| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 05/06/2009 | CN101423761A Silicon wafer reclamation process |
| 05/06/2009 | CN101423747A Abrasive, method of polishing wafer, and method of producing semiconductor device |
| 05/06/2009 | CN101423681A Conductive pattern formation ink, conductive pattern and wiring substrate |
| 05/06/2009 | CN101422882A Grinding mat and method |
| 05/06/2009 | CN101422877A Grinding mat trimmer for chemical mechanical grinding |
| 05/06/2009 | CN101422874A Polishing apparatus |
| 05/06/2009 | CN101422873A Chemical mechanical polishing method |
| 05/06/2009 | CN101422849A Laser beam machining apparatus |
| 05/06/2009 | CN100485989C Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof |
| 05/06/2009 | CN100485985C Nitride semiconductor device |
| 05/06/2009 | CN100485984C Nitride semiconductor device |
| 05/06/2009 | CN100485974C Photoelectromotive force element and manufacturing method thereof |
| 05/06/2009 | CN100485971C Gallium arsenide PIN diode and preparation method thereof |
| 05/06/2009 | CN100485970C Silicon carbide semiconductor device with junction type field effect transistor and its producing method |
| 05/06/2009 | CN100485969C Method for fabricating semiconductor device |
| 05/06/2009 | CN100485968C Chip and manufacturing method thereof |
| 05/06/2009 | CN100485967C Semiconductor device and method of manufacturing the same |
| 05/06/2009 | CN100485966C High-voltage P-type metal oxide transistor and producing method thereof |
| 05/06/2009 | CN100485964C 半导体装置及其形成方法 Semiconductor device and method of forming |
| 05/06/2009 | CN100485962C Semiconductor device and method for fabricating the same |
| 05/06/2009 | CN100485961C Metal-oxide-semiconductor device having an enhanced shielding structure |
| 05/06/2009 | CN100485960C Semiconductor device having an edge termination structure and method of manufacture thereof |
| 05/06/2009 | CN100485959C Epitaxial structure of the compound insulation layer nitride high-electronic transfer transistor and its making method |
| 05/06/2009 | CN100485958C Semiconductor device and manufacturing process thereof |
| 05/06/2009 | CN100485955C Gallium nitride based semiconductor device and method of manufacturing same |
| 05/06/2009 | CN100485954C OLED integrated colour filter image quality improvement structure and method |
| 05/06/2009 | CN100485953C Substrate for organic EL and method for manufacturing the same |
| 05/06/2009 | CN100485951C Passive survey meter for electrically testing acceleration and voltage, and manufacture method thereof |
| 05/06/2009 | CN100485950C Semiconductor device and display device |
| 05/06/2009 | CN100485948C 半导体装置模块 Semiconductor device module |
| 05/06/2009 | CN100485947C Complementary metal oxide semiconductor image sensor and method for fabricating the same |
| 05/06/2009 | CN100485946C Image pickup apparatus, fabrication method for the same, camera module, and electronic device |
| 05/06/2009 | CN100485945C Semiconductor light receiving device and method of manufacturing the same |
| 05/06/2009 | CN100485943C Semiconductor device |
| 05/06/2009 | CN100485941C Programmable non-volatile memory device and its forming method |
| 05/06/2009 | CN100485939C Semiconductor integrated circuit and booster circuit |
| 05/06/2009 | CN100485938C Semiconductor constructions having a buried bit line, and method of forming same |
| 05/06/2009 | CN100485937C Semiconductor memory device and constructing method |
| 05/06/2009 | CN100485936C Semiconductor structure and method of manufacture thereof |
| 05/06/2009 | CN100485935C Semiconductor integrated circuit device and design method thereof |
| 05/06/2009 | CN100485934C Inductor for semiconductor device and method of fabricating the same |
| 05/06/2009 | CN100485931C Semiconductor element and its producing method |
| 05/06/2009 | CN100485927C 3D storage |
| 05/06/2009 | CN100485923C Semiconductor device of electrostatic protection circuit using thyristor as protection element |
| 05/06/2009 | CN100485920C Integrate circuit with double layer silicon carbon compound barrier layer |
| 05/06/2009 | CN100485919C Semiconductor device, and method for manufacturing the same |
| 05/06/2009 | CN100485918C Interconnection, interconnection forming method, thin-film transistor and displaying device |
| 05/06/2009 | CN100485917C Method for manufacturing non-exterior pin semiconductor packaging construction plated in sealing glue |
| 05/06/2009 | CN100485916C Semiconductor device and power supply unit utilizing the same |
| 05/06/2009 | CN100485915C 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 05/06/2009 | CN100485909C Structure combining IC integration base board and carrier board and manufacturing method for the same and electronic device |
| 05/06/2009 | CN100485908C Semiconductor device with quasi self-aligned source/drain FinFET and forming method thereof |
| 05/06/2009 | CN100485907C Flat panel display and method for fabricating the same |
| 05/06/2009 | CN100485906C Method for forming memory cell and peripherial circuit |
| 05/06/2009 | CN100485905C Magnetic random access memory using single crystal self-aligned diode |
| 05/06/2009 | CN100485904C Matrix type display device and manufacturing method thereof |
| 05/06/2009 | CN100485903C Active matrix substrate, method for manufacturing same, electro-optical device and electronic apparatus |
| 05/06/2009 | CN100485902C Substrate dividing method |
| 05/06/2009 | CN100485901C Substrate dividing method |
| 05/06/2009 | CN100485900C Through-wafer gateway and surface metallization for coupling thereto |
| 05/06/2009 | CN100485899C Semiconductor chip and method of fabricating the same |
| 05/06/2009 | CN100485898C Gripper unit, assembling head, and method for fitting substrates with electrical components |
| 05/06/2009 | CN100485897C Large base board material carrying table |
| 05/06/2009 | CN100485896C Semiconductor device and method of making the same |
| 05/06/2009 | CN100485895C Built-in wafer encapsulation structure and its making process |
| 05/06/2009 | CN100485894C Flip chip packaging method and packaging structure thereof |
| 05/06/2009 | CN100485893C Producing process for video sensing chip packaging and structure |
| 05/06/2009 | CN100485892C A method for manufacturing enhancement type ZnO channel layer thin film transistor by ammonia doping |
| 05/06/2009 | CN100485891C Non-volatile memory and its making method |
| 05/06/2009 | CN100485890C Method for manufacturing thin film electricity crystal and method for changing non-crystal inlay to multi-crystal inlay or single-crystal inlay |
| 05/06/2009 | CN100485889C Method for manufacturing thin film transistor |
| 05/06/2009 | CN100485888C High electron mobility transistor (HEMT) made of group XIII element nitride layers and manufacturing method thereof |
| 05/06/2009 | CN100485887C Semiconductor epitaxial wafer |
| 05/06/2009 | CN100485886C Al/Ti/Al/Ti/Pt/Au ohmic contact system adapted to GaN device |
| 05/06/2009 | CN100485885C Method for forming film |
| 05/06/2009 | CN100485884C Substrate for electronic device and method for processing same |
| 05/06/2009 | CN100485883C Plasma ashing method |
| 05/06/2009 | CN100485882C Method for manufacturing semiconductor device |
| 05/06/2009 | CN100485881C Method for washing crystal chip |
| 05/06/2009 | CN100485880C Alkaline post-chemical mechanical planarization cleaning compositions |
| 05/06/2009 | CN100485879C Method of producing group III nitride substrate wafers and group III nitride substrate wafers |
| 05/06/2009 | CN100485878C Ultrosonic cleaning nozzle and ultrosonic cleaning device |
| 05/06/2009 | CN100485877C Method for improving unevenness of polishing and method for preparing embedded copper metal layer |
| 05/06/2009 | CN100485876C Semiconductor processing methods for forming electrical contacts, and semiconductor structures |
| 05/06/2009 | CN100485875C Self-aligning contact window open manufacturing method, internal connecting structure and manufacturing method thereof |
| 05/06/2009 | CN100485874C Processing equipment for object to be processed |
| 05/06/2009 | CN100485873C Control method for epitaxial layer transition zone on re-mixed arsenic underlay |
| 05/06/2009 | CN100485872C Method for preparing amorphous semiconductor film and semiconductor device |
| 05/06/2009 | CN100485871C Liquid quantity monitor, semiconductor manufacturing equipment provided with liquid quantity monitor and method for monitoring liquid material and liquid quantity |
| 05/06/2009 | CN100485870C Film forming apparatus and gasifier |
| 05/06/2009 | CN100485869C Polysilicon layer and preparation method |
| 05/06/2009 | CN100485868C Semiconductor thin film manufacturing method and device, beam-shaping mask, and thin film transistor |
| 05/06/2009 | CN100485867C Epitaxial growth of lanthanum aluminate film material on silicon substrate and preparation method |
| 05/06/2009 | CN100485866C Method for forming sublithographic opening in semiconductor process |
| 05/06/2009 | CN100485865C Exposure device and device manufacturing method |
| 05/06/2009 | CN100485864C EUV light source, EUV exposure equipment and semiconductor device manufacturing method |
| 05/06/2009 | CN100485863C Substrate processing method and substrate processing apparatus |
| 05/06/2009 | CN100485862C Exposure apparatus, exposure method, and method for producing device |
| 05/06/2009 | CN100485861C Film etching method |
| 05/06/2009 | CN100485860C Film forming method, film forming device and storing medium |