Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2009
04/15/2009CN101409252A Spin head, chuck pin used in the spin head, and method for treating a substrate with the spin head
04/15/2009CN101409251A Electrostatic chuck apparatus
04/15/2009CN101409250A Containment of a number of electronic components with suction channels with a pneumatic adjustment element
04/15/2009CN101409249A DC electrode for semiconductor equipment
04/15/2009CN101409248A Two-dimensional motion platform
04/15/2009CN101409247A Substrate support unit and device for processing substrate by the same
04/15/2009CN101409246A Crystal boat box with inlet valve
04/15/2009CN101409245A Automatic control silicon chip check system
04/15/2009CN101409244A Method for monitoring technique microparticle and defect of wafer surface
04/15/2009CN101409243A Method for implementing thick copper wire down-lead bonding
04/15/2009CN101409242A Method for improving corrosion resistance of bonding point
04/15/2009CN101409241A Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
04/15/2009CN101409240A Intelligent label capable of using chip and equipment for producing flip-chip module
04/15/2009CN101409239A Method for manufacturing wiring plate
04/15/2009CN101409238A Method for preparing seedless layer package substrate
04/15/2009CN101409237A Method for manufacturing semiconductor device
04/15/2009CN101409236A Method for manufacturing semiconductor device
04/15/2009CN101409235A Procedure for preparing field effect tube chip back face
04/15/2009CN101409234A Semiconductor structure and manufacture method thereof
04/15/2009CN101409233A Method for depositing group III/V compounds
04/15/2009CN101409232A Method for forming polysilicon film
04/15/2009CN101409231A Method for growing semiconductor layer, method for producing semiconductor light-emitting element, semiconductor light-emitting element, and electronic device
04/15/2009CN101409230A Method for preparing polycrystalline silicon layer
04/15/2009CN101409229A Epitaxial substrate and manufacturing method thereof, and method for manufacturing LED device
04/15/2009CN101409228A Infrared rapid heat-treatment cavity for semiconductor chip with movable heat baffle
04/15/2009CN101409227A Plasma treatment system as well as cooling device and method thereof
04/15/2009CN101409226A Method for vertical transfer of semiconductor substrates in a cleaning module
04/15/2009CN101409225A Ultraviolet irradiation method and apparatus using the same
04/15/2009CN101409224A Brush assembly and substrate cleaning device having the same
04/15/2009CN101409223A Manufacturing method of semiconductor device
04/15/2009CN101409222A Method for manufacturing SOI substrate
04/15/2009CN101409221A Manufacturing method of semiconductor device
04/15/2009CN101409220A Inlet port mechanism for introducing object and treatment system
04/15/2009CN101409219A Substrate support unit, and substrate treating apparatus and method using the same
04/15/2009CN101409218A Single substrate cleaning apparatus and method for cleaning backside of substrate
04/15/2009CN101409217A Method of forming an electrical circuit with overlaying integration layer
04/15/2009CN101409216A Manufacturing method of SOI substrate
04/15/2009CN101409215A Method for manufacturing SOI substrate and semiconductor device
04/15/2009CN101409214A Method of manufacturing semiconductor device
04/15/2009CN101409213A Gas supply device, semiconductor manufacturing device and component for gas supply device
04/15/2009CN101409212A Apparatus and method for treating substrate
04/15/2009CN101409211A Substrate processing apparatus and method of cleaning the same
04/15/2009CN101409210A Semiconductor element and preparation method thereof
04/15/2009CN101409209A Method for cleaning abnormal residual on wafer rear surface after Cu CMP procedure
04/15/2009CN101409208A Electric incandescent lamp and light irradiation type heat treatment device
04/15/2009CN101409126A Inductance coupling coil and inductance coupling plasma apparatus
04/15/2009CN101409113A Composition for fabrication of electrode, electrode fabricated using the same, plasma display panel, and associated methods
04/15/2009CN101408763A IC chip control line key choosing structure on circuit board
04/15/2009CN101408753A Method and apparatus for controlling process terminal
04/15/2009CN101408734A Exposure apparatus and device manufacturing method
04/15/2009CN101408704A Pixel structure of semi-penetrating trans liquid crystal display panel and manufacturing method thereof
04/15/2009CN101408694A Method for preparing pixel structure of semi-penetrating inverse LCD device
04/15/2009CN101408650A Method of making circuitized substrate with internal optical pathway
04/15/2009CN101408649A Method of making circuitized substrate with internal optical pathway using photolithography
04/15/2009CN101408285A Illuminating apparatus generating continuous variable pupil
04/15/2009CN101408250A Valve and apparatus and method for treating substrate using the same
04/15/2009CN101408249A Sluice valve and substrate processing apparatus using the same
04/15/2009CN101407910A Film forming device for processing semiconductor
04/15/2009CN101407284A Substrate conveying device
04/15/2009CN101407283A Substrate conveying device
04/15/2009CN101407040A Face lapping mill with abrasive disk cooling mechanism
04/15/2009CN101407035A Grinding method for wafer
04/15/2009CN100479636C Method for soldering electronic component comprising a welding disk on substrate
04/15/2009CN100479633C Layered pattern producing method, distribution producing method and method for producing electronic equipment
04/15/2009CN100479631C Method of manufacturing package substrate with fine circuit pattern using anodic oxidation
04/15/2009CN100479220C Organic electronic device and its manufacturing method
04/15/2009CN100479213C Light emitting device and method of manufacturing the same
04/15/2009CN100479211C A method for equable glue filling of LED and corresponding glue filler
04/15/2009CN100479197C 光接收器封装件 Optical receiver package
04/15/2009CN100479192C Organic thin film transistor and flat panel display comprising the same
04/15/2009CN100479191C MOSFET device and its making method
04/15/2009CN100479190C Field effect transistor structure and method of making same
04/15/2009CN100479189C Manufacturing method of semiconductor device
04/15/2009CN100479188C Manufacturing method of a body silicon MOS transistor
04/15/2009CN100479187C Trench MOSFET technology for DC-DC converter applications
04/15/2009CN100479185C Resistance device and mfg. method
04/15/2009CN100479184C Wiring method for detection wire of organic electroluminescent display device
04/15/2009CN100479182C Organic el display and method for manufacturing the same
04/15/2009CN100479181C Electro-optical device and electronic device
04/15/2009CN100479180C Display device and a method of manufacturing the display device
04/15/2009CN100479176C Video sensing element and method for making the same
04/15/2009CN100479175C Solid-state imaging device and method for manufacturing the same
04/15/2009CN100479172C Electro-optic display and manufacturing method thereof
04/15/2009CN100479170C Electronic device and method of manufacturing the same
04/15/2009CN100479169C Method for forming at least part of bi-bit storage core array on semiconductor substrate
04/15/2009CN100479168C Eeprom device having selecting transistors and method of fabricating the same
04/15/2009CN100479167C Sram cells
04/15/2009CN100479165C Sram cell and mfg. method thereof
04/15/2009CN100479164C Semiconductor structure and method for forming same
04/15/2009CN100479162C Semiconductor component and its making method
04/15/2009CN100479161C Semiconductor device and method of manufacturing same
04/15/2009CN100479159C Integrated circuit devices having an epitaxial pattern with a void region formed therein and methods of forming the same
04/15/2009CN100479158C Fet channel having a strained lattice structure along multiple surfaces
04/15/2009CN100479157C Manufacturing method of metal-isolating layer-metal capacitor
04/15/2009CN100479156C Method and technique for corroding IC structure
04/15/2009CN100479154C Light emitting diode packaging structure and method capable of increasing luminous efficiency
04/15/2009CN100479152C Semiconductor device, electronic appts. their mfg. methods and electronic instrument
04/15/2009CN100479148C Test key for checking up intraconnection and method for checking intraconnection
04/15/2009CN100479146C Interconnection structure and forming method thereof
04/15/2009CN100479145C Method for manufacturing inner connecting line possessing antireflection coating and structure thereof