method for transferring thin-film element structure onto other substrate |
04/09/2009 | WO2009044917A1 Semiconductor substrate and semiconductor device |