Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2010
02/25/2010WO2010021297A1 Method and apparatus for polishing a substrate
02/25/2010WO2010021290A1 Composition for forming silicon-containing resist underlayer film with onium group
02/25/2010WO2010021286A1 Connecting terminal, connector, socket and semiconductor package
02/25/2010WO2010021265A1 Cluster jet processing method, semiconductor element, microelectromechanical element, and optical component
02/25/2010WO2010021260A1 Surface-treated ceramic member, method for producing same, and vacuum processing device
02/25/2010WO2010021214A1 Pattern defect inspecting apparatus and method
02/25/2010WO2010021213A1 Magnetoresistive storage device
02/25/2010WO2010021212A1 Light emitting element, and method for manufacturing the element
02/25/2010WO2010021173A1 Wire bonding device and method for measuring amplitude of capillary
02/25/2010WO2010021106A1 Semiconductor device, method for manufacturing semiconductor device, transistor substrate, light emitting device and display device
02/25/2010WO2010021099A1 Field effect transistor
02/25/2010WO2010021086A1 Carrier for dual-surface polishing device, and dual-surface polishing device and dual-surface polishing method using the same
02/25/2010WO2010021080A1 Cleaning device adapted to eject high-pressure cleaning liquid
02/25/2010WO2010021070A1 Apparatus and method for measuring withstand voltage of semiconductor element
02/25/2010WO2010021030A1 Material for resist sensitization film formation, process for producing semiconductor device, semiconductor device, and magnetic head
02/25/2010WO2010021020A1 Resist removing method and resist removing apparatus
02/25/2010WO2010020897A1 Gringo heterojunction bipolar transistor with a metal extrinsic base region
02/25/2010WO2010020579A1 Thin body silicon-on-insulator transistor with borderless self-aligned contacts
02/25/2010WO2010020578A1 Self-aligned borderless contacts for high density electronic and memory device integration
02/25/2010WO2010020546A1 Dual metal gate corner
02/25/2010WO2010020462A1 Product chips and die with a feature pattern that contains information relating to the product chip, methods for fabricating such product chips and die, and methods for reading a feature pattern from a packaged die
02/25/2010WO2010020195A1 Plasma processing apparatus, gas distribution device and gas delivery method
02/25/2010WO2010020092A1 Barrier layer removal method and apparatus
02/25/2010WO2010020077A1 Method for fabricating ingaain light-emitting device on a combined substrate
02/25/2010WO2010020071A1 LIGHT-EMITTING DEVICE BASED ON STRAIN-ADJUSTABLE InGaAlN FILM
02/25/2010WO2010020070A1 Semiconductor light-emitting device with passivation in p-type layer
02/25/2010WO2010020069A1 METHOD FOR FABRICATING InGaAlN LIGHT-EMITTING DIODES WITH A METAL SUBSTRATE
02/25/2010WO2010020065A1 Method for fabricating ingan-based multi-quantum well layers
02/25/2010WO2010020046A1 Doped dielectric layers and method for formation thereof
02/25/2010WO2010020033A1 Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same
02/25/2010WO2010019992A1 Method and apparatus for defect detection
02/25/2010WO2010019985A1 Multi-chip printhead assembler
02/25/2010WO2010019981A1 Apparatus for testing integrated circuitry
02/25/2010WO2010019980A1 Measuring apparatus for performing positional analysis on an integrated circuit carrier
02/25/2010WO2010002510A3 Methods and systems for packaging integrated circuits with integrated passive components
02/25/2010WO2010001344A3 Integrating and optimizing different functional components on a single substrate having layer in common
02/25/2010WO2010001192A3 Methods of combinatorial processing for screening multiple samples on a semiconductor substrate
02/25/2010WO2009158533A3 Method of wire bonding a stackof semiconductor chips in an offset configuration and device obtained by such a method
02/25/2010WO2009157647A3 Non-contact type conveyor plate having a suction force
02/25/2010WO2009155160A3 Multi-layer thick metallization structure for a microelectronic device, integrated circuit containing same, and method of manufacturing an integrated circuit containing same
02/25/2010WO2009155122A3 Epitaxial lift off stacks and methods
02/25/2010WO2009155119A3 Methods and apparatus for a chemical vapor deposition reactor
02/25/2010WO2009155067A3 Method for forming fine pitch structures
02/25/2010WO2009154965A3 Automated determination of height and tilt of a substrate surface within a lithography system
02/25/2010WO2009154952A3 Systems and methods for determining two or more characteristics of a wafer
02/25/2010WO2009154889A3 Gas distribution showerhead skirt
02/25/2010WO2009154853A3 Wafer processing deposition shielding components
02/25/2010WO2009154827A3 Floating sheet measurement apparatus and method
02/25/2010WO2009152327A3 Post oxidation annealing of low temperature thermal or plasma based oxidation
02/25/2010WO2009151834A3 Supramolecular block copolymer compositions for sub-micron lithography
02/25/2010WO2009151767A3 Design and use of dc magnetron sputtering systems
02/25/2010WO2009151745A3 Shear sensors and uses thereof
02/25/2010WO2009148671A3 Method for preparing ultraflat, atomically perfect areas on large regions of a crystal surface by heteroepitaxy deposition
02/25/2010WO2009148664A3 Fully integrated temperature regulator for biochemical applications
02/25/2010WO2009145531A3 Heat-treatment apparatus
02/25/2010WO2009144762A3 Micro emulsion of cadmium telluride and preparation method
02/25/2010WO2009142440A3 Optical component for maskless exposure apparatus
02/25/2010WO2009142400A3 In-line die cleaning device and cleaning method employing plasma
02/25/2010WO2009140622A3 Polishing pad with endpoint window and systems and method using the same
02/25/2010WO2009140403A3 Systems and methods for detecting defects on a wafer and generating inspection results for the wafer
02/25/2010WO2009140270A3 System and method for light source employing laser-produced plasma
02/25/2010WO2009140252A3 Through-silicon enabled die stacking scheme
02/25/2010WO2009140238A3 Structure and method for reliable solder joints
02/25/2010WO2009140139A3 Plasma process with photoresist mask preteatment
02/25/2010WO2009137764A3 Cmp pad thickness and profile monitoring system
02/25/2010WO2009137685A3 Configuring of lapping and polishing machines
02/25/2010WO2009137447A3 Debris-extraction exhaust system
02/25/2010WO2009137351A3 Improved method for encapsulating the edge of a flexible sheet
02/25/2010WO2009129194A3 Large-area single- and few-layer graphene on arbitrary substrates
02/25/2010WO2009007375A3 Thin-film solar cell module and method for its production
02/25/2010WO2008155761A3 Carbon nano-tube power cell
02/25/2010WO2008149372A3 Apparatus and method for substrate handling
02/25/2010WO2008109524A3 System and method for increased stand-off height in stud bumping process
02/25/2010WO2006064282A8 A method of ion implantation to reduce transient enhanced diffusion
02/25/2010US20100050149 Design and Layout of Phase Shifting Photolithographic Masks
02/25/2010US20100048102 Polishing pad
02/25/2010US20100048036 Method for manufacturing semiconductor device and laser irradiation apparatus
02/25/2010US20100048035 Robot apparatus and processing apparatus provided therewith, ashing system, and ashing method
02/25/2010US20100048034 Vertical boat for heat treatment and heat treatment method of semiconductor wafer using thereof
02/25/2010US20100048033 Process And Apparatus For Forming Oxide Film, And Electronic Device Material
02/25/2010US20100048032 Process gas delivery for semiconductor process chamber
02/25/2010US20100048031 Soft mold, method of manufacturing the same, and patterning method using the same
02/25/2010US20100048030 Method to improve the step coverage and pattern loading for dielectric films
02/25/2010US20100048029 Surface Preparation for Thin Film Growth by Enhanced Nucleation
02/25/2010US20100048028 Surface treated aluminum nitride baffle
02/25/2010US20100048027 Smooth and vertical semiconductor fin structure
02/25/2010US20100048026 Substrate processing method
02/25/2010US20100048025 Nanostructures and nanostructure fabrication
02/25/2010US20100048024 Manufacturing method of semiconductor device
02/25/2010US20100048023 Methods for Manufacturing a Structure on a Substrate and Intermediate Product
02/25/2010US20100048022 Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
02/25/2010US20100048021 Semiconductor device manufacturing method
02/25/2010US20100048020 Nanoscale Electrodes for Phase Change Memory Devices
02/25/2010US20100048019 Method for manufacturing a semiconductor device
02/25/2010US20100048018 Doped Layers for Reducing Electromigration
02/25/2010US20100048017 Bonded structure and bonding method
02/25/2010US20100048016 Semiconductor device manufacturing method
02/25/2010US20100048015 Methods of Forming Void-Free Layers in Openings of Semiconductor Substrates
02/25/2010US20100048014 Method of forming gate line of semiconductor device
02/25/2010US20100048013 Novel high-k metal gate cmos patterning method
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