Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2009
05/12/2009US7531409 Fabrication method and structure for providing a recessed channel in a nonvolatile memory device
05/12/2009US7531408 Method of manufacturing a semiconductor device containing a PbxSr(1-x)[Zr,Ti]xRu(1-x)O3 film in a capacitor
05/12/2009US7531407 Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating same
05/12/2009US7531406 Method for fabricating an electrical component
05/12/2009US7531405 Method of manufacturing a dielectric layer and corresponding semiconductor device
05/12/2009US7531404 Semiconductor device having a metal gate electrode formed on an annealed high-k gate dielectric layer
05/12/2009US7531403 SOI semiconductor components and methods for their fabrication
05/12/2009US7531402 Method of manufacturing semiconductor device with offset sidewall structure
05/12/2009US7531401 Method for improved fabrication of a semiconductor using a stress proximity technique process
05/12/2009US7531400 Methods for fabricating MOS transistor gates with doped silicide
05/12/2009US7531399 Semiconductor devices and methods with bilayer dielectrics
05/12/2009US7531398 Methods and devices employing metal layers in gates to introduce channel strain
05/12/2009US7531397 Method for manufacturing a semiconductor device on GAN substrate having surface bidirectionally inclined toward <1-100> and <11-20> directions relative to {0001} crystal planes
05/12/2009US7531396 Method of manufacturing semiconductor device
05/12/2009US7531395 Methods of forming a layer comprising epitaxial silicon, and methods of forming field effect transistors
05/12/2009US7531394 Manufacturing method for a TFT LCD array substrate
05/12/2009US7531393 Non-planar MOS structure with a strained channel region
05/12/2009US7531392 Multi-orientation semiconductor-on-insulator (SOI) substrate, and method of fabricating same
05/12/2009US7531391 CMOS image sensor and method for manufacturing the same
05/12/2009US7531390 Crystallizing method, thin-film transistor manufacturing method, thin-film transistor, and display device
05/12/2009US7531389 Method of manufacturing semiconductor device
05/12/2009US7531388 Electrically programmable fuse structures with narrowed width regions configured to enhance current crowding and methods of fabricating thereof
05/12/2009US7531387 Flip chip mounting method and bump forming method
05/12/2009US7531386 Semiconductor package
05/12/2009US7531385 Flip chip mounting method and method for connecting substrates
05/12/2009US7531384 Enhanced interconnect structure
05/12/2009US7531383 Array quad flat no-lead package and method of forming same
05/12/2009US7531382 Method of fabricating a patterned device using sacrificial spacer layer
05/12/2009US7531381 Manufacturing method of a quad flat no-lead package structure
05/12/2009US7531380 Methods of forming light-emitting devices having an active region with electrical contacts coupled to opposing surfaces thereof
05/12/2009US7531379 Method of forming CMOS imager with capacitor structures
05/12/2009US7531378 Forming an intermediate electrode between an ovonic threshold switch and a chalcogenide memory element
05/12/2009US7531377 Optical device
05/12/2009US7531376 Array substrate for transflective liquid crystal display device and a fabricating method thereof
05/12/2009US7531375 Solid image-pickup device and method for manufacturing the solid image pickup device
05/12/2009US7531374 CMOS image sensor process and structure
05/12/2009US7531373 Methods of forming a conductive interconnect in a pixel of an imager and in other integrated circuitry
05/12/2009US7531372 Method for manufacturing array substrate for liquid crystal display device
05/12/2009US7531371 Multisurfaced microdevice system array and a method of producing the array
05/12/2009US7531370 Light-emitting diode and its manufacturing method
05/12/2009US7531369 Process endpoint detection method using broadband reflectometry
05/12/2009US7531368 In-line lithography and etch system
05/12/2009US7531367 Utilizing sidewall spacer features to form magnetic tunnel junctions in an integrated circuit
05/12/2009US7531294 Forming film pattern over a substrate, forming a second film pattern which is curved on the surface of first film pattern or substrate, and forming film pattern by irradiating the first film pattern with light with second film pattern and modifying part of the second film pattern; cost efficiency
05/12/2009US7531232 Component for vacuum apparatus, production method thereof and apparatus using the same
05/12/2009US7531218 Methods and apparatuses for fluidic self assembly
05/12/2009US7531115 Conductive material and method for filling via-hole
05/12/2009US7531108 Fine particle sizes; narrow particle size distribution; display devices and lighting elements; printed on explosives or ammunitions; currency; printed on confidential documentation
05/12/2009US7531101 Method for eliminating punctual defects comprised in an electrochemical device
05/12/2009US7531077 Forming and adhering a multi-material layer to a previously formed layer to a substrate to build up a three-dimensional structure from a plurality of adhered multi-material layers each having a thickness, separating at least a portion of sacrificial material layers from the structure
05/12/2009US7531061 Gas temperature control for a plasma process
05/12/2009US7531060 Integrated tool assemblies with intermediate processing modules for processing of microfeature workpieces
05/12/2009US7531059 Cleaning of semiconductor wafers by contaminate encapsulation
05/12/2009US7531040 Resist recovery method
05/12/2009US7531039 Substrate processing apparatus and substrate processing system
05/12/2009US7531011 Method of manufacturing capacitor device
05/12/2009US7530778 High-Performance non-contact support platforms
05/12/2009US7530749 Coater/developer and coating/developing method
05/12/2009US7530359 Plasma treatment system and cleaning method of the same
05/12/2009US7530164 Wafer-level underfill process making use of sacrificial contact pad protective material
05/12/2009US7530163 Electronic parts packaging structure and method of manufacturing the same
05/12/2009CA2463169C Method and device for fabricating semiconductor light emitting elements
05/12/2009CA2344342C Production of bulk single crystals of aluminum nitride, silicon carbide and aluminum nitride:silicon carbide alloy
05/07/2009WO2009059302A1 Fabrication of contacts for silicon solar cells including printing burn through layers
05/07/2009WO2009059238A1 Plasma treatment between deposition processes
05/07/2009WO2009059018A1 Compositions and methods of enhancing immune responses to flagellated bacterium
05/07/2009WO2009058744A1 Spacer process for on pitch contacts and related structures
05/07/2009WO2009058695A2 Cool impact-ionization transistor and method for making same
05/07/2009WO2009058580A1 High-injection heterojunction bipolar transistor
05/07/2009WO2009058532A2 Methods for fabricating sub-resolution alignment marks on semiconductor structures and semiconductor structures including same
05/07/2009WO2009058486A1 Method for integrating nvm circuitry with logic circuitry
05/07/2009WO2009058463A1 Composition, method and process for polishing a wafer
05/07/2009WO2009058450A1 Method for trapping implant damage in a semiconductor substrate
05/07/2009WO2009058449A1 Method for suppressing lattice defects in a semiconductor substrate
05/07/2009WO2009058376A2 Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body
05/07/2009WO2009058288A1 Amidoxime compounds as chelating agents in semiconductor processes
05/07/2009WO2009058287A1 Process of purification of amidoxime containing cleaning solutions and their use
05/07/2009WO2009058278A1 Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions
05/07/2009WO2009058277A1 Novel nitrile and amidoxime compounds and methods of preparation
05/07/2009WO2009058275A1 Methods of post chemical mechanical polishing and wafer cleaning using amidoxime compositions
05/07/2009WO2009058274A1 Chemical mechanical polishing and wafer cleaning composition comprising amidoxime compounds and associated method for use
05/07/2009WO2009058272A1 Copper cmp polishing pad cleaning composition comprising of amidoxime compounds
05/07/2009WO2009058245A2 Improved substrate compositions and methods for forming semiconductor on insulator devices
05/07/2009WO2009058242A1 Method for adjusting the height of a gate electrode in a semiconductor device
05/07/2009WO2009058235A2 High lifetime consumable silicon nitride-silicon dioxide plasma processing components
05/07/2009WO2009058187A1 Structure and fabrication of semiconductor architecture having field-effect transistors especially suitable for analog applications.
05/07/2009WO2009058181A2 Compounds for photoresist stripping
05/07/2009WO2009058142A1 Method to reduce trench capacitor leakage for random access memory device
05/07/2009WO2009058096A1 Device for supporting workpiece
05/07/2009WO2009057968A2 Sawing apparatus
05/07/2009WO2009057927A2 Package for semiconductor device and packaging method thereof
05/07/2009WO2009057892A1 Method of coating exterior surface of case with high resistance thin film
05/07/2009WO2009057838A1 Apparatus for surface-treating wafer using high-frequency inductively-coupled plasma
05/07/2009WO2009057769A1 Novel sulfonic acid salt and derivative thereof, photoacid generator agent, and resist material and pattern formation method using the photoacid generator agent
05/07/2009WO2009057764A1 Etching method and method for manufacturing optical/electronic device using the same
05/07/2009WO2009057758A1 Container exchanging device and container exchanging method
05/07/2009WO2009057715A1 Magnetron unit, magnetron sputtering apparatus and method for manufacturing electronic device
05/07/2009WO2009057710A1 Substrate holding member, substrate bonding apparatus, apparatus for manufacturing multilayer substrate, substrate bonding method, method for manufacturing multilayer substrate, and method for manufacturing multilayer semiconductor device
05/07/2009WO2009057700A1 Transfer method and transfer device
05/07/2009WO2009057667A1 Formation method of single crystal semiconductor layer, formation method of crystalline semiconductor layer, formation method of polycrystalline layer, and method for manufacturing semiconductor device