Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2009
04/15/2009CN201220960Y Novel depositional ring
04/15/2009CN201220227Y Rotating component
04/15/2009CN101411251A Method for forming bump and device for forming bump
04/15/2009CN101411248A Electronic system comprising slots for any possible excess fusible material, and corresponding assembly method
04/15/2009CN101410998A Multiple gate printed transistor method and apparatus
04/15/2009CN101410991A Localized annealing during semiconductor device fabrication
04/15/2009CN101410988A Trench widening without merging
04/15/2009CN101410987A Trench-gate semiconductor device and method of fabrication thereof
04/15/2009CN101410979A Scalable flash EEPROM memory cell with notched floating gate and graded source region
04/15/2009CN101410974A Electrically enhanced wirebond package
04/15/2009CN101410973A Wafer-level chip scale package and method for fabricating and using the same
04/15/2009CN101410969A Semiconductor integrated circuit devices having high-Q wafer back-side capacitors
04/15/2009CN101410968A Improved CMOS devices with stressed channel regions, and methods for fabricating the same
04/15/2009CN101410967A Dual wired integrated circuit chips
04/15/2009CN101410966A Trench isolation structure having an expanded portion thereof
04/15/2009CN101410965A Method and structure for eliminating aluminum terminal pad material in semiconductor devices
04/15/2009CN101410964A Aluminum leadframes for semiconductor QFN/SON devices
04/15/2009CN101410963A Nanowire transistor with surrounding gate
04/15/2009CN101410962A Programmable structure including control gate overlying select gate formed in a trench
04/15/2009CN101410961A Grown nanofin transistors
04/15/2009CN101410960A Structure and fabrication method of a selectively deposited capping layer on an epitaxially grown source drain
04/15/2009CN101410959A Bipolar transistor with dual shallow trench isolation and low base resistance
04/15/2009CN101410958A Plasma CVD apparatus, method for forming thin film and semiconductor device
04/15/2009CN101410957A High aspect ratio contacts
04/15/2009CN101410956A Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing
04/15/2009CN101410955A Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical poli
04/15/2009CN101410954A Method of substrate treatment, process for producing semiconductor device, substrate treating apparatus, and memory medium
04/15/2009CN101410953A Method of substrate treatment, process for producing semiconductor device, substrate treating apparatus, and memory medium
04/15/2009CN101410952A Method for seed film formation, plasma film forming apparatus, and memory medium
04/15/2009CN101410951A Low-gidl mosfet structure and method for fabrication
04/15/2009CN101410950A Growth method using nanostructure compliant layers and HVPE for producing high quality compound semiconductor materials
04/15/2009CN101410949A Movable-body apparatus, exposure apparatus and methods comprising same, micro-motion body and device manufacturing methods
04/15/2009CN101410948A Exposure method and apparatus, maintenance method and device manufacturing method
04/15/2009CN101410947A Method of repairing a polymer mask
04/15/2009CN101410946A Lighting optical system, exposure system, and device production method
04/15/2009CN101410945A Mobile body drive method and mobile body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
04/15/2009CN101410944A High yield high density on-chip capacitor design
04/15/2009CN101410943A Method and structure for creation of a metal insulator metal capacitor
04/15/2009CN101410942A Symmetrical MIM capacitor design
04/15/2009CN101410941A Post-etch treatment system for removing residue on a substrate
04/15/2009CN101410940A Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species
04/15/2009CN101410939A Method of separating a structure in a semiconductor device
04/15/2009CN101410930A Insulator system for a terminal structure of an ion implantation system
04/15/2009CN101410929A Ion implanter with variable scan frequency
04/15/2009CN101410914A Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor
04/15/2009CN101410907A Multiple port memory having a plurality of parallel connected trench capacitors in a cell
04/15/2009CN101410897A Disc master exposure device and method for adjusting same
04/15/2009CN101410749A System and method of monitoring, predicting and optimizing production yields in a liquid crystal display (LCD) manufacturing process
04/15/2009CN101410557A Semiconductor substrate, electronic device, optical device, and production methods therefor
04/15/2009CN101410549A Microwave plasma CVD system
04/15/2009CN101410548A Liquid material vaporizer
04/15/2009CN101410547A Pallet based system for forming thin-film solar cells
04/15/2009CN101410503A Improved alkaline solutions for post CMP cleaning processes
04/15/2009CN101410226A Conveying position alignment method for conveying system
04/15/2009CN101410224A Double side wafer grinder and methods for assessing workpiece nanotopology
04/15/2009CN101409975A Method for controlling and accelerating plasma glow start
04/15/2009CN101409974A Plasma reaction chamber and method for improving plasma distribution uniformity
04/15/2009CN101409520A Solar power source
04/15/2009CN101409320A Method for preparing substrate
04/15/2009CN101409318A LED chip and manufacturing method thereof
04/15/2009CN101409313A Method for preparing silicon solar battery pile face in magnetic field
04/15/2009CN101409309A Flash memory device and method of fabricating the same
04/15/2009CN101409307A Semiconductor device and method of manufacturing the same
04/15/2009CN101409306A Thyristor with improved conduction performance, thyristor device and method for producing the same
04/15/2009CN101409305A Organic electroluminescence device and method for manufacturing the same
04/15/2009CN101409302A Phase-change memory array and manufacturing method thereof
04/15/2009CN101409301A Solid state imaging device, its manufacturing method, and imaging device
04/15/2009CN101409300A Backside illuminated image sensor and manufacture method thereof
04/15/2009CN101409298A Imaging apparatus and assembling method thereof
04/15/2009CN101409297A Three-dimensional quantum well NMOS integrated component and preparation method thereof
04/15/2009CN101409296A Three-dimensional strain NMOS integrated device and preparation method thereof
04/15/2009CN101409295A Poly-SiGe gate three-dimensional quantum well CMOS integrated device and preparation method thereof
04/15/2009CN101409294A Three-dimensional quantum well CMOS integrated device and preparation method thereof
04/15/2009CN101409293A Poly-SiGe gate three-dimensional strain CMOS integrated component and preparation method thereof
04/15/2009CN101409292A SOI three-dimensional CMOS integrated component and preparation method thereof
04/15/2009CN101409291A Nonvolatile semiconductor storage device, and method for controlling nonvolatile semiconductor storage device
04/15/2009CN101409290A Non-volatile memory device, method of operating the same, and method of fabricating the same
04/15/2009CN101409288A Semiconductor device with contact stabilization and method for manufacturing the same
04/15/2009CN101409285A Semiconductor device and a method of manufacturing the same
04/15/2009CN101409284A Voltage-controlled capacitive element and semiconductor integrated circuit
04/15/2009CN101409282A Thin film transistor substrate, display device having the same and method of manufacturing the same
04/15/2009CN101409279A Semiconductor device including electronic component coupled to a backside of a chip
04/15/2009CN101409277A Assembly comprising an electromagnetically screened SMD component, method and use
04/15/2009CN101409273A Ball-placing side surface structure for package substrate and manufacturing method thereof
04/15/2009CN101409270A Metallic conduction structure applying for module integrated circuit and preparation method thereof
04/15/2009CN101409269A Conductive structure for semiconductor integrated circuit and method of forming the same
04/15/2009CN101409267A Semiconductor device and method of manufacturing the same
04/15/2009CN101409266A Package structure
04/15/2009CN101409265A Substrate for semiconductor package structure, semiconductor package structure and manufacturing method thereof
04/15/2009CN101409263A Pixel structure, display panel and method for manufacturing optoelectronic device
04/15/2009CN101409262A Pixel structure and manufacturing method thereof
04/15/2009CN101409261A Technological method for forming high voltage gate oxygen structure
04/15/2009CN101409260A Method of forming poly pattern in R-string of LCD drive IC and structure of the same
04/15/2009CN101409259A Light emitting device, its manufacturing method, and operation method of manufacturing device
04/15/2009CN101409258A Optical sensor and manufacturing method thereof
04/15/2009CN101409257A Optical sensor and manufacturing method thereof
04/15/2009CN101409256A Object cutting method
04/15/2009CN101409255A Method for forming double-mosaic pattern of semiconductor device
04/15/2009CN101409254A Silicon nitride read-only memory and method for manufacturing word line thereof
04/15/2009CN101409253A Clamper for cleaning and degumming silicon chip