| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/16/2009 | DE102008045488A1 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same |
| 04/16/2009 | DE102008044740A1 Apparat zum Montieren leitender Kugeln Apparatus for mounting conductive balls |
| 04/16/2009 | DE102008039560A1 Verfahren zur Herstellung einer integrierten Schaltung mit Spannungsverstärkung A process for producing an integrated circuit comprising voltage gain |
| 04/16/2009 | DE102008039389A1 Halbleiterbauelement Semiconductor device |
| 04/16/2009 | DE102008039388A1 Gestapelte Halbleiterchips Stacked semiconductor chips |
| 04/16/2009 | DE102008038552A1 Vertikaldiode unter Verwendung von Silizium, ausgebildet durch selektives epitaxiales Aufwachsen Vertical diode using silicon, is formed by selective epitaxial growth |
| 04/16/2009 | DE102008035911A1 Verfahren zum Herstellen eines integrierten Schaltungsmoduls A method of manufacturing an integrated circuit module |
| 04/16/2009 | DE102007049160A1 Verfahren zum Vereinzeln von zu einer Gruppe zusammengefassten, einen Kunststoffvergusskörper aufweisenden Chipgehäusen A method for separating a group summarized, a Kunststoffvergusskörper having chip packages |
| 04/16/2009 | DE102007049103A1 System for determining correct position of mask in storage of coordinate measuring machine, has coordinate measuring machine, where each storage is assigned to ultrasonic system |
| 04/16/2009 | DE102007048749A1 Thermal generator for direct conversion of thermal energy into electrical energy, has linear structures integrated into substrates and made from thermoelectric material e.g. germanium, with high electrical and thermal conductivity |
| 04/16/2009 | DE102007048332A1 Verbund aus mindestens zwei Halbleitersubstraten sowie Herstellungsverfahren Composite of at least two semiconductor substrates and manufacturing method |
| 04/16/2009 | DE102007048295A1 Vorrichtung und Verfahren zur Dickenmessung Apparatus and method for measuring the thickness |
| 04/16/2009 | DE102007048178A1 Method for manufacturing metal-insulator-metal trench capacitor, involves providing substrate with metal layer and insulator layer separated by metal layer, and opening is formed for vias in insulator layer |
| 04/16/2009 | DE102007046849A1 Verfahren zur Herstellung von Gateelektrodenstrukturen mit großem ε nach der Transistorherstellung Process for the preparation of gate electrode structures with large ε after the transistor fabrication |
| 04/16/2009 | DE102007030054B4 Transistor mit reduziertem Gatewiderstand und verbesserter Verspannungsübertragungseffizienz und Verfahren zur Herstellung desselben Of the same transistor with reduced gate resistance and improved stress transfer efficiency and methods for preparing |
| 04/16/2009 | DE102006052693B4 Verfahren zur Fertigung eines Halbleitersensors A method for manufacturing a semiconductor sensor |
| 04/16/2009 | DE102006046363B4 Verfahren zum Verringern von Kristalldefekten in Transistoren mit wieder aufgewachsenen flachen Übergängen durch geeignetes Auswählen von Kristallorientierungen A method for reducing crystal defects in transistors with shallow junctions again grown by suitably selecting crystal orientations |
| 04/16/2009 | DE102006033864B4 Elektronische Schaltung in einer Package-in-Package-Konfiguration und Herstellungsverfahren für eine solche Schaltung Electronic circuit in a package-on-package configuration and manufacturing method for such a circuit |
| 04/16/2009 | DE102006030267B4 Nano-Einprägetechnik mit erhöhter Flexibilität in Bezug auf die Justierung und die Formung von Strukturelementen Nano-imprint technique with increased flexibility in terms of the adjustment and the formation of structural elements |
| 04/16/2009 | DE102005027447B4 Verfahren zur Erhöhung der Randsperrfähigkeit eines Leistungshalbleiterbauelements A method of increasing the edge blocking capability of a power semiconductor component |
| 04/16/2009 | DE102005025123B4 Verfahren und Einrichtung zur nasschemischen Behandlung von großflächigen Substraten, insbesondere zur Herstellung von Solarzellen Method and apparatus for wet-chemical treatment of large-area substrates, in particular for producing solar cells |
| 04/16/2009 | DE102004058708B4 Polierkopf, Poliervorrichtung sowie Polierverfahren Polishing head, polishing apparatus and polishing method |
| 04/16/2009 | DE102004050358B4 Ätzzusammensetzung, Verfahren zu ihrer Herstellung und Verwendung derselben Etching composition, process for their preparation and use thereof |
| 04/16/2009 | DE102004010676B4 Verfahren zur Herstellung eines Halbleiterwafers A process for producing a semiconductor wafer |
| 04/16/2009 | DE10000754B4 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
| 04/15/2009 | EP2048923A2 Method of manufacturing silicon substrate with a conductive through-hole |
| 04/15/2009 | EP2048720A2 Piezoelectic-actuator driving device and exposure apparatus including the same |
| 04/15/2009 | EP2048712A2 Electronic device manufacturing method and electronic device |
| 04/15/2009 | EP2048710A1 High temperature packaging for semiconductor devices |
| 04/15/2009 | EP2048709A2 Non-volatile memory device, method of operating the same, and method of fabricating the same |
| 04/15/2009 | EP2048708A1 Semiconductor integrated circuit device |
| 04/15/2009 | EP2048707A1 Patterns of conductive objects on a substrate and method of producing thereof |
| 04/15/2009 | EP2048706A1 Transfer method with a treatment of a surface to be bonded |
| 04/15/2009 | EP2048705A2 Manufacturing method of SOI substrate |
| 04/15/2009 | EP2048704A1 Mounting method, mounting structure, method for manufacturing electronic equipment, electronic equipment, method for manufacturing light emitting diode display, and light emitting diode display |
| 04/15/2009 | EP2048703A1 End point detectable plasma etching method and plasma etching apparatus |
| 04/15/2009 | EP2048702A2 Method for cleaning silicon wafer |
| 04/15/2009 | EP2048701A2 Edge removal of silicon-on-insulator transfer wafer |
| 04/15/2009 | EP2048700A2 Antireflective coatings |
| 04/15/2009 | EP2048699A2 Antireflective coatings for photovoltaic applications |
| 04/15/2009 | EP2048698A1 Object cutting method |
| 04/15/2009 | EP2048697A1 Method for reusing removed wafer |
| 04/15/2009 | EP2048696A2 Process for manufacturing silicon wafers for solar cell |
| 04/15/2009 | EP2048695A2 Containment of a number of electronic components with suction channels with a pneumatic adjustment element |
| 04/15/2009 | EP2048694A1 Thin plate storage container |
| 04/15/2009 | EP2048429A1 Illuminating device, illuminating method, light detector and light detecting method |
| 04/15/2009 | EP2048267A1 Process for producing single-crystal substrate with off angle |
| 04/15/2009 | EP2048209A1 Adhesive composition, and connection structure for circuit member |
| 04/15/2009 | EP2048208A2 Free radical-forming activator attached to solid and used to enhanced CMP formulations |
| 04/15/2009 | EP2048171A1 Insulating layer, electronic device, field effect transistor, and polyvinylthiophenol |
| 04/15/2009 | EP2048146A2 Novel tantalum and niobium compounds |
| 04/15/2009 | EP2048128A1 Polymerizable compound having adamantane structure, process for production of the same, and resin composition |
| 04/15/2009 | EP2047606A2 Dual inductor circuit for multi-band wireless communication device |
| 04/15/2009 | EP2047512A1 Organic transistor and active matrix display |
| 04/15/2009 | EP2047511A2 Method of manufacturing a semiconductor device and a device manufactured by the method |
| 04/15/2009 | EP2047507A2 Substrate carrier enclosure |
| 04/15/2009 | EP2047506A2 Interconnect structure and process of making the same |
| 04/15/2009 | EP2047505A2 An interconnect structure with dielectric air gaps |
| 04/15/2009 | EP2047504A2 Method for removing nanoclusters from selected regions |
| 04/15/2009 | EP2047503A1 Plasma chamber cathode and outer ring made of silicon material |
| 04/15/2009 | EP2047502A2 Nanocrystal formation |
| 04/15/2009 | EP2047501A1 Deposition of group iii-nitrides on ge |
| 04/15/2009 | EP2047500A1 Metal filled through via structure for providing vertical wafer-to wafer interconnection |
| 04/15/2009 | EP2047209A1 Device for characterizing unique objects |
| 04/15/2009 | EP2046893A2 Silicone resin and silicone composition |
| 04/15/2009 | EP2046531A2 System and method for processing high purity materials |
| 04/15/2009 | EP2003679A9 Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method and device manufacturing method |
| 04/15/2009 | EP2003506A9 Reflective, refractive and projecting optical system; reflective, refractive and projecting device; scanning exposure device; and method of manufacturing micro device |
| 04/15/2009 | EP1943320B1 Method for testing a slurry used to form a semiconductor device |
| 04/15/2009 | EP1846947A4 Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow |
| 04/15/2009 | EP1825509A4 Dual stressed soi substrates |
| 04/15/2009 | EP1779440A4 Metal-insulator varactor devices |
| 04/15/2009 | EP1777278B1 Adhesive composition and sheet having an adhesive layer of the composition |
| 04/15/2009 | EP1723676A4 Nano-enabled memory devices and anisotropic charge carrying arrays |
| 04/15/2009 | EP1655765B1 Exposure method |
| 04/15/2009 | EP1595289A4 Thermal interconnect systems methods of production and uses thereof |
| 04/15/2009 | EP1586111B1 Wirebonding method and apparatus |
| 04/15/2009 | EP1503403B1 Reticle and optical characteristic measuring method |
| 04/15/2009 | EP1474811B1 Process for forming an embedded resistor |
| 04/15/2009 | EP1382065A4 Electropolishing metal layers on wafers having trenches or vias with dummy structures |
| 04/15/2009 | EP1359610B1 Substrate heating device |
| 04/15/2009 | EP1354351B1 Direct build-up layer on an encapsulated die package |
| 04/15/2009 | EP1307919A4 Electrical passivation of silicon-containing surfaces using organic layers |
| 04/15/2009 | EP1304746B1 Method of manufacturing a thin-film transistor |
| 04/15/2009 | EP1235947A4 Method and apparatus for substrate biasing in multiple electrode sputtering systems |
| 04/15/2009 | EP1183134B1 Abrasive tools for grinding electronic components |
| 04/15/2009 | EP1129488B1 Method for producing thin-film transistors |
| 04/15/2009 | EP1100128B1 Method of manufacture of a semiconductor device |
| 04/15/2009 | CN201222603Y Equipment for taking conductor head |
| 04/15/2009 | CN201222602Y Semiconductor conductor processing mechanism |
| 04/15/2009 | CN201222601Y Conductor molding mold |
| 04/15/2009 | CN201222600Y Semiconductor conductor forming mechanism |
| 04/15/2009 | CN201222507Y Quartz boat for solar cell diffusion technology |
| 04/15/2009 | CN201222493Y Multipurpose clamper for bonding machine workstation |
| 04/15/2009 | CN201222492Y Fixed device and system |
| 04/15/2009 | CN201222491Y Auxiliary fixture for silicon chip loading box |
| 04/15/2009 | CN201222490Y Bonding wire pressing claw capable of improving welding quality |
| 04/15/2009 | CN201222489Y Drive device for binding machine rotational axis |
| 04/15/2009 | CN201222488Y Water block anti-pollution device |
| 04/15/2009 | CN201220964Y Auxiliary tooling for etching silicon chip |