Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2009
05/13/2009CN100486933C Joined ceramic article, substrate holding structure, and apparatus for treating substrate
05/13/2009CN100486879C Transport method and transport apparatus for semiconductor wafer
05/13/2009CN100486770C Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers
05/12/2009US7532499 Semiconductor integrated circuit device
05/12/2009US7532385 Optical interference display panel and manufacturing method thereof
05/12/2009US7532378 Laser irradiation apparatus, method of laser irradiation, and method for manufacturing semiconductor device
05/12/2009US7532328 Circuit-pattern inspection apparatus
05/12/2009US7532322 Method and apparatus for measuring electron density of plasma and plasma processing apparatus
05/12/2009US7532304 Lithographic apparatus and device manufacturing method
05/12/2009US7532270 Manufacturing method of a liquid crystal display device using a photo resist having regions with different thicknesses, ashing, and reflow processing
05/12/2009US7532267 Liquid crystal display device and method of fabricating the same
05/12/2009US7532184 Flat panel display with improved white balance
05/12/2009US7531906 Flip chip packaging using recessed interposer terminals
05/12/2009US7531902 Tungsten nitride and tungsten carbonitride layers; superior capability for preventing diffusion of copper
05/12/2009US7531901 Metal interconnection of semiconductor device and method for forming the same
05/12/2009US7531897 Process for sealing and connecting parts of electromechanical, fluid and optical microsystems and device obtained thereby
05/12/2009US7531896 Semiconductor device having a minimal via resistance created by applying a nitrogen plasma to a titanium via liner
05/12/2009US7531894 Method of electrically connecting a microelectronic component
05/12/2009US7531891 Semiconductor device
05/12/2009US7531890 Multi-chip package (MCP) with a conductive bar and method for manufacturing the same
05/12/2009US7531889 Epitaxial substrate and semiconductor element
05/12/2009US7531878 Semiconductor MIS transistor formed on SOI semiconductor substrate
05/12/2009US7531871 Power semiconductor switching element
05/12/2009US7531870 SONOS memory device having nano-sized trap elements
05/12/2009US7531864 Nonvolatile memory device
05/12/2009US7531863 Semiconductor device and method of fabricating the same
05/12/2009US7531862 Semiconductor device having ferroelectric substance capacitor
05/12/2009US7531861 Trench capacitors with insulating layer collars in undercut regions
05/12/2009US7531852 Electronic unit with a substrate where an electronic circuit is fabricated
05/12/2009US7531842 Method for etching a tapered bore in a silicon substrate, and a semiconductor wafer comprising the substrate
05/12/2009US7531839 Display device having driver TFTs and pixel TFTs formed on the same substrate
05/12/2009US7531838 LCD with increased pixel opening sizes
05/12/2009US7531835 Increased mobility from organic semiconducting polymers field-effect transistors
05/12/2009US7531754 Flexible substrate having interlaminar junctions, and process for producing the same
05/12/2009US7531739 Build-in-place method of manufacturing thermoelectric modules
05/12/2009US7531679 Composition and method for low temperature deposition of silicon-containing films such as films including silicon nitride, silicon dioxide and/or silicon-oxynitride
05/12/2009US7531590 Additives to prevent degradation of alkyl-hydrogen siloxanes
05/12/2009US7531492 Aqueous solution of sulfuric acid, hydrogen peroxide, H2SiF6, HBF4; clean residual polymers from aluminium or aluminium-containing surfaces, during the production of semiconductor elements
05/12/2009US7531491 Aqueous cleaning solution for integrated circuit device and method of cleaning using the cleaning solution
05/12/2009US7531470 Method and apparatus for electronic device manufacture using shadow masks
05/12/2009US7531469 Dosimetry using optical emission spectroscopy/residual gas analyzer in conjunction with ion current
05/12/2009US7531468 System and method for forming a gate dielectric
05/12/2009US7531467 Manufacturing method of semiconductor device and substrate processing apparatus
05/12/2009US7531466 Metal organic deposition precursor solution synthesis and terbium-doped SiO2 thin film deposition
05/12/2009US7531465 Method of manufacturing nitride-based semiconductor light emitting device
05/12/2009US7531464 Semiconductive device fabricated using a substantially disassociated chlorohydrocarbon
05/12/2009US7531463 Fabrication of semiconductor interconnect structure
05/12/2009US7531462 Method of inspecting semiconductor wafer
05/12/2009US7531461 Process and system for etching doped silicon using SF6-based chemistry
05/12/2009US7531460 Dry-etching method
05/12/2009US7531459 Methods of forming self-aligned silicide layers using multiple thermal processes
05/12/2009US7531458 Organometallic compounds
05/12/2009US7531457 Method of fabricating suspended structure
05/12/2009US7531456 Method of forming self-aligned double pattern
05/12/2009US7531455 Method for forming storage node contact in semiconductor device using nitride-based hard mask
05/12/2009US7531454 Method and apparatus of fabricating liquid crystal display device
05/12/2009US7531453 Microelectronic devices and methods for forming interconnects in microelectronic devices
05/12/2009US7531452 Strained metal silicon nitride films and method of forming
05/12/2009US7531451 SIP semiconductor device and method for manufacturing the same
05/12/2009US7531450 Method of fabricating semiconductor device having contact hole with high aspect-ratio
05/12/2009US7531449 Method of forming fine patterns using double patterning process
05/12/2009US7531448 Manufacturing method of dual damascene structure
05/12/2009US7531447 Process for forming integrated circuit comprising copper lines
05/12/2009US7531446 Method of manufacturing a semiconductor device
05/12/2009US7531445 Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane
05/12/2009US7531444 Method to create air gaps using non-plasma processes to damage ILD materials
05/12/2009US7531443 Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors
05/12/2009US7531442 Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing
05/12/2009US7531441 Method of manufacturing semiconductor device
05/12/2009US7531440 Semiconductor laser device, semiconductor laser system, optical pickup module and manufacturing for semiconductor laser system
05/12/2009US7531439 Method for forming an integrated semiconductor circuit arrangement
05/12/2009US7531438 Method of fabricating a recess channel transistor
05/12/2009US7531437 Method of forming metal gate electrodes using sacrificial gate electrode material and sacrificial gate dielectric material
05/12/2009US7531436 Highly conductive shallow junction formation
05/12/2009US7531435 Semiconductor device and manufacturing method of the same
05/12/2009US7531434 Method of fabricating semiconductor devices
05/12/2009US7531433 Homoepitaxial growth of SiC on low off-axis SiC wafers
05/12/2009US7531432 Block-molded semiconductor device singulation methods and systems
05/12/2009US7531431 Methods for reducing contamination of semiconductor devices and materials during wafer processing
05/12/2009US7531430 Method for producing a semiconductor-on-insulator structure
05/12/2009US7531429 Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
05/12/2009US7531428 Recycling the reconditioned substrates for fabricating compound material wafers
05/12/2009US7531427 Thermal oxidation of a SiGe layer and applications thereof
05/12/2009US7531426 Approach to high temperature wafer processing
05/12/2009US7531425 Method of fabricating bonded wafer
05/12/2009US7531424 Vacuum wafer-level packaging for SOI-MEMS devices
05/12/2009US7531423 Reduced-resistance finFETs by sidewall silicidation and methods of manufacturing the same
05/12/2009US7531422 Method for fabricating capacitor in semiconductor device using hafnium terbium oxide dielectric layer
05/12/2009US7531421 Semiconductor capacitor structure and method to form same
05/12/2009US7531420 Semiconductor memory cell and corresponding method of producing same
05/12/2009US7531419 Semiconductor device and a method of manufacturing the same
05/12/2009US7531418 Method of producing a conductive layer including two metal nitrides
05/12/2009US7531417 High performance system-on-chip passive device using post passivation process
05/12/2009US7531416 Thick film capacitors on ceramic interconnect substrates
05/12/2009US7531415 Multilayered CMP stop for flat planarization
05/12/2009US7531414 Method of manufacturing integrated circuit device including recessed channel transistor
05/12/2009US7531413 Method of forming transistor having channel region at sidewall of channel portion hole
05/12/2009US7531412 Methods of manufacturing semiconductor memory devices including a vertical channel transistor
05/12/2009US7531411 Apparatus and method for a non-volatile memory structure comprising a multi-layer silicon-rich, silicon nitride trapping layer
05/12/2009US7531410 Semiconductor flash memory device and method of fabricating the same
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