| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/30/2009 | US20090110018 Laser diode expitaxial wafer and method for producing same |
| 04/30/2009 | US20090110017 Semiconductor light-emitting element and method of manufacturing the same |
| 04/30/2009 | US20090109752 Memory cell heights |
| 04/30/2009 | US20090109734 Non-volatile sram cell |
| 04/30/2009 | US20090109731 Dielectric layers and memory cells including metal-doped alumina |
| 04/30/2009 | US20090109595 Method and system for performing electrostatic chuck clamping in track lithography tools |
| 04/30/2009 | US20090109582 Method of protecting circuits using integrated array fuse elements and process for fabrication |
| 04/30/2009 | US20090109520 Electrophoretic display device and method for fabricating the same |
| 04/30/2009 | US20090109419 Supporting plate, stage device, exposure apparatus, and exposure method |
| 04/30/2009 | US20090109365 Liquid crystal display device and method for manufacturing the same |
| 04/30/2009 | US20090109162 Amorphous-silicon thin film transistor and shift resister having the same |
| 04/30/2009 | US20090108996 Rfid antenna system and method |
| 04/30/2009 | US20090108852 Structure for capacitive balancing of integrated relative humidity sensor |
| 04/30/2009 | US20090108755 Composition for fabrication of electrode, electrode fabricated using the same, plasma display panel, and associated methods |
| 04/30/2009 | US20090108749 Transistor and process of producing the same, light-emitting device, and display |
| 04/30/2009 | US20090108496 Method for packaging light emitting diode |
| 04/30/2009 | US20090108474 Junction structure and method of manufacturing the same |
| 04/30/2009 | US20090108473 Die-attach material overflow control for die protection in integrated circuit packages |
| 04/30/2009 | US20090108472 Wafer-level underfill process using over-bump-applied resin |
| 04/30/2009 | US20090108471 Wiring board of semiconductor device, semiconductor device, electronic apparatus, mother board, method of manufacturing wiring board of semiconductor device, method of manufacturing mother board and method of manufacturing electronic apparatus |
| 04/30/2009 | US20090108468 Stacked semiconductor package and method for manufacturing the same |
| 04/30/2009 | US20090108467 Device with a plurality of semiconductor chips |
| 04/30/2009 | US20090108466 Semiconductor device and method for patterning vertical contacts and metal lines in a common etch process |
| 04/30/2009 | US20090108464 Semiconductor device and method for manufacturing the same |
| 04/30/2009 | US20090108463 Method of manufacturing semiconductor device and semiconductor device |
| 04/30/2009 | US20090108462 Dual integration scheme for low resistance metal layers |
| 04/30/2009 | US20090108461 Semiconductor device and method of fabricating the same |
| 04/30/2009 | US20090108460 Device including a semiconductor chip having a plurality of electrodes |
| 04/30/2009 | US20090108456 Solder-top Enhanced Semiconductor Device and Method for Low Parasitic Impedance Packaging |
| 04/30/2009 | US20090108455 Integrated circuit and process for fabricating thereof |
| 04/30/2009 | US20090108454 Metal line in semiconductor device and fabricating method thereof |
| 04/30/2009 | US20090108453 Chip structure and method for fabricating the same |
| 04/30/2009 | US20090108452 Semiconductor device and method for manufacturing the same |
| 04/30/2009 | US20090108451 Semiconductor device and method for manufacturing the same |
| 04/30/2009 | US20090108449 Microelectronic device |
| 04/30/2009 | US20090108448 Metal pad of semiconductor device |
| 04/30/2009 | US20090108444 Chip package structure and its fabrication method |
| 04/30/2009 | US20090108443 Flip-Chip Interconnect Structure |
| 04/30/2009 | US20090108442 Self-assembled stress relief interface |
| 04/30/2009 | US20090108440 Semiconductor device |
| 04/30/2009 | US20090108438 Semiconductor device and method of manufacturing the same |
| 04/30/2009 | US20090108437 Wafer scale integrated thermal heat spreader |
| 04/30/2009 | US20090108435 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
| 04/30/2009 | US20090108433 Multilayer semiconductor device package assembly and method |
| 04/30/2009 | US20090108431 Inverted package-on-package (POP) assemblies and packaging methods for integrated circuits |
| 04/30/2009 | US20090108428 Mountable integrated circuit package system with substrate having a conductor-free recess |
| 04/30/2009 | US20090108427 Techniques for Modular Chip Fabrication |
| 04/30/2009 | US20090108426 Optical device and method of manufacturing the same |
| 04/30/2009 | US20090108425 Stacked package and method of manufacturing the same |
| 04/30/2009 | US20090108423 Semiconductor package |
| 04/30/2009 | US20090108421 Apparatus and method configured to lower thermal stresses |
| 04/30/2009 | US20090108420 Semiconductor device and its fabrication process |
| 04/30/2009 | US20090108417 Method and System for Providing a Continuous Impedance Along a Signal Trace in an IC Package |
| 04/30/2009 | US20090108415 Increasing etch selectivity during the patterning of a contact structure of a semiconductor device |
| 04/30/2009 | US20090108413 Interlayer Insulating Film, Interconnection Structure, and Methods of Manufacturing the Same |
| 04/30/2009 | US20090108412 Semiconductor substrate and method for manufacturing a semiconductor substrate |
| 04/30/2009 | US20090108409 Semiconductor device and manufacturing method thereof |
| 04/30/2009 | US20090108408 Method for Trapping Implant Damage in a Semiconductor Substrate |
| 04/30/2009 | US20090108407 Oxygen-doped n-type gallium nitride freestanding single crystal substrate |
| 04/30/2009 | US20090108405 Semiconductor device and method of manufacturing the semiconductor device |
| 04/30/2009 | US20090108403 Semiconductor structure and method of manufacture |
| 04/30/2009 | US20090108402 Method for Manufacturing Capacitor of Semiconductor Device |
| 04/30/2009 | US20090108401 Semiconductor device |
| 04/30/2009 | US20090108400 Anti-fuse structure including a sense pad contact region and methods for fabrication and programming thereof |
| 04/30/2009 | US20090108399 Apparatus and method for manufacturing semiconductor device incorporating fuse elements |
| 04/30/2009 | US20090108398 Fuse of Semiconductor Device and Method for Forming the Same |
| 04/30/2009 | US20090108396 Electrical fuse having a fully silicided fuselink and enhanced flux divergence |
| 04/30/2009 | US20090108395 Semiconductor device having increased active region width and method for manufacturing the same |
| 04/30/2009 | US20090108394 Semiconductor device and method for fabricating the same |
| 04/30/2009 | US20090108387 Semiconductor Device And Method For Strain Controlled Optical Absorption |
| 04/30/2009 | US20090108383 High performance MTJ element for conventional MRAM and for STT-RAM and a method for making the same |
| 04/30/2009 | US20090108382 Transducer for use in harsh environments |
| 04/30/2009 | US20090108381 Low temperature bi-CMOS compatible process for MEMS RF resonators and filters |
| 04/30/2009 | US20090108379 Semiconductor device and fabrication method for the same |
| 04/30/2009 | US20090108378 Structure and method for fabricating self-aligned metal contacts |
| 04/30/2009 | US20090108377 Method for fabricating gate dielectrics of metal-oxide-semiconductor transistors using rapid thermal processing |
| 04/30/2009 | US20090108374 High density sram cell with hybrid devices |
| 04/30/2009 | US20090108373 Techniques for Enabling Multiple Vt Devices Using High-K Metal Gate Stacks |
| 04/30/2009 | US20090108372 Sram cell having a rectangular combined active area for planar pass gate and planar pull-down nfets |
| 04/30/2009 | US20090108371 Semiconductor device and manufacturing the same |
| 04/30/2009 | US20090108370 Semiconductor device and manufacturing method thereof |
| 04/30/2009 | US20090108369 Radio Frequency Device of Semiconductor Type |
| 04/30/2009 | US20090108368 Semiconductor device and method for manufacturing the same |
| 04/30/2009 | US20090108367 Semiconductor device and method for manufacturing same |
| 04/30/2009 | US20090108366 Structure And Method To Fabricate Metal Gate High-K Devices |
| 04/30/2009 | US20090108365 High-k dielectric metal gate device structure and method for forming the same |
| 04/30/2009 | US20090108364 Dual workfunction silicide diode |
| 04/30/2009 | US20090108362 Semiconductor device and method of manufacturing the same |
| 04/30/2009 | US20090108361 Tensile strain source using silicon/germanium in globally strained silicon |
| 04/30/2009 | US20090108360 Methods, structures and designs for self-aligning local interconnects used in integrated circuits |
| 04/30/2009 | US20090108356 Integration scheme for multiple metal gate work function structures |
| 04/30/2009 | US20090108354 Semiconductor device and method of manufacturing the same |
| 04/30/2009 | US20090108353 Finfet structure and methods |
| 04/30/2009 | US20090108352 Metal-Gated MOSFET Devices Having Scaled Gate Stack Thickness |
| 04/30/2009 | US20090108350 Method For Fabricating Super-Steep Retrograde Well Mosfet On SOI or Bulk Silicon Substrate, And Device Fabricated In Accordance With The Method |
| 04/30/2009 | US20090108346 Hybrid-mode ldmos |
| 04/30/2009 | US20090108343 Semiconductor component and method of manufacture |
| 04/30/2009 | US20090108342 Semiconductor component and method of manufacture |
| 04/30/2009 | US20090108341 Semiconductor device and method of fabricating the same |
| 04/30/2009 | US20090108340 Semiconductor device and method of fabricating the same |