| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/07/2009 | WO2009057665A1 Thin film active element group, thin film active element array, organic light emitting device, display device and method for manufacturing thin film active element group |
| 05/07/2009 | WO2009057660A1 Half-tone mask, half-tone mask blank and method for manufacturing half-tone mask |
| 05/07/2009 | WO2009057638A1 Positive photosensitive resin composition, method for forming pattern, electronic component |
| 05/07/2009 | WO2009057632A1 Apparatus for connecting utility medium supply member, stage apparatus, apparatus for supporting projection optical system, and exposure apparatus |
| 05/07/2009 | WO2009057614A1 Electronic device, electronic device manufacturing method, and mounting board |
| 05/07/2009 | WO2009057612A1 Circuit connecting material and connecting structure for circuit member |
| 05/07/2009 | WO2009057601A1 Iii nitride electronic device and iii nitride semiconductor epitaxial substrate |
| 05/07/2009 | WO2009057589A1 Capacitor, semiconductor device comprising the same, and method for manufacturing capacitor |
| 05/07/2009 | WO2009057583A1 Plasma processing system and plasma processing method |
| 05/07/2009 | WO2009057582A1 Electrical connection body and method for fabricating the same |
| 05/07/2009 | WO2009057530A1 Adhesive composition for semiconductor and semicondutor device produced using the adhesive composition |
| 05/07/2009 | WO2009057514A1 Organic transistor, organic transistor array, and display device |
| 05/07/2009 | WO2009057513A1 Vacuum gate valve, and gate opening/closing method using the gate valve |
| 05/07/2009 | WO2009057504A1 Magnetoresistive element, magnetic random access memory, and initialization method thereof |
| 05/07/2009 | WO2009057482A1 Semiconductor mounting apparatus and semiconductor mounting method |
| 05/07/2009 | WO2009057469A1 Method for forming silicon dots |
| 05/07/2009 | WO2009057458A1 Composition for forming resist underlayer film and method of forming resist pattern from the same |
| 05/07/2009 | WO2009057444A1 Circuit board and display device |
| 05/07/2009 | WO2009057428A1 Magnetoresistive effect memory device |
| 05/07/2009 | WO2009057422A1 Copper anode or phosphorus-containing copper anode, method for electroplating copper on semiconductor wafer, and semiconductor wafer with particle not significantly deposited thereon |
| 05/07/2009 | WO2009057405A1 Machine and method for mounting electronic component |
| 05/07/2009 | WO2009057395A1 Substrate cleaning method for removing oxide film |
| 05/07/2009 | WO2009057385A1 Power amplifier and power amplifier control method |
| 05/07/2009 | WO2009057376A1 Circuit connecting material, connection structure and method for producing the same |
| 05/07/2009 | WO2009057258A1 Work polishing head, and polishing apparatus having the polishing head |
| 05/07/2009 | WO2009057225A1 Semiconductor device and its manufacturing method |
| 05/07/2009 | WO2009057223A1 Surface treating apparatus and method for substrate treatment |
| 05/07/2009 | WO2009057203A1 Abnormality detecting device for detecting abnormality of contact section of contact arm |
| 05/07/2009 | WO2009057194A1 Semiconductor structure, and manufacturing method for that semiconductor structure |
| 05/07/2009 | WO2009057185A1 Cvd device |
| 05/07/2009 | WO2009057015A1 Trench gate mosfet and method of manufacturing the same |
| 05/07/2009 | WO2009057010A1 Multilayer structure and method of producing the same |
| 05/07/2009 | WO2009056491A1 Cmp slurry composition and process for planarizing copper containing surfaces provided with a diffusion barrier layer |
| 05/07/2009 | WO2009056478A2 Strained semiconductor-on-insulator by si:c combined with porous process |
| 05/07/2009 | WO2009056471A1 Hybrid orientation semiconductor structure with reduced boundary defects and method of forming same |
| 05/07/2009 | WO2009056469A1 Foil perforating needle for detaching a small die from a foil |
| 05/07/2009 | WO2009056468A1 Pick-up tool and method for grasping and mounting small dies |
| 05/07/2009 | WO2009056417A1 Method for enabling multiple vt devices using high-k metal gate stacks |
| 05/07/2009 | WO2009056235A2 Multilayer system comprising contact elements, and method for the production of a contact element for a multilayer system |
| 05/07/2009 | WO2009055992A1 Plating apparatus for metallization on semiconductor workpiece |
| 05/07/2009 | WO2009055989A1 Method and apparatus to prewet wafer surface for metallization from electrolyte solution |
| 05/07/2009 | WO2009055862A1 Method of component assembly on a substrate |
| 05/07/2009 | WO2009038441A3 Method for etching glass or metal substrates using negative photoresist and method for fabricating cliche using the same |
| 05/07/2009 | WO2009036053A3 Tuning via facet with minimal rie lag |
| 05/07/2009 | WO2009035268A3 Room temperature-operating single-electron device and the fabrication method thereof |
| 05/07/2009 | WO2009032576A3 Method to fabricate adjacent silicon fins of differing heights |
| 05/07/2009 | WO2009032230A3 A cmos device having gate insulation layers of different type and thickness and method of forming the same |
| 05/07/2009 | WO2009029942A3 Mechanically integrated and closely coupled print head and mist source |
| 05/07/2009 | WO2009029938A3 Apparatus for anisotropic focusing |
| 05/07/2009 | WO2009029532A3 Thermocouple |
| 05/07/2009 | WO2009014741A9 A plasma processing method for forming a film and an electronic component manufactured by the method |
| 05/07/2009 | WO2009013255A3 Method for transferring an epitaxial layer from a donor wafer to a system wafer appertaining to microsystems technology |
| 05/07/2009 | WO2008122891A3 Binding of costituents having a high mobility in an electronic connection |
| 05/07/2009 | WO2008118824A3 Signaling circuit and method for integrated circuit devices and systems |
| 05/07/2009 | WO2008118531A3 Oxide-containing film formed from silicon |
| 05/07/2009 | WO2008046785A3 Method for stabilizing and functionalizing porous metallic layers |
| 05/07/2009 | WO2007118121A3 Method and structure for fabricating solar cells using a layer transfer process |
| 05/07/2009 | WO2007067330A3 Leadless semiconductor package and method of manufacture |
| 05/07/2009 | WO2007059220A3 Methods to shape the electric field in electron devices, passivate dislocations and point defects, and enhance the luminescence efficiency of optical devices |
| 05/07/2009 | WO2007056708A3 A strain-compensated metastable compound base heterojunction bipolar transistor |
| 05/07/2009 | WO2007055849A3 Multi-step system and method for curing a dielectric film |
| 05/07/2009 | WO2007047822A3 Nanoporous low-k films with infiltrated porosity |
| 05/07/2009 | WO2007040798A3 Method to improve transmittance of an encapsulating film |
| 05/07/2009 | WO2007040717A3 Process and system for etching doped silicon |
| 05/07/2009 | WO2007035731A3 Defectivity and process control of electroless deposition in microelectronics applications |
| 05/07/2009 | WO2007030327A3 High temperature microelectromechanical (mem) devices and fabrication method |
| 05/07/2009 | WO2007022145A3 Cleanspace fabricator support and method |
| 05/07/2009 | WO2007014320A3 Method and structure for fabricating multiple tile regions onto a plate using a controlled cleaving process |
| 05/07/2009 | WO2007002140A3 A cold-walled vessel process for compounding, homogenizing and consolidating semiconductor compounds |
| 05/07/2009 | WO2006138496A3 Remote chip attachment |
| 05/07/2009 | WO2006138491A3 Back-to-front via process |
| 05/07/2009 | WO2006107573A3 High strip rate downstream chamber |
| 05/07/2009 | WO2006104921A3 A plasma enhanced atomic layer deposition system and method |
| 05/07/2009 | WO2006072022A3 Electronic device including a guest material within a layer and a process for forming the same |
| 05/07/2009 | US20090119635 Mask pattern correction method for manufacture of semiconductor integrated circuit device |
| 05/07/2009 | US20090119069 Method for determining relative swing curve amplitude |
| 05/07/2009 | US20090117871 Switch circuit and method of switching radio frequency signals |
| 05/07/2009 | US20090117829 Polishing slurry for metal, and polishing method |
| 05/07/2009 | US20090117828 Polishing apparatus and substrate processing apparatus |
| 05/07/2009 | US20090117752 Semiconductor device manufacturing method and substrate processing apparatus |
| 05/07/2009 | US20090117751 Method for forming radical oxide layer and method for forming dual gate oxide layer using the same |
| 05/07/2009 | US20090117750 Methods of Forming a Semiconductor Device |
| 05/07/2009 | US20090117749 Etching Method of Single Wafer |
| 05/07/2009 | US20090117748 Method for manufacturing a phase change memory device capable of improving thermal efficiency of phase change material |
| 05/07/2009 | US20090117747 Method for Surface Treating Semiconductor |
| 05/07/2009 | US20090117746 Gas supply device, substrate processing apparatus and substrate processing method |
| 05/07/2009 | US20090117745 Methods for selectively etching a barrier layer in dual damascene applications |
| 05/07/2009 | US20090117744 Ion implantation mask forming method |
| 05/07/2009 | US20090117743 Film formation apparatus and method for using same |
| 05/07/2009 | US20090117742 Method for fabricating fine pattern in semiconductor device |
| 05/07/2009 | US20090117741 Method for fabricating monolithic two-dimensional nanostructures |
| 05/07/2009 | US20090117740 Fluid-confining apparatus and method of operating the same |
| 05/07/2009 | US20090117739 Method for forming pattern in semiconductor device |
| 05/07/2009 | US20090117738 Method for producing substrate |
| 05/07/2009 | US20090117737 Polyconductor line end formation and related mask |
| 05/07/2009 | US20090117736 Ammonia-based plasma treatment for metal fill in narrow features |
| 05/07/2009 | US20090117735 Implantation of multiple species to address copper reliability |
| 05/07/2009 | US20090117734 Processes for forming electronic devices including polishing metal-containing layers |
| 05/07/2009 | US20090117733 Protection of seedlayer for electroplating |
| 05/07/2009 | US20090117732 Method of fabricating semicondcutor device |