| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/14/2009 | WO2009061282A1 An interconnect structure and a method of fabricating the same |
| 05/14/2009 | WO2009061104A1 Plasma etching chamber |
| 05/14/2009 | WO2009061067A1 Apparatus for reactive sputtering deposition |
| 05/14/2009 | WO2009061050A1 Method of aligning a wafer and method of manufacturing a flip chip using the same |
| 05/14/2009 | WO2009060967A1 Process for producing polycarbonate resin pellet and molded article |
| 05/14/2009 | WO2009060949A1 Structure for packing semiconductor device, method for packing semiconductor device, and embossed tape |
| 05/14/2009 | WO2009060943A1 Plasma processing apparatus and method for transferring processing material |
| 05/14/2009 | WO2009060934A1 Semiconductor device and method for manufacturing the same |
| 05/14/2009 | WO2009060927A1 Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor |
| 05/14/2009 | WO2009060914A1 Epitaxial wafer |
| 05/14/2009 | WO2009060913A1 Method for manufacturing epitaxial wafer |
| 05/14/2009 | WO2009060912A1 Epitaxial film growing method, wafer supporting structure and susceptor |
| 05/14/2009 | WO2009060907A1 Semiconductor device, power supply provided with semiconductor device, and processing unit |
| 05/14/2009 | WO2009060906A1 Microactuator, optical device, display, exposure apparatus and device manufacturing method |
| 05/14/2009 | WO2009060890A1 Bonding substrate manufacturing apparatus and bonding substrate manufacturing method |
| 05/14/2009 | WO2009060862A1 Epoxy group-containing organosiloxane compound, curable composition for transfer material, and fine pattern forming method using the composition |
| 05/14/2009 | WO2009060861A1 Bonding substrate manufacturing apparatus and bonding substrate manufacturing method |
| 05/14/2009 | WO2009060855A1 Bonding substrate manufacturing apparatus and bonding substrate manufacturing method |
| 05/14/2009 | WO2009060827A1 Process and apparatus for producing ultrapure water, and method and apparatus for cleaning electronic component members |
| 05/14/2009 | WO2009060788A1 Dicing die-bonding film |
| 05/14/2009 | WO2009060787A1 Dicing die-bonding film |
| 05/14/2009 | WO2009060782A1 Retainer and substrate storing container |
| 05/14/2009 | WO2009060781A1 Method for correcting mask pattern and method for manufacturing acceleration sensor and angular velocity sensor by using same |
| 05/14/2009 | WO2009060770A1 Susceptor for vapor deposition |
| 05/14/2009 | WO2009060769A1 Ashing system |
| 05/14/2009 | WO2009060767A1 Conductive reel |
| 05/14/2009 | WO2009060766A1 Heating apparatus |
| 05/14/2009 | WO2009060761A1 Dopant host and process for producing the dopant host |
| 05/14/2009 | WO2009060756A1 Plasma treatment apparatus and external air shielding vessel |
| 05/14/2009 | WO2009060755A1 Process for producing intermediate structure and inspection apparatus |
| 05/14/2009 | WO2009060749A1 Magnetoresistive element and magnetic random access memory |
| 05/14/2009 | WO2009060745A1 Control device, exposure method, and exposure device |
| 05/14/2009 | WO2009060744A1 Illumination optical device and exposure device |
| 05/14/2009 | WO2009060736A1 A semiconductor layer structure |
| 05/14/2009 | WO2009060731A1 Method for manufacturing organic thin film transistor, and organic thin film transistor |
| 05/14/2009 | WO2009060726A1 Integrated circuit and method for manufacturing the same |
| 05/14/2009 | WO2009060698A1 Gold alloy wire for ball bonding |
| 05/14/2009 | WO2009060693A1 Device and device manufacturing method |
| 05/14/2009 | WO2009060687A1 Adhesive sheet and method for manufacturing semiconductor device using the same |
| 05/14/2009 | WO2009060686A1 Adhesive sheet for inspection |
| 05/14/2009 | WO2009060670A1 Semiconductor device and method for manufacturing the same |
| 05/14/2009 | WO2009060662A1 Bonding wire |
| 05/14/2009 | WO2009060596A1 Substrate processing apparatus |
| 05/14/2009 | WO2009060585A1 Exposure apparatus, exposure method and device manufacturing method |
| 05/14/2009 | WO2009060562A1 Wire saw apparatus |
| 05/14/2009 | WO2009060560A1 Component mounting apparatus, component mounting head, and component mounting method |
| 05/14/2009 | WO2009060556A1 Wiring structure and method for forming the same |
| 05/14/2009 | WO2009060541A1 Inline-type wafer conveyance device |
| 05/14/2009 | WO2009060540A1 Inline-type wafer conveyance device |
| 05/14/2009 | WO2009060539A1 Inline-type wafer conveyance device |
| 05/14/2009 | WO2009060514A1 Semiconductor device manufacturing method, wafer and wafer manufacturing method |
| 05/14/2009 | WO2009060511A1 Substrate for photomask, photomask, and method for manufacturing the same |
| 05/14/2009 | WO2009060425A2 Electronic interface apparatus and method and system for manufacturing same |
| 05/14/2009 | WO2009060406A1 A trench-gate semiconductor device and method of manufacturing the same |
| 05/14/2009 | WO2009060320A2 Method for integrating selective ruthenium deposition into manufacturing of a semiconductior device |
| 05/14/2009 | WO2009060200A1 Improved field emission backplate |
| 05/14/2009 | WO2009060195A1 Composite material |
| 05/14/2009 | WO2009060168A1 Current limiting diode and method of manufacturing thereof |
| 05/14/2009 | WO2009060125A1 Carbosilane polymer compositions for anti-reflective coatings |
| 05/14/2009 | WO2009060078A1 Field-effect transistor and method for producing a field-effect transistor |
| 05/14/2009 | WO2009059770A1 Device and method for coating a surface |
| 05/14/2009 | WO2009042983A3 Method of achieving atomically smooth sidewalls in deep trenches, and high aspect ratio silicon structure containing atomically smooth sidewalls |
| 05/14/2009 | WO2009042946A3 Reduced scrub contact element |
| 05/14/2009 | WO2009042940A3 Component assembly and alignment |
| 05/14/2009 | WO2009042495A3 Methods of forming nitride stressing layer for replacement metal gate and structures formed thereby |
| 05/14/2009 | WO2009042490A3 Improved nitrogen profile in high-k dielectrics using ultrathin disposable capping layers |
| 05/14/2009 | WO2009042144A3 Process for making doped zinc oxide |
| 05/14/2009 | WO2009042029A3 Back gated sram cell |
| 05/14/2009 | WO2009042028A3 Lanthanide dielectric with controlled interfaces |
| 05/14/2009 | WO2009038690A3 Low ph barrier slurry based on titanium dioxide |
| 05/14/2009 | WO2009026324A3 Composition and method for removing ion-implanted photoresist |
| 05/14/2009 | WO2009009566A9 Method for manufacturing semiconductor device |
| 05/14/2009 | WO2009004243A3 Assemblage of radiofrequency chips |
| 05/14/2009 | WO2008109204A3 Multifinger carbon nanotube field-effect transistor |
| 05/14/2009 | WO2008037506A8 Uses of self-organized needle-type nanostructures |
| 05/14/2009 | WO2008036837A3 Release strategies for making transferable semiconductor structures, devices and device components |
| 05/14/2009 | WO2007058781A3 Method of fabricating an exposed die package |
| 05/14/2009 | WO2007050422A3 Plastic packaged device with die interface layer |
| 05/14/2009 | WO2007047888A3 Method and apparatus for converting precursor layers into photovoltaic absorbers |
| 05/14/2009 | WO2006124241A3 Electronic device including a trench field isolation having combination shallow and deep depth and a process for forming the same |
| 05/14/2009 | WO2006083520A3 Method of separating a mold from a solidified layer disposed on a substrate |
| 05/14/2009 | WO2006055476A3 Method of integrating optical devices and electronic devices on an integrated circuit |
| 05/14/2009 | WO2006019890A3 Systems and methods for forming integrated circuit components having matching geometries |
| 05/14/2009 | WO2005046207A3 Image sensor with deep well region and method of fabricating the image sensor |
| 05/14/2009 | US20090124175 Double-Side Polishing Method for Wafer |
| 05/14/2009 | US20090124172 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing |
| 05/14/2009 | US20090124097 Method of forming narrow fins in finfet devices with reduced spacing therebetween |
| 05/14/2009 | US20090124096 Method of fabricating flash memory device |
| 05/14/2009 | US20090124095 Method for forming patterned photoresist layer |
| 05/14/2009 | US20090124094 Method for manufacturing semiconductor device to prevent defects due to insulation layer volume change |
| 05/14/2009 | US20090124093 Methods of Forming CMOS Integrated Circuits that Utilize Insulating Layers with High Stress Characteristics to Improve NMOS and PMOS Transistor Carrier Mobilities |
| 05/14/2009 | US20090124092 Methods of selective deposition of fine particles onto selected regions of a substrate |
| 05/14/2009 | US20090124091 Etching solution composition for metal films |
| 05/14/2009 | US20090124090 Conductive polymer electrodes |
| 05/14/2009 | US20090124089 Device and Method for Stopping an Etching Process |
| 05/14/2009 | US20090124088 Method for etching a sacrificial layer for a micro-machined structure |
| 05/14/2009 | US20090124087 Vertical plasma processing apparatus and method for using same |
| 05/14/2009 | US20090124086 Method of fabricating a flash memory device |
| 05/14/2009 | US20090124085 Method for forming a semiconductor device has a lengthened channel length |
| 05/14/2009 | US20090124084 Fabrication of sub-resolution features for an integrated circuit |