Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2009
05/20/2009CN100490158C Semiconductor strcture and its making method
05/20/2009CN100490157C Non-volatile memory for reading data with temperature-compensated function
05/20/2009CN100490156C Voltage booster for non-volatile memories
05/20/2009CN100490155C Semiconductor device and method for forming a semiconductor structure
05/20/2009CN100490153C Semiconductor device and method of manufacturing the same
05/20/2009CN100490152C Non-volatile memory cell and related operation method
05/20/2009CN100490150C Semiconductor apparatus and its manufacturing method
05/20/2009CN100490149C Integrated circuit device, method of manufacturing the same and method of forming vanadium oxide film
05/20/2009CN100490148C Method of reducing current leakage in a semiconductor capacitor and corresponding device thereof
05/20/2009CN100490147C Method and structure for wiring electronic devices
05/20/2009CN100490146C Capacitor group structure and method for reducing capacitance variation amount between capacitors
05/20/2009CN100490143C Non-gate-controlled diode, electrostatic discharge protection circuit and manufacture method thereof
05/20/2009CN100490141C 半导体器件 Semiconductor devices
05/20/2009CN100490139C Lead frame for semiconductor device and manufacturing methode thereof
05/20/2009CN100490135C Preparation method for integrated pulsating chip heat pipe
05/20/2009CN100490132C Insulating sheet and power module comprising the insulating sheet
05/20/2009CN100490130C Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfilling applications
05/20/2009CN100490128C Method of grinding multilayer body and method of manufacturing solid state image pickup device
05/20/2009CN100490127C Wafer and wafer cutting and dividing method
05/20/2009CN100490126C Semiconductor wafer and process for producing a semiconductor wafer
05/20/2009CN100490125C Method for making base-board of liquid crystal display
05/20/2009CN100490124C Method for manufacturing a display device and method for forming a pattern
05/20/2009CN100490123C Making technology method for flash memory
05/20/2009CN100490122C Semiconductor element and making method
05/20/2009CN100490121C A method to fabricate high resistance value polysilicon resistance in high voltage IC
05/20/2009CN100490120C Automatic allocation and allocation method of spare element in wiring module
05/20/2009CN100490119C Dicing die-bonding film
05/20/2009CN100490118C Method for production of semiconductor devices
05/20/2009CN100490117C Manufacturing method of semiconductor device
05/20/2009CN100490116C A semiconductor device and a method of manufacturing thereof
05/20/2009CN100490115C Method of manufacturing a semiconductor device having damascene structures with air gaps
05/20/2009CN100490114C Semiconductor structure, and method for forming a copper diffusion barrier
05/20/2009CN100490113C Metal interconnection structure and its manufacture method
05/20/2009CN100490112C A method to improve STI morphology in high voltage MOS device
05/20/2009CN100490111C Method for obtaining a structure having a supporting substrate and an ultra-thin layer
05/20/2009CN100490110C Electrostatic adsorption apparatus
05/20/2009CN100490109C Level adjustment systems and adjustable pin chuck thereof
05/20/2009CN100490108C Indication device and method for indicating workpiece delivery position to robot
05/20/2009CN100490107C Manufacture method of vertical-type electric contactor and vertical-type electric contactor thereof
05/20/2009CN100490106C Test system and method for judging integrated circuit processing speed
05/20/2009CN100490105C Semiconductor chip glue-pouring method and die
05/20/2009CN100490104C Mould-seal array treating process of packaging wafer and used substrates bar
05/20/2009CN100490103C Making method for base plate welding cover layer and its structure
05/20/2009CN100490102C Lead frame and method for manufacturing semiconductor package with the same
05/20/2009CN100490101C Thin film transistor, pixel structure and method of manufacture thereof
05/20/2009CN100490100C Method of fabricating a fin field effect transistor in a semiconductor device
05/20/2009CN100490099C Method for making floating gate discharging sharp angle
05/20/2009CN100490098C Semiconductor structure and method for forming N type MOS transistor
05/20/2009CN100490097C Method for decreasing MOS field effect pipe reversed narrow channel effect
05/20/2009CN100490096C Semiconductor device and manufacturing method of the same
05/20/2009CN100490095C Semiconductor and method for making same
05/20/2009CN100490094C Ion implantation in use for reducing I/O NMOS inverse short-channel effect
05/20/2009CN100490093C Manufacturing method for transverse PNP transistor
05/20/2009CN100490092C Selective W-CVD process and process for producing Cu multilayer wiring
05/20/2009CN100490091C Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device
05/20/2009CN100490090C Method for etching three layers hard mask in two-stage integrated circuit device
05/20/2009CN100490089C Method for etching inclined shoulder type side wall in large scale integrated circuit logic device
05/20/2009CN100490088C Method for reducing oxidized silicon chip obverse grain
05/20/2009CN100490087C Radical generating method, etching method and apparatus for use in these methods
05/20/2009CN100490086C Substrate processing method
05/20/2009CN100490085C Dielectric block material including metal compound particle and its forming method
05/20/2009CN100490084C Polishing liquid for CMP process and polishing method
05/20/2009CN100490083C Method of processing substrate and substrate processing apparatus
05/20/2009CN100490082C Slurry composition for secondary polishing of silicon wafer
05/20/2009CN100490081C Grid dielectric layer and its formation method
05/20/2009CN100490080C Method of fabricating recess gate in semiconductor device
05/20/2009CN100490079C FET gate structure with metal gate electrode and silicide contact
05/20/2009CN100490078C GaN-based III-V group compound semiconductor device and p-type electrode for the same
05/20/2009CN100490077C Silicon carbide semiconductor device and process for producing the same
05/20/2009CN100490076C Self-assembly method, method for manufacturing cathode and device for depositing material
05/20/2009CN100490075C Susceptor and vapor growth device
05/20/2009CN100490074C Method for producing polycrystal silicon thin film and method for producing transistor using the same
05/20/2009CN100490073C Plasma processing apparatus and plasma processing method
05/20/2009CN100490072C A method of making a polycrystalline thin film, a mask pattern used in the same and a method for manufacturing a display device
05/20/2009CN100490071C Production method for silicon based silicon/germanium nano-crystal
05/20/2009CN100490070C Preventive treatment process for a multilayer semiconductor wafer
05/20/2009CN100490069C Method for depositing materials on a substrate
05/20/2009CN100490068C Plate member, substrate holding device, exposure device and method, and element manufacturing method
05/20/2009CN100490067C Substrate processing apparatus, use state ascertaining method, and false use preventing method
05/20/2009CN100490066C Mobile body system, exposure apparatus, and method of producing device
05/20/2009CN100490065C Support method and support structure for optical member, optical apparatus, exposure apparatus, and device production method
05/20/2009CN100490064C Exposing device and exposing method, and device manufacturing method
05/20/2009CN100490063C Methods and apparatus for processing semiconductor wafers with plasma processing chambers in a wafer track environment
05/20/2009CN100490062C Method of manufacturing semiconductor device
05/20/2009CN100490061C Method for fabricating capacitor in semiconductor device
05/20/2009CN100490060C Substrate treatment method and substrate treatment apparatus
05/20/2009CN100490059C Production of high-brightness light-emitting diodes chip
05/20/2009CN100490058C Double-side mounting apparatus and method of manufacturing electrical apparatus
05/20/2009CN100490057C Ditching type capacitor and its producing method
05/20/2009CN100490056C False piece operation method with cobalt deposition
05/20/2009CN100490055C Semiconductor device, method for manufacturing the same, liquid crystal television and EL television
05/20/2009CN100490013C System and method for preventing read margin degradation for a memory array
05/20/2009CN100490006C A method for fabricating a flux concentrating system for use in a magnetoelectronic device
05/20/2009CN100490005C Multiposition magnetic memory
05/20/2009CN100490003C Magnetic resistance element, storage element using same and relative recording/reproducing method
05/20/2009CN100489720C Method for compensating deviation of test temperature
05/20/2009CN100489709C Mechanical arm monitoring and self-reset system
05/20/2009CN100489666C Immersion lithography systems
05/20/2009CN100489665C Method for forming a lithography pattern
05/20/2009CN100489664C Optical approach effect compensation process of photoetching technology
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