| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/07/2009 | DE112007001446T5 Chipmodul für vollständigen Leistungsstrang Chip module for complete power train |
| 05/07/2009 | DE112007001278T5 Infrarotlaser-Waferritzen unter Verwendung von kurzen Impulsen Infrared laser wafer scribing using short pulses |
| 05/07/2009 | DE112007000752T5 Verfahren zum Reduzieren der Kapazität zwischen Interconnect-Leiterbahnen durch Verwenden eines Abstandshalters mit niedriger Dielektrizitätskonstante A method of reducing the capacitance between interconnect conductor tracks by using a spacer having a low dielectric constant |
| 05/07/2009 | DE10338252B4 Bitleitung einer Halbleitervorrichtung mit einer nippelförmigen Abdeckschicht und Verfahren zur Herstellung derselben Bit line of a semiconductor device having a nipple-shaped covering layer and method of manufacturing the same |
| 05/07/2009 | DE10314505B4 Verbesserte Diodenstruktur für Soi-Schaltungen Improved diode structure for Soi circuits |
| 05/07/2009 | DE10310080B4 Verfahren zum Ausbilden tieferer Gräben unabhängig von lithografisch bedingten, kritischen Abmessungen A method of forming a deeper trenches, regardless of lithographically-related, critical dimensions |
| 05/07/2009 | DE10246306B4 Verfahren zum Ausbilden eines Dielektrikums für einen Kondensator und Verfahren zum Ausbilden eines chipintegrierten Kondensators A method for forming a dielectric for a capacitor and method for forming an on-chip capacitor |
| 05/07/2009 | DE10208728B4 Ein Verfahren zur Herstellung eines Halbleiterelements mit unterschiedlichen Metallsilizidbereichen A method of manufacturing a semiconductor element with different Metallsilizidbereichen |
| 05/07/2009 | DE102008056206A1 Halbleitervorrichtung und Verfahren zu deren Fertigung A semiconductor device and method of manufacturing |
| 05/07/2009 | DE102008054157A1 Laserstrahlbearbeitungsvorrichtung Laser beam machining apparatus |
| 05/07/2009 | DE102008051494A1 SOI-Substrate mit einer feinen vergrabenen Isolationsschicht SOI substrates with a thin buried insulating layer |
| 05/07/2009 | DE102008051466A1 Bauelement, das einen Halbleiterchip mit mehreren Elektroden enthält Component that includes a semiconductor chip having a plurality of electrodes |
| 05/07/2009 | DE102008049534A1 Halbleiterstruktur Semiconductor structure |
| 05/07/2009 | DE102008046728A1 Elektronikbauelement Electronic component |
| 05/07/2009 | DE102008012479B3 Electrochemical etching of macropores in n-type silicon wafers under illumination of backside of the wafer using an aqueous electrolyte, where the electrolyte is an aqueous acetic acid solution of a composition with hydrogen fluoride |
| 05/07/2009 | DE102007052626A1 Method for producing porous structures in semiconductor structures which are based on silicon, involves introducing germanium in layer of semiconductor substrate |
| 05/07/2009 | DE102007052609A1 Verfahren und Einrichtung zur Bewertung von elektrisch leitfähigen, gedruckten Strukturen und Druckmaschine mit einer solchen Einrichtung Method and apparatus for measurement of electrically conductive printed structures and printing machine with such a device |
| 05/07/2009 | DE102007052220A1 Dotierstoffprofileinstellung für MOS-Bauelemente durch Anpassen einer Abstandshalterbreite vor der Implantation Dotierstoffprofileinstellung for MOS devices by fitting a spacer width prior to implantation |
| 05/07/2009 | DE102007052167A1 Verfahren zur Einstellung der Höhe einer Gateelektrode in einem Halbleiterbauelement Method for adjusting the height of a gate electrode in a semiconductor device |
| 05/07/2009 | DE102007052097A1 SOI-Bauelement mit einer Substratdiode, die durch reduzierte Implantationsenergie gebildet ist SOI device with a substrate diode which is formed by reduced implantation energy |
| 05/07/2009 | DE102007052049A1 Halbleiterbauelement und Verfahren zum Strukturieren von vertikalen Kontakten und Metallleitungen in einem gemeinsamen Ätzprozess A semiconductor device and method of patterning of vertical contacts and metal lines in a common etch process |
| 05/07/2009 | DE102007051875A1 HF-Chipmodul, HF-Baugruppe und Verfahren zur Herstellung einer HF-Baugruppe RF-chip module, the RF module and method for manufacturing a RF assembly |
| 05/07/2009 | DE102007051870A1 Modulgehäuse und Verfahren zur Herstellung eines Modulgehäuses Module housing and method of manufacturing a module housing |
| 05/07/2009 | DE102007046843A1 Erhöhte Zuverlässigkeit für eine Kontaktstruktur zur Verbindung eines aktiven Gebiets mit einer Polysiliziumleitung Increased reliability for a contact structure for connecting an active region with a polysilicon line |
| 05/07/2009 | DE102007020656B4 Werkstück mit Halbleiterchips, Halbleiterbauteil und Verfahren zur Herstellung eines Werkstücks mit Halbleiterchips Workpiece with semiconductor chips, semiconductor device and process for the production of a workpiece with semiconductor chips |
| 05/07/2009 | DE102007015304A1 Rückwärtsleitender (RC-) IGBT mit senkrecht angeordneter Ladungsträgerlebensdaueranpassung Reverse-conducting (RC) IGBT with vertically arranged carrier lifetime adaptation |
| 05/07/2009 | DE102006040762B4 N-Kanalfeldeffekttransistor mit einer Kontaktätzstoppschicht in Verbindung mit einer Zwischenschichtdielektrikumsteilschicht mit der gleichen Art an innerer Verspannung N-channel field effect transistor with a contact etch stop in conjunction with a Zwischenschichtdielektrikumsteilschicht with the same kind of internal stress |
| 05/07/2009 | DE102006029497B4 Druckvorrichtungssystem und dieses verwendendes Strukturierungsverfahren Printing apparatus and system-use of this patterning process |
| 05/07/2009 | DE102005024118B4 Vorrichtung und Verfahren zur Reduktion von Partikeln bei der thermischen Behandlung rotierender Substrate Device and method for reduction of particles in the thermal treatment rotating substrates |
| 05/07/2009 | DE102004008900B4 Vorrichtung zum Verarbeiten von Wafern An apparatus for processing of wafers |
| 05/07/2009 | DE10142975B4 Wärmeableitelement für elktronische Bauteile und Verfahren zum Anbringen desselben The same heat sink member for elktronische components and methods for applying |
| 05/07/2009 | DE10000690B4 Verfahren zum Bestimmen des Ausbeute-Einflusses von Prozessschritten für Halbleiterwafer A method for determining the yield influence of process steps for semiconductor wafers |
| 05/07/2009 | CA2704457A1 Compositions and methods of enhancing immune responses to flagellated bacterium |
| 05/06/2009 | EP2056653A1 Soft x-ray shielding sheet used in soft x-ray electrostatic removal device and its manufacturing method |
| 05/06/2009 | EP2056365A1 High-efficiency indirect transition semiconductor ultraviolet light-emitting element |
| 05/06/2009 | EP2056349A1 Component built-in module and method for producing the same |
| 05/06/2009 | EP2056343A2 Silicon interposer producing method, silicon interposer and seminconductor device package and semiconductor device incorporating silicon interposer |
| 05/06/2009 | EP2056341A2 Methods for forming high aspect ratio features on a substrate |
| 05/06/2009 | EP2056340A1 Method for producing silicon carbide substrate and silicon carbide substrate |
| 05/06/2009 | EP2056339A1 Method for manufacturing group iii nitride compound semiconductor light-emitting device, group iii nitride compound semiconductor light-emitting device, and lamp |
| 05/06/2009 | EP2056338A2 Method and system supporting production of a semiconductor device using a plurality of fabrication processes |
| 05/06/2009 | EP2056161A1 Photo mask |
| 05/06/2009 | EP2056098A2 A method for detection and analysis of impurity content in refined metallurgical silicon |
| 05/06/2009 | EP2055756A1 Adhesive tape, joint structure, and semiconductor package |
| 05/06/2009 | EP2055429A2 Polishing apparatus |
| 05/06/2009 | EP2055397A2 In-situ chamber cleaning method |
| 05/06/2009 | EP2054930A1 Heat sink for semiconductor components or similar devices, and method for producing it |
| 05/06/2009 | EP2054929A2 Process for the collective manufacturing of electronic 3d modules |
| 05/06/2009 | EP2054928A1 Dram transistor with recessed gates and methods of fabricating the same |
| 05/06/2009 | EP2054927A1 Thin-film solar module |
| 05/06/2009 | EP2054926A1 Method of manufacturing a semiconductor device and semiconductor device obtained with such a method |
| 05/06/2009 | EP2054925A2 Nonvolatile memories with shaped floating gates |
| 05/06/2009 | EP2054924A1 Process for regenerating electrolytes in electrochemical polishing applications |
| 05/06/2009 | EP2003685A9 Surface protective tape used for back grinding of semiconductor wafer and base film for the surface protective tape |
| 05/06/2009 | EP1872397A4 Dual wavelength thermal flux laser anneal |
| 05/06/2009 | EP1776715A4 Method for forming a gate electrode having a metal |
| 05/06/2009 | EP1774580A4 Method of forming a semiconductor device and structure thereof |
| 05/06/2009 | EP1606828A4 Allowance method for point to ground resistance on tray |
| 05/06/2009 | EP1567915A4 Pattern forming materials and pattern formation method using the materials |
| 05/06/2009 | EP1556900B1 Non-destructive analysis method for determining the quality of a solar cell, and application of the same |
| 05/06/2009 | EP1486983B1 Magnetic storage device using ferromagnetic tunnel junction element |
| 05/06/2009 | EP1466361B1 Method for enhancing electrode surface area in dram cell capacitors |
| 05/06/2009 | EP1393352A4 Semiconductor device, semiconductor layer and production method thereof |
| 05/06/2009 | EP1360882A4 A stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same |
| 05/06/2009 | EP1313662A4 Edge gripping end effector wafer handling apparatus |
| 05/06/2009 | EP1305453B1 Ring-shaped high-density plasma source and method |
| 05/06/2009 | EP1252656B1 Protection device for schottky diodes |
| 05/06/2009 | EP1247294A4 Packaging of integrated circuits and vertical integration |
| 05/06/2009 | EP1121672A4 Wafer mapping system |
| 05/06/2009 | EP1074040A4 Method for using a hard mask for critical dimension growth containment |
| 05/06/2009 | EP1029340B1 Apparatus and method for secondary electron emission microscope |
| 05/06/2009 | CN201233887Y Front and back surface converting device for IC wafer |
| 05/06/2009 | CN201233886Y Three dimensional regulating seat |
| 05/06/2009 | CN201233433Y Full automatic testing and discriminating gear for wafer of each specification |
| 05/06/2009 | CN201231446Y Cleaning cushion for chemical and mechanical grinding |
| 05/06/2009 | CN101427391A Nitride semiconductor component and method for the production thereof |
| 05/06/2009 | CN101427386A Selective implementation of barrier layers to achieve threshold voltage control in CMOS device fabrication with high k dielectrics |
| 05/06/2009 | CN101427373A Method for fabricating a semiconductor component including a high capacitance per unit area capacitor |
| 05/06/2009 | CN101427365A Semiconductor sensor device and method for manufacturing same |
| 05/06/2009 | CN101427364A Stressor integration and method thereof |
| 05/06/2009 | CN101427363A Semiconductor device and method for incorporating a halogen in a dielectric |
| 05/06/2009 | CN101427362A Method for producing an integrated circuit |
| 05/06/2009 | CN101427361A Metal interconnects in a dielectric material |
| 05/06/2009 | CN101427360A Wafer scale die handling |
| 05/06/2009 | CN101427359A Work clamp and wire bonding device |
| 05/06/2009 | CN101427358A Mold release film for semiconductor resin mold |
| 05/06/2009 | CN101427357A Nanoparticle implantation |
| 05/06/2009 | CN101427356A Implant optimization scheme |
| 05/06/2009 | CN101427355A Patterning sub-lithographic features with variable widths |
| 05/06/2009 | CN101427354A Plasma treatment of a semiconductor surface for enhanced nucleation of a metal-containing layer |
| 05/06/2009 | CN101427353A Silicon etching method |
| 05/06/2009 | CN101427352A Method and apparatus for monitoring plasma conditions in an etching plasma processing facility |
| 05/06/2009 | CN101427351A Adaptive electropolishing using thickness measurements and removal of barrier and sacrificial layers |
| 05/06/2009 | CN101427350A Methods of implanting ions and ion sources used for same |
| 05/06/2009 | CN101427349A Composite substrate, and method for the production of a composite substrate |
| 05/06/2009 | CN101427348A Methods to reduce the minimum pitch in a pattern |
| 05/06/2009 | CN101427347A SOI wafer manufacturing method |
| 05/06/2009 | CN101427346A Adjustable resistor for use in a resistive divider circuit and method for manufacturing |
| 05/06/2009 | CN101427345A Load lock control |
| 05/06/2009 | CN101427344A Perforated embedded plane package and method |