Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2009
05/14/2009US20090121320 Method of manufacturing p-type nitride semiconductor and semiconductor device fabricated by the method
05/14/2009US20090121319 Power semiconductor devices with mesa structures and buffer layers including mesa steps
05/14/2009US20090121318 Semiconductor device, DRAM integrated circuit device, and method of producing the same
05/14/2009US20090121316 Electronic Component with Reactive Barrier and Hermetic Passivation Layer
05/14/2009US20090121315 Method for producing an integrated circuit and arrangement comprising a substrate
05/14/2009US20090121314 Manufacturing method for forming an integrated circuit device and corresponding integrated circuit device
05/14/2009US20090121313 Semiconductor device with at least one air gap provided in chip outer area
05/14/2009US20090121312 Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate
05/14/2009US20090121311 Semiconductor device and method of fabricating the same
05/14/2009US20090121310 Semiconductor device and manufacturing method for the same
05/14/2009US20090121309 Semiconductor device and method for fabricating the same
05/14/2009US20090121299 Wafer level sensing package and manufacturing process thereof
05/14/2009US20090121295 Method and structure for reducing induced mechanical stresses
05/14/2009US20090121291 Dense chevron non-planar field effect transistors and method
05/14/2009US20090121288 Multiple gate field effect transistor structure and method for fabricating same
05/14/2009US20090121286 Integrated Circuit Comprising a Field Effect Transistor and Method of Fabricating the Same
05/14/2009US20090121284 Semiconductor device and method for manufacturing the same
05/14/2009US20090121283 Semiconductor device and fabrication method of the same
05/14/2009US20090121279 Semiconductor device and method of manufacturing the same
05/14/2009US20090121278 Structure and fabrication method of flash memory
05/14/2009US20090121274 Semiconductor memory device and method of manufacturing the same
05/14/2009US20090121271 Vertical-type non-volatile memory devices
05/14/2009US20090121270 Design structure for a trench capacitor
05/14/2009US20090121269 Integrated circuit comprising a transistor and a capacitor, and fabrication method
05/14/2009US20090121268 Semiconductor Memory Devices Having Vertical Channel Transistors and Related Methods
05/14/2009US20090121266 Methods and structures for exchange-coupled magnetic multi-layer structure with improved operating temperature behavior
05/14/2009US20090121264 Cmos image sensor and method of forming the same
05/14/2009US20090121263 Semiconductor device and its manufacturing method
05/14/2009US20090121261 STRUCTURE AND METHOD FOR COMPACT LONG-CHANNEL FETs
05/14/2009US20090121258 Field effect transistor containing a wide band gap semiconductor material in a drain
05/14/2009US20090121256 Semiconductor device with improved short channel effect of a pmos and stabilized current of an nmos and method for manufacturing the same
05/14/2009US20090121251 Siloxane-hydantoin copolymer, optoelectronic device encapsulated therewith and method
05/14/2009US20090121250 High light extraction efficiency light emitting diode (led) using glass packaging
05/14/2009US20090121249 Package structure of a light emitting diode device and method of fabricating the same
05/14/2009US20090121244 LED packaging structure and production method thereof
05/14/2009US20090121242 Compound semiconductor light-emitting diode and method for fabrication thereof
05/14/2009US20090121240 Nitride Semiconductor Device and Method for Manufacturing the Same
05/14/2009US20090121237 Led array for microdisplays or like applications, and method of fabrication
05/14/2009US20090121235 Method for fabricating a semiconductor device
05/14/2009US20090121234 Liquid crystal display device and fabrication method thereof
05/14/2009US20090121232 Array substrate, method for manufacturing the same and display panel having the same
05/14/2009US20090121231 Thin film transistors, method of fabricating the same, and organic light-emitting diode device using the same
05/14/2009US20090121228 Array substrate and method of manufacturing the same
05/14/2009US20090121227 Method of manufacturing thin film transistor array substrate and display device
05/14/2009US20090121225 Thin film transistor, method for manufacturing the same and display using the same
05/14/2009US20090121224 Dual gate of semiconductor device capable of forming a layer doped in high concentration over a recessed portion of substrate for forming dual gate with recess channel structure and method for manufacturing the same
05/14/2009US20090121221 High performance sub-system design and assembly
05/14/2009US20090121220 High performance sub-system design and assembly
05/14/2009US20090121218 Method for programming an electronic circuit and electronic circuit
05/14/2009US20090121212 Small electrode for phase change memories
05/14/2009US20090121211 Solution-Based Deposition Process for Metal Chalcogenides
05/14/2009US20090121208 Nonvolatile semiconductor memory device and method of manufacturing the same
05/14/2009US20090121157 Pulse train annealing method and apparatus
05/14/2009US20090121136 Electromagnetic radiation detector with nanowire thermometer and method for producing same
05/14/2009US20090120998 Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
05/14/2009US20090120905 Sacrificial Compositions And Methods Of Fabricating A Structure Using Sacrificial Compositions
05/14/2009US20090120803 Pad for electrochemical processing
05/14/2009US20090120799 Multiple-step electrodeposition process for direct copper plating on barrier metals
05/14/2009US20090120790 Low contamination components for semiconductor processing apparatus and methods for making components
05/14/2009US20090120679 Conductive through via structure and process for electronic device carriers
05/14/2009US20090120584 Counter-balanced substrate support
05/14/2009US20090120582 Shower plate and substrate processing apparatus
05/14/2009US20090120580 Disturbance-Free, Recipe-Controlled Plasma Processing System And Method
05/14/2009US20090120501 Formation of photoconductive and photovoltaic films
05/14/2009US20090120494 Solar cell and method of manufacturing the same
05/14/2009US20090120492 Low-cost solar cells and methods for their production
05/14/2009US20090120483 Conductive compositions and processes for use in the manufacture of semiconductor devices
05/14/2009US20090120472 Substrate cleaning and processing apparatus with magnetically controlled spin chuck holding pins
05/14/2009US20090120462 Fabricating and cleaning chamber components having textured surfaces
05/14/2009US20090120459 Apparatus and method for cleaning semiconductor substrates
05/14/2009US20090120193 Electronic circuit for measuring the mass of biological material and process for manufacturing the same
05/14/2009US20090119915 Method for Manufacturing Circuit Device
05/14/2009DE112007001029T5 Lötformteil und Elektronikbauteil Lötformteil and electronic component
05/14/2009DE112006003947T5 Polierzusammensetzung für einen Siliciumwafer und ein Polierverfahren für Siliciumwafer The polishing composition for a silicon wafer and a polishing process for silicon wafers
05/14/2009DE10209204B4 Elektronisches Bauteil mit einem Stapel aus Halbleiterchips und Verfahren zur Herstellung desselben The same electronic component having a stack of semiconductor chips and processes for making
05/14/2009DE102008056389A1 Halbleitervorrichtung mit Transistor hoher Durchbruchspannung A semiconductor device having high breakdown voltage transistor
05/14/2009DE102008051542A1 Integriertes Schaltungsbauelement und Verfahren The integrated circuit device and method
05/14/2009DE102008038170A1 Verfahren zum Fertigen einer rippenförmigen Halbleiterstruktur und eine rippenförmige Halbleiterstruktur A method of manufacturing a fin-shaped semiconductor structure and a ridge-shaped semiconductor structure
05/14/2009DE102008023622A1 DRAM-Vorrichtung mit einer dielektrischen Gate-Schicht mit mehreren Dicken DRAM device having a gate dielectric layer having a plurality of thicknesses
05/14/2009DE102007054626A1 Verfahren und Vorrichtung zum Ultraschallbonden Method and apparatus for ultrasonic bonding
05/14/2009DE102007054527A1 Neue Aufheizblöcke New Aufheizblöcke
05/14/2009DE102007054526A1 Wärmetransferelement und Anlage zur thermischen Behandlung von Substraten Heat transfer element and plant for the thermal treatment of substrates
05/14/2009DE102007054099A1 Zuordnung von Partikeln zu Entstehungsprozessen Allocation of particles to development processes
05/14/2009DE102007052981A1 Loading and unloading device for silicon wafer, has contact surface sloped relative to horizontal plane such that wafer with outer edges and/or transition surface between edges and plane surfaces of wafer only lies on contact surface
05/14/2009DE102007052820A1 Method for producing isolation trench in semiconductor substrate, involves etching trench in substrate at upper side of substrate made of semiconductor material
05/14/2009DE102007052530A1 Vorrichtungen zur Inspektion und Bestrahlung von flächigen Materialien Devices for inspection and irradiation of sheet materials
05/14/2009DE102007052051A1 Verspannungsübertragung durch sequenzielles Vorsehen eines stark verspannten Ätzstoppmaterials und eines Zwischenschichtdielektrikums in einem Kontaktschichtstapel eines Halbleiterbauelements Stress transfer by sequentially providing a highly stressed etch stop and a interlayer in a contact layer stack of a semiconductor device
05/14/2009DE102007052050A1 Erhöhen der Ätzselektivität während der Strukturierung einer Kontaktstruktur eines Halbleiterbauelements Increase the etch selectivity during the patterning of a contact structure of a semiconductor device
05/14/2009DE102007052048A1 Doppelintegrationsschema für Metallschicht mit geringem Widerstand Double integration scheme for metal layer having a low resistance
05/14/2009DE102007033918B4 Halbleiterbauelement und Herstellungsverfahren davon A semiconductor device and manufacturing method thereof
05/14/2009DE102007006525B4 Verfahren und Vorrichtung zur Detektierung von Defekten Method and apparatus for detection of defects
05/14/2009DE102007000980A1 Camera i.e. color camera, characteristic curve determining method for inspection machine, involves adjusting exposure time of camera to value, and allocating sparkles or associated exposure time to camera signal measured in camera
05/14/2009DE102006058325B4 Halbleiterdynamiksensor und Verfahren zur Herstellung desselben A semiconductor dynamic sensor and method for manufacturing the same
05/14/2009DE102005061210B4 Halbleiterbauelement mit einem vorderseitigen und einem rückseitigen pn-Übergang sowie zugehöriges Herstellungsverfahren A semiconductor device having a front and a rear-side pn junction and associated production method
05/14/2009DE102005047566B4 Anordnung mit einem Leistungshalbleiterbauelement und mit einem Gehäuse sowie Herstellungsverfahren hierzu Arrangement with a power semiconductor device and a housing and manufacturing method therefor
05/14/2009DE102004033825B4 Verfahren zur Herstellung einer Kondensatoranordnung sowie zugehörige Kondensatoranordnung A method of manufacturing a capacitor arrangement and associated capacitor assembly
05/14/2009CA2714546A1 Production of free-standing solid state layers by thermal processing of substrates with a polymer
05/14/2009CA2704610A1 Device and device manufacture method
05/13/2009EP2059112A1 Electronic component taking out apparatus, surface mounting apparatus and method for taking out electronic component
05/13/2009EP2059103A1 Semiconductor device and multilayer wiring board
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