Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2009
05/19/2009US7534692 Process for producing an integrated circuit comprising a capacitor
05/19/2009US7534691 Isolation structures for preventing photons and carriers from reaching active areas and methods of formation
05/19/2009US7534690 Non-volatile memory with asymmetrical doping profile
05/19/2009US7534689 Stress enhanced MOS transistor and methods for its fabrication
05/19/2009US7534688 Nonvolatile memory device with a non-planar gate-insulating layer and method of fabricating the same
05/19/2009US7534687 Semiconductor device and method for manufacturing the same
05/19/2009US7534686 Multi-structured Si-fin and method of manufacture
05/19/2009US7534685 Method for fabrication of a capacitor, and a monolithically integrated circuit comprising such a capacitor
05/19/2009US7534684 Methods of forming non-volatile memory devices having a multi-layered charge storage layer
05/19/2009US7534683 Method of making a MOS-gated transistor with reduced miller capacitance
05/19/2009US7534682 Semiconductor memory device with a stacked gate including a floating gate and a control gate and method of manufacturing the same
05/19/2009US7534681 Memory device fabrication
05/19/2009US7534680 Bipolar transistor, BiCMOS device, and method for fabricating thereof
05/19/2009US7534679 System and method for producing a semiconductor circuit arrangement
05/19/2009US7534678 Methods of forming CMOS integrated circuit devices having stressed NMOS and PMOS channel regions therein and circuits formed thereby
05/19/2009US7534677 Method of fabricating a dual gate oxide
05/19/2009US7534676 Method of forming enhanced device via transverse stress
05/19/2009US7534675 Techniques for fabricating nanowire field-effect transistors
05/19/2009US7534674 Method of making a semiconductor device with a stressor
05/19/2009US7534672 Tiered gate device with source and drain extensions
05/19/2009US7534671 Method for integrally forming an electrical fuse device and a MOS transistor
05/19/2009US7534670 Semiconductor device and manufacturing method of the same
05/19/2009US7534669 Method and structure to create multiple device widths in FinFET technology in both bulk and SOI
05/19/2009US7534668 Method of fabricating etch-stopped SOI back-gate contact
05/19/2009US7534667 Structure and method for fabrication of deep junction silicon-on-insulator transistors
05/19/2009US7534666 High voltage non punch through IGBT for switch mode power supplies
05/19/2009US7534665 Method of manufacturing semiconductor device
05/19/2009US7534664 Semiconductor device and method of manufacturing same
05/19/2009US7534663 Method for manufacturing a surface mount device
05/19/2009US7534662 Methods for hermetic sealing of post media-filled MEMS package
05/19/2009US7534661 Method of forming molded resin semiconductor device
05/19/2009US7534660 Methods for assembly and packaging of flip chip configured dice with interposer
05/19/2009US7534659 Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device
05/19/2009US7534658 Process for manufacturing microelectronic, microoptoelectronic or micromechanical devices
05/19/2009US7534657 Method of manufacturing a semiconductor device
05/19/2009US7534656 Image sensor device and method of manufacturing the same
05/19/2009US7534655 Method of arranging dies in a wafer for easy inkless partial wafer process
05/19/2009US7534654 Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
05/19/2009US7534653 Chip packaging process
05/19/2009US7534652 Microelectronic elements with compliant terminal mountings and methods for making the same
05/19/2009US7534651 Seedless wirebond pad plating
05/19/2009US7534650 Carbon-carbon and/or metal-carbon fiber composite heat spreader
05/19/2009US7534649 Thermoset polyimides for microelectronic applications
05/19/2009US7534648 resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments
05/19/2009US7534647 Damascene phase change RAM and manufacturing method
05/19/2009US7534646 Method of fabricating an organic field transistor
05/19/2009US7534645 CMOS type image sensor module having transparent polymeric encapsulation material
05/19/2009US7534644 Solid-state imaging device, production method and drive method thereof, and camera
05/19/2009US7534643 CMOS image sensor and method for fabricating the same
05/19/2009US7534642 Methods of manufacturing an image device
05/19/2009US7534641 Method for manufacturing a micro-electro-mechanical device
05/19/2009US7534640 Support structure for MEMS device and methods therefor
05/19/2009US7534638 III-nitride light emitting devices grown on templates to reduce strain
05/19/2009US7534637 Tunable alignment geometry
05/19/2009US7534636 Lids for wafer-scale optoelectronic packages
05/19/2009US7534635 Getter precursors for hermetically sealed packaging
05/19/2009US7534634 Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source
05/19/2009US7534633 LED with substrate modifications for enhanced light extraction and method of making same
05/19/2009US7534630 Method of improving power distribution in wirebond semiconductor packages
05/19/2009US7534629 Manufacturing method of semiconductor integrated circuit device
05/19/2009US7534628 Method for forming semiconductor device and method for forming photovoltaic device
05/19/2009US7534627 Methods and systems for controlling critical dimensions in track lithography tools
05/19/2009US7534626 MgO-based tunnel spin injectors
05/19/2009US7534625 Phase change memory with damascene memory element
05/19/2009US7534554 Photoacid generator, a quencher and a salt having a buffering function for an acid which is generated by the acid generator, wherein said buffer is a salt of a long chain alkyl(oxy)benzenesulfonic acid with an organic amine; damascene; solves problem of photoresist remaining in the via hole
05/19/2009US7534550 improve lithography characteristics, and reduction in defects; increase solubility in developing solution under the action of acid which is generated by acid generator on irradiation; tetra- or tripolymers contains monomers of methacrylic acid, adamantyl methacrylate, butyrolactone acrylate
05/19/2009US7534533 Polarization analyzing system, exposure method, and method for manufacturing semiconductor device
05/19/2009US7534531 Full phase shifting mask in damascene process
05/19/2009US7534498 Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
05/19/2009US7534467 Reduced-pressure drying unit and coating film forming method
05/19/2009US7534412 Large-volume CaF2 single crystals with reduced scattering and improved laser stability, and uses thereof
05/19/2009US7534364 Methods for a multilayer retaining ring
05/19/2009US7534363 Method for providing uniform removal of organic material
05/19/2009US7534310 Single crystal GaN substrate, method of growing single crystal GaN and method of producing single crystal GaN substrate
05/19/2009US7534307 Methods for processing wafer surfaces using thin, high velocity fluid layer
05/19/2009US7534301 RF grounding of cathode in process chamber
05/19/2009US7534298 Apparatus and method of detecting the electroless deposition endpoint
05/19/2009US7534295 III nitride single crystal manufacturing method
05/19/2009US7534277 Slurry composition for secondary polishing of silicon wafer
05/19/2009US7534166 Chemical mechanical polishing apparatus
05/19/2009US7534080 Vacuum processing and transfer system
05/19/2009US7533629 Arrangement, method and electrode for generating a plasma
05/19/2009US7533628 Volume-optimized reactor for simultaneously coating eyeglasses on both sides
05/19/2009US7533462 Method of constructing a membrane probe
05/19/2009CA2401220C High frequency plasma beam source
05/14/2009WO2009062123A2 Pitch reduction using oxide spacer
05/14/2009WO2009061886A2 Tensile strained ge for electronic and optoelectronic applications
05/14/2009WO2009061809A2 Single poly eeprom allowing continuous adjustment of its threshold voltage
05/14/2009WO2009061738A1 Gas mixing swirl insert assembly
05/14/2009WO2009061737A1 Counter-balanced substrate support
05/14/2009WO2009061714A2 Implantation of multiple species to address copper reliability
05/14/2009WO2009061704A2 Atomic layer deposition encapsulation
05/14/2009WO2009061670A2 Workpiece support with fluid zones for temperature control
05/14/2009WO2009061599A1 Methods of selectively depositing silicon-containing films
05/14/2009WO2009061579A1 Dynamic pattern generator with cup-shaped structure
05/14/2009WO2009061411A2 Use melanocortins to treat insulin sensitivity
05/14/2009WO2009061353A2 Production of free-standing solid state layers by thermal processing of substrates with a polymer
05/14/2009WO2009061340A1 Power semiconductor devices with mesa structures and buffer layers including mesa steps
05/14/2009WO2009061322A1 Low-temperature junction growth using hot-wire chemical vapor deposition
05/14/2009WO2009061290A1 Metal work function adjustment by ion implantation
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