| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/30/2009 | WO2009055245A1 Showerhead design with precursor pre-mixing |
| 04/30/2009 | WO2009055244A1 Showerhead design with precursor source |
| 04/30/2009 | WO2009055208A1 Process testers and testing methodology for thin-film photovoltaic devices |
| 04/30/2009 | WO2009055173A2 Floating body field-effect transistors, and methods of forming floating body field-effect transistors |
| 04/30/2009 | WO2009055156A1 Semiconductor structure and method of manufacture |
| 04/30/2009 | WO2009055113A1 Filler cells for design optimization in a place-and-route system |
| 04/30/2009 | WO2009055108A1 Semiconductor structure and method of manufacture |
| 04/30/2009 | WO2009054936A2 Methods, structures and designs for self-aligning local interconnects used in integrated circuits |
| 04/30/2009 | WO2009054804A1 Nanowire growth on dissimilar material |
| 04/30/2009 | WO2009054696A1 Baffle, substrate supporting apparatus and plasma processing apparatus and plasma processing method |
| 04/30/2009 | WO2009054574A1 Method of fabricating liquid for oxide thin film |
| 04/30/2009 | WO2009054522A1 Composition containing polysilazane compound, which can provide dense siliceous film |
| 04/30/2009 | WO2009054513A1 Stamper, process for producing the same, process for producing molding, and aluminum base die for stamper |
| 04/30/2009 | WO2009054487A1 Polyimide precursor and photosensitive resin composition containing polyimide precursor |
| 04/30/2009 | WO2009054469A1 Monitoring device, monitoring method, inspection device and inspection method |
| 04/30/2009 | WO2009054466A1 DISPLAY DEVICE AND Cu ALLOY FILM FOR USE IN THE DISPLAY DEVICE |
| 04/30/2009 | WO2009054461A1 Heat radiation structure and process for production thereof, heat sink and radiator, heater and susceptor, ceramic filter and process for production thereof, and ceramic filter and diesel particulate filter for exhaust gas purification |
| 04/30/2009 | WO2009054413A1 Semiconductor device manufacturing method |
| 04/30/2009 | WO2009054404A1 Inspection method based on captured image and inspection device |
| 04/30/2009 | WO2009054403A1 Inspection device for disk-shaped substrate |
| 04/30/2009 | WO2009054370A1 Cmp polishing liquid and method for polishing substrate using the same |
| 04/30/2009 | WO2009054343A1 Method of forming copper wiring pattern and copper oxide particle dispersion for use in the same |
| 04/30/2009 | WO2009054297A1 Method for polishing substrate |
| 04/30/2009 | WO2009054268A1 METHOD FOR FORMING Cu WIRING |
| 04/30/2009 | WO2009054250A1 Semiconductor substrate and method for inspecting semiconductor substrate |
| 04/30/2009 | WO2009054236A1 Planar antenna and method for manufacturing the same |
| 04/30/2009 | WO2009054232A1 Semiconductor manufacturing apparatus, semiconductor manufacturing method, and electronic device |
| 04/30/2009 | WO2009054219A1 Electrode manufacturing method and thin film transistor manufacturing method using the same |
| 04/30/2009 | WO2009054194A1 Anisotropically conductive adhesive |
| 04/30/2009 | WO2009054180A1 Magnetoresistive effect element and magnetic random access memory |
| 04/30/2009 | WO2009054164A1 Gold alloy wire for ball bonding |
| 04/30/2009 | WO2009054140A1 Semiconductor device and method for manufacturing the same |
| 04/30/2009 | WO2009054131A1 Forming method of etching mask, control program and program storage medium |
| 04/30/2009 | WO2009054115A1 SEMICONDUCTOR DEVICE OF SOI (Silicon on insulator) STRUCTURE, AND ITS MANUFACTURING METHOD |
| 04/30/2009 | WO2009054102A1 Defect classification method and defect classification apparatus |
| 04/30/2009 | WO2009054064A1 Substrate loading apparatus |
| 04/30/2009 | WO2009053788A1 Container for storing plates for electronic circuits and relative method |
| 04/30/2009 | WO2009053787A1 Alignment device and method to align plates for electronic circuits |
| 04/30/2009 | WO2009053786A1 Positioning device to position one or more plates for electronic circuits in a metal deposition unit, and related method |
| 04/30/2009 | WO2009053785A1 Drying apparatus for plate elements for electronics and the like, and relative method |
| 04/30/2009 | WO2009053783A1 Automatic store and method for storing plates of electronic circuits |
| 04/30/2009 | WO2009053779A1 Method for manufacturing a non-volatile memory, nonvolatile memory device, and an integrated circuit |
| 04/30/2009 | WO2009053479A2 Application of high power magnetron sputtering to through silicon via metallization |
| 04/30/2009 | WO2009053357A1 Electrical power component, in particular power semiconductor module, having a cooling device and method for the planar and heat-conductive attachment of a cooling device to an electrical power component |
| 04/30/2009 | WO2009053355A1 Method of splitting a substrate |
| 04/30/2009 | WO2009053334A2 Method and apparatus for indirectly cooling thin components |
| 04/30/2009 | WO2009053327A1 Method for fabricating super-steep retrograde well mosfet on soi or bulk silicon substrate, and device fabricated in accordance with the method |
| 04/30/2009 | WO2009053289A1 Hover cushion transport for webs in a web coating process |
| 04/30/2009 | WO2009053251A1 Integration scheme for multiple metal gate work function structures |
| 04/30/2009 | WO2009052878A1 Semiconductor component comprising a polycrystalline semiconductor layer |
| 04/30/2009 | WO2009052707A1 A plasma etching residues cleaning composition |
| 04/30/2009 | WO2009052682A1 Fabrication of recordable electrical memory |
| 04/30/2009 | WO2009052649A1 Self-alignment apparatus and method for self-alignment during chip package process by using magnetic field |
| 04/30/2009 | WO2009035727A3 Tem grids for determination of structure-property relationships in nanotechnology |
| 04/30/2009 | WO2009032566A3 Techniques for terminal insulation in an ion implanter |
| 04/30/2009 | WO2009032536A3 Method for manufacturing a semiconductor die and a semiconductor device comprising the semiconductor die obtained thereby |
| 04/30/2009 | WO2009032530A3 Thickened sidewall dielectric for memory cell |
| 04/30/2009 | WO2009031830A3 Exhaust unit, exhaust method using the exhaust unit, and substrate processing apparatus including the exhaust unit |
| 04/30/2009 | WO2009031829A3 Substrate processing apparatus |
| 04/30/2009 | WO2009029939A3 Aerosol jet® printing system for photovoltaic applications |
| 04/30/2009 | WO2009029851A3 Apparatus and methods for predicting a semiconductor parameter across an area of a wafer |
| 04/30/2009 | WO2009027888A3 Solderable structure |
| 04/30/2009 | WO2009026509A3 Semiconductor package having buss-less substrate |
| 04/30/2009 | WO2009026403A3 Semiconductor device formed with source/drain nitrogen implant |
| 04/30/2009 | WO2009026350A3 Semiconductor device source and drain regions formed utilizing dual capping layers and split thermal processes |
| 04/30/2009 | WO2009015742A3 Device and method for holding and transporting substrates |
| 04/30/2009 | WO2009003029A3 High-temperature spin-on temporary bonding compositions |
| 04/30/2009 | WO2009002771A3 Slit valve door |
| 04/30/2009 | WO2008156516A3 Methods of fabricating silicon carbide power devices by at least partially removing an n-type silicon carbide substrate, and silicon carbide power devices so fabricated |
| 04/30/2009 | WO2008125096A3 Method for producing an opto-electronic component and opto-electronic component |
| 04/30/2009 | WO2008112086A3 Electroplating process |
| 04/30/2009 | WO2008042732A3 Recessed sti for wide transistors |
| 04/30/2009 | WO2007067541A3 Systems and methods for processing a film, and thin films |
| 04/30/2009 | WO2007064506A3 End point detection in workpiece processing |
| 04/30/2009 | WO2007064435A3 Method of determining a target mesa configuration of an electrostatic chuck |
| 04/30/2009 | WO2007053624A3 Optical devices featuring textured semiconductor layers |
| 04/30/2009 | WO2007047949A3 Methods for growing carbon nanotubes on single crystal substrates |
| 04/30/2009 | WO2007040679A3 Method and apparatus for forming nickel silicide with low defect density in fet devices |
| 04/30/2009 | WO2007038645A3 Electrostatic protection systems and methods |
| 04/30/2009 | WO2007038342A3 Flip chip semiconductor device and process of its manufacture |
| 04/30/2009 | WO2007030294A3 Method for forming integrated circuit utilizing dual semiconductors |
| 04/30/2009 | WO2007025039A3 Pulsed etching cooling |
| 04/30/2009 | WO2007022370A3 A method for fabricating a semiconductor device |
| 04/30/2009 | WO2007022075A3 Tin-silver solder bumping in electronics manufacture |
| 04/30/2009 | WO2007021639A3 3d ic method and device |
| 04/30/2009 | WO2007018653A3 High electron mobility electronic device structures comprising native substrates and methods for making the same |
| 04/30/2009 | WO2007011512A3 Arrangement for tool equipment |
| 04/30/2009 | WO2007002024A3 Algainn-based lasers produced using etched facet technology |
| 04/30/2009 | WO2007001617A3 Method of making a substrate con tact for a capped mems |
| 04/30/2009 | WO2007001295A3 Quantum dot based optoelectronic device and method of making same |
| 04/30/2009 | WO2006135746A3 Charge balance field effect transistor |
| 04/30/2009 | WO2006101986A3 Mettalic dispersion and formation of compound film for photovoltaic device active layer |
| 04/30/2009 | WO2006084128A3 Apparatus, method and computer program product providing radial addressing of nanowires |
| 04/30/2009 | WO2006078851A3 End point detection method for plasma etching of semiconductor wafers with low exposed area |
| 04/30/2009 | WO2006023699A3 Photonic crystal, conjugated polymers suitable for photonic crystals, and a method for synthesizing conjugated polymers |
| 04/30/2009 | WO2006023159A3 Transistor structure with stress modification and capacitive reduction feature in a width direction and method thereof |
| 04/30/2009 | WO2005112094A9 Method for making a semiconductor structure using silicon germanium |
| 04/30/2009 | WO2005097883A3 Method of producing a crosslinked coating in the manufacture of integrated circuits |
| 04/30/2009 | WO2005036610A3 Multi-surface contact ic packaging structures and assemblies |
| 04/30/2009 | US20090113372 Interconnect routing methods of integrated circuit designs |