Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2009
05/13/2009EP2059089A2 Light irradiation type heat treatment device
05/13/2009EP2058889A1 Polymer electrolyte composition
05/13/2009EP2058865A1 Method for forming semiconductor substrate and electrode, and method for manufacturing solar battery
05/13/2009EP2058862A1 Field-effect transistor and method for producing a field-effect transistor.
05/13/2009EP2058859A2 Wiring substrate and semiconductor device and method of manufacturing the same
05/13/2009EP2058857A2 IC chip package with directly connected leads
05/13/2009EP2058855A2 Method of manufacturing semiconductor package
05/13/2009EP2058854A2 A semiconductor device
05/13/2009EP2058853A1 Semiconductor substrate jig and method of manufacturing a semiconductor device
05/13/2009EP2058852A2 Vertical carousel and vertical transportation method using the vertical carousel
05/13/2009EP2058851A2 Elevator linear motor drive
05/13/2009EP2058850A2 Semiconductor substrate jig and method of manufacturing a semiconductor device
05/13/2009EP2058849A2 Rotating temperature controlled substrate pedestal for film uniformity
05/13/2009EP2058848A1 Lateral junction field effect transistor
05/13/2009EP2058847A1 Method of manufacturing nanowires parallel to their support substrate
05/13/2009EP2058846A1 Method for producing a n-metered zone in a semiconductor wafer and semiconductor component
05/13/2009EP2058845A1 Thin film manufacturing apparatus using discharge electrode, and solar cell manufacturing method
05/13/2009EP2058844A1 Method of forming a semiconductor device
05/13/2009EP2058843A2 Multi-port pumping system for substrate processing chambers
05/13/2009EP2058842A2 Pulse train annealing method and apparatus
05/13/2009EP2058841A2 Heat transfer element and device for thermal treatment of substrates
05/13/2009EP2058840A2 Heating blocks
05/13/2009EP2058667A2 Microelectronic spring contact element
05/13/2009EP2058623A2 Method and apparatus for measuring a bump on a substrate
05/13/2009EP2058080A1 Normal temperature joining method and normal temperature joining device
05/13/2009EP2057687A1 Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure
05/13/2009EP2057677A1 Method and apparatus for manufacturing an electronic module, and electronic module
05/13/2009EP2057676A2 Semiconductor devices including fine pitch arrays with staggered contacts and methods for designing and fabricating the same
05/13/2009EP2057675A2 Implant at shallow trench isolation corner
05/13/2009EP2057674A2 Workpiece handling scan arm for ion implantation system
05/13/2009EP2057673A2 Electrical conductivity bridge in a conductive multilayer article
05/13/2009EP2057672A1 Method and apparatus for making semiconductor packages
05/13/2009EP2057671A1 Jfet with built in back gate in either soi or bulk silicon
05/13/2009EP2057670A2 Method for selective plasmochemical dry-etching of phosphosilicate glass deposited on surfaces of silicon wafers
05/13/2009EP2057669A2 Selective etch chemistries for forming high aspect ratio features and associated structures
05/13/2009EP2057668A2 Methods for substrate surface cleaning suitable for fabricating silicon-on-insulator structures
05/13/2009EP2057667A1 A method of antistatic deposition on components of mobile phone
05/13/2009EP2057666A2 Spin coater with optical controls
05/13/2009EP2057665A2 Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities
05/13/2009EP2024716A4 Method and system for testing indirect bandgap semiconductor devices using luminescence imaging
05/13/2009EP1977444A4 Sensing devices from molecular electronic devices
05/13/2009EP1779436A4 Hybrid substrate technology for high-mobility planar and multiple-gate mosfets
05/13/2009EP1751325A4 Controlled vapor deposition of multilayered coatings adhered by an oxide layer
05/13/2009EP1681594B1 Composition for forming underlying film containing dextrin ester compound
05/13/2009EP1652225A4 A semiconductor device having an organic anti-reflective coating (arc) and method therefor
05/13/2009EP1652217A4 Method and apparatus for scrambling cell content in an integrated circuit
05/13/2009EP1497046A4 In-situ local heating using megasonic transducer resonator
05/13/2009EP1474542B1 Method of CIRCUIT FABRICATION using an aperture mask
05/13/2009EP1449239B1 Magneto-resistive bit structure and method of manufacturing therefor
05/13/2009EP1448736B1 Boron-containing polishing system and method
05/13/2009EP1437300B1 System for embossing carrier tape and method for producing carrier tape
05/13/2009EP1429185B1 Etching method and use of a composition for forming etching protective layer
05/13/2009EP1405018A4 Wafer boat with arcuate wafer support arms
05/13/2009EP1356498A4 Chromium adhesion layer for copper vias in low-k technology
05/13/2009EP1214557A4 Thermocapillary dryer
05/13/2009EP1063684B1 Method for producing a projection optical system
05/13/2009EP1062172A4 Semiconductor wafer input/output handling system
05/13/2009CN201238047Y Thread feeding/drawing device
05/13/2009CN201238046Y Inlet/outlet apparatus
05/13/2009CN201238045Y Double pre-heating materiel gripper mechanism of full-automatic lead bonding machine
05/13/2009CN201238044Y Novel metal wire soldering sparking electrode used for semiconductor device production
05/13/2009CN201238043Y Control wafer and retaining wafer
05/13/2009CN201236994Y Reflow-stopping reaction valve
05/13/2009CN201236206Y Silicon wafer bearing device in deposition film manufacture process
05/13/2009CN201235596Y Molding mould for LED
05/13/2009CN201235498Y Lapping machine for two-side of wafer
05/13/2009CN101432931A Electroconductive particle placement sheet and anisotropic elctroconductive film
05/13/2009CN101432898A Semiconductor light emitting element and wafer
05/13/2009CN101432890A Conductive paste for solar cell electrode
05/13/2009CN101432886A An SOI transistor having a reduced body potential and a method of forming the same
05/13/2009CN101432882A A transistor having a channel with tensile strain and oriented along a crystallographic orientation with increased charge carrier mobility
05/13/2009CN101432877A Method for forming a semiconductor device having a fin and structure thereof
05/13/2009CN101432869A Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device
05/13/2009CN101432868A Three-dimensional packaging scheme for package types utilizing a sacrificail metal base
05/13/2009CN101432867A Methods and materials useful for chip stacking, chip and wafer bonding
05/13/2009CN101432866A Method and apparatus for matching defect distribution pattern
05/13/2009CN101432865A Method of plasma processing with in-situ monitoring and process parameter tuning
05/13/2009CN101432864A Method and system for classifying defect distribution, method and system for specifying causative equipment, computer program and recording medium
05/13/2009CN101432863A System for specifying equipment causing failure
05/13/2009CN101432862A Substrate for a microelectronic package and method of fabricating thereof
05/13/2009CN101432861A Connection structure and method of producing the same
05/13/2009CN101432860A Method for forming self-aligned metal silicide contacts
05/13/2009CN101432859A An SOI transistor having an embedded strain layer and a reduced floating body effect and a method for forming the same
05/13/2009CN101432858A Programming and erasing structure for a floating gate memory cell and method of making
05/13/2009CN101432857A Method and apparatus for laser processing
05/13/2009CN101432856A Multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same
05/13/2009CN101432855A Method for manufacturing semiconductor substrate, solar semiconductor substrate, and etching liquid
05/13/2009CN101432854A Polishing liquid for CMP and method of polishing
05/13/2009CN101432853A Laser processing of workpieces containing low-K dielectric material
05/13/2009CN101432852A Non-volatile memory device
05/13/2009CN101432851A Laser irradiation device, laser irradiation method, and method for manufacturing modified object
05/13/2009CN101432850A Method for manufacturing group 3-5 nitride semiconductor substrate
05/13/2009CN101432849A SOI wafer manufacturing method
05/13/2009CN101432848A Low power RF tuning using optical and non-reflected power methods
05/13/2009CN101432847A Byproduct collecting apparatus of semiconductor apparatus
05/13/2009CN101432846A Method for bonding a semiconductor substrate to a metal substrate
05/13/2009CN101432673A Automated manufacturing systems and methods
05/13/2009CN101432659A 感光性树脂组合物及感光性薄膜 The photosensitive resin composition and a photosensitive film
05/13/2009CN101432622A Quantitative evaluation device and method of atom vacancy existing in silicon wafer
05/13/2009CN101432471A Method for manufacturing gallium nitride crystal and gallium nitride wafer