Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2009
05/14/2009US20090124083 Film formation apparatus and method for using same
05/14/2009US20090124082 Slurry for polishing ruthenium and method for polishing using the same
05/14/2009US20090124081 Techniques to Improve Characteristics of Processed Semiconductor Substrates
05/14/2009US20090124080 Semiconductor device that is advantageous in microfabrication and method of manufacturing the same
05/14/2009US20090124079 Method for fabricating a conductive plug
05/14/2009US20090124078 Method of manufacturing semiconductor device with through hole
05/14/2009US20090124077 Method for forming poly-silicon film
05/14/2009US20090124076 Method of manufacturing semiconductor device
05/14/2009US20090124075 Method of manufacturing a wafer level package
05/14/2009US20090124074 Wafer level sensing package and manufacturing process thereof
05/14/2009US20090124073 Semiconductor device with bonding pad
05/14/2009US20090124072 Semiconductor device having through electrode and method of fabricating the same
05/14/2009US20090124071 Method of manufacturing semiconductor device
05/14/2009US20090124070 Methods of Manufacturing Semiconductor Devices Including Metal Oxide Layers
05/14/2009US20090124069 Methods of changing threshold voltages of semiconductor transistors by ion implantation
05/14/2009US20090124068 Non-Uniformly Doped High Voltage Drain-Extended Transistor and Method of Manufacture Thereof
05/14/2009US20090124067 Method to decrease thin film tensile stresses resulting from physical vapor deposition
05/14/2009US20090124066 Particle beam assisted modification of thin film materials
05/14/2009US20090124065 Particle beam assisted modification of thin film materials
05/14/2009US20090124064 Particle beam assisted modification of thin film materials
05/14/2009US20090124063 Method of manufacturing semiconductor device
05/14/2009US20090124062 Display device having a curved surface
05/14/2009US20090124061 Method for manufacturing semiconductor device
05/14/2009US20090124060 Method for manufacturing silicon carbide semiconductor apparatus
05/14/2009US20090124059 Method for forming a semiconductor device
05/14/2009US20090124058 Method of Providing Electrical Separation in Integrated Devices and Related Devices
05/14/2009US20090124057 Damascene gate field effect transistor with an internal spacer structure
05/14/2009US20090124056 Method of fabricating semiconductor device
05/14/2009US20090124055 Transistor structure and method for making same
05/14/2009US20090124054 Method of making integrated circuit embedded with non-volatile programmable memory having variable coupling
05/14/2009US20090124053 Fabrication of nanowires and nanodevices
05/14/2009US20090124052 Method of fabricating memory cell
05/14/2009US20090124051 Thin-filmed field effect transistor and making method
05/14/2009US20090124050 Method of manufacturing nanowires parallel to the supporting substrate
05/14/2009US20090124049 Deletable nanotube circuit
05/14/2009US20090124048 Semiconductor device and method of manufacturing semiconductor device
05/14/2009US20090124047 Stacked image method
05/14/2009US20090124046 Method of manufacturing semiconductor package
05/14/2009US20090124045 Low Profile Stacking System and Method
05/14/2009US20090124044 Method for removing bubbles from adhesive layer of semiconductor chip package
05/14/2009US20090124043 Method of manufacturing a package board
05/14/2009US20090124042 ZnO BASED SEMICONDUCTOR DEVICE MANUFACTURE METHOD
05/14/2009US20090124041 Resistance variable memory device with nanoparticle electrode and method of fabrication
05/14/2009US20090124039 Low temperature deposition of phase change memory materials
05/14/2009US20090124038 Imager device, camera, and method of manufacturing a back side illuminated imager
05/14/2009US20090124036 Method of production of semiconductor device and method of production of solid-state imaging device
05/14/2009US20090124035 Method of producing a suspended membrane device
05/14/2009US20090124034 Nanostructured Thin Films and Their Uses
05/14/2009US20090124032 Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same
05/14/2009US20090124030 Nitride-Based Light-Emitting Device and Method of Manufacturing the Same
05/14/2009US20090124029 Method of fabricating resistor and proximate drive transistor for a printhead
05/14/2009US20090124028 Imaging device and method for a bonding apparatus
05/14/2009US20090124027 Structure and Method for Placement, Sizing and Shaping of Dummy Structures
05/14/2009US20090123875 Method for manufacturing semiconductor device, and method for processing etching-target film
05/14/2009US20090123735 Low contamination components for semiconductor processing apparatus and methods for making components
05/14/2009US20090123661 System and method for forming high resolution electronic circuits on a substrate
05/14/2009US20090123643 Electronic Device and Method for Manufacturing the Same
05/14/2009US20090123256 Elevator linear motor drive
05/14/2009US20090122822 Semiconductor device having trench extending perpendicularly to cleaved plane and manufacturing method of the same
05/14/2009US20090122605 Integrated circuit embedded with non-volatile multiple-time programmable memory having variable coupling
05/14/2009US20090122535 Configuration and Method for the Manufacture of a Failsafe LED or OLED Chain
05/14/2009US20090122465 Electrolyte transistor and method of fabricating the same
05/14/2009US20090122459 Electrostatic chuck device
05/14/2009US20090122458 Embossed electrostatic chuck
05/14/2009US20090122384 Capacitive mems device with programmable offset voltage control
05/14/2009US20090122292 Illumination optical apparatus and projection exposure apparatus
05/14/2009US20090122281 Silica glass containing tio2 and process for its production
05/14/2009US20090122212 LCD driving device having plural TFT channels connected in parallel with either increasing channel widths or decreasing channel distances from central part to edges of the device
05/14/2009US20090121982 Organic light emitting diode display and method for manufacturing the same
05/14/2009US20090121943 Antenna system using complementary metal oxide semiconductor techniques
05/14/2009US20090121804 Monolithic semiconductor microwave switch array
05/14/2009US20090121710 Novel free layer design for TMR/CPP device
05/14/2009US20090121383 Fibrillar Microstructure and Processes for the Production Thereof
05/14/2009US20090121363 Process for Producing Circuit Substrate and Circuit Substrate Obtained in Accordance With the Process
05/14/2009US20090121362 Semiconductor package and mounting method thereof
05/14/2009US20090121361 Semiconductor device and method for manufacturing thereof
05/14/2009US20090121360 Semiconductor device having dual damascene structure
05/14/2009US20090121359 Semiconductor device and method for fabricating the same
05/14/2009US20090121358 Dual depth trench termination method for improving cu-based interconnect integrity
05/14/2009US20090121357 Design structure for bridge of a seminconductor internal node
05/14/2009US20090121356 Semiconductor device and method of manufacturing semiconductor device
05/14/2009US20090121355 Semiconductor device and method for manufacturing the same
05/14/2009US20090121354 Semiconductor Device and Method of Fabricating the Same
05/14/2009US20090121353 Dual damascene beol integration without dummy fill structures to reduce parasitic capacitance
05/14/2009US20090121351 Process for forming a bump structure and bump structure
05/14/2009US20090121350 Board adapted to mount an electronic device, semiconductor module and manufacturing method therefore, and portable device
05/14/2009US20090121349 Semiconductor device and a method of manufacturing the same
05/14/2009US20090121348 Chip structure and process thereof and stacked structure of chips and process thereof
05/14/2009US20090121346 Flexible Interposer for Stacking Semiconductor Chips and Connecting Same to Substrate
05/14/2009US20090121345 Silicon interposer producing method, silicon interposer and semiconductor device package and semiconductor device incorporating silicon interposer
05/14/2009US20090121343 Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules
05/14/2009US20090121342 Semiconductor device including main substrate and sub substrates and fabrication method of the same
05/14/2009US20090121341 Component for semiconductor package and manufacturing method of component for semiconductor package
05/14/2009US20090121337 Semiconductor device manufacturing method and semiconductor
05/14/2009US20090121334 Manufacturing method of semiconductor apparatus and semiconductor apparatus
05/14/2009US20090121331 Self-Aligning Structures and Method For Integrated Circuits
05/14/2009US20090121330 Clip Mount For Integrated Circuit Leadframes
05/14/2009US20090121327 Semiconductor device having spacer formed on semiconductor chip connected with wire
05/14/2009US20090121322 Semiconductor chip and semiconductor device
05/14/2009US20090121321 Wafer and a Method of Dicing a Wafer
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