Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2010
03/04/2010WO2010024036A1 Plasma processing device and method for cleaning plasma processing device
03/04/2010WO2010024034A1 Sputtering target and oxide semiconductor thin film formed therefrom
03/04/2010WO2010024015A1 Semiconductor element and display device provided with the same
03/04/2010WO2010023964A1 Insulating film material, method for forming film by using the insulating film material, and insulating film
03/04/2010WO2010023952A1 Magnetron sputter cathode, and filming apparatus
03/04/2010WO2010023937A1 Crystal manufacturing apparatus, semiconductor device manufactured using same, and method for manufacturing semiconductor device using same
03/04/2010WO2010023935A1 Substrate aligning apparatus, substrate aligning method and method for manufacturing multilayer semiconductor
03/04/2010WO2010023925A1 Plasma etching method, plasma etching device and photonic crystal manufacturing method
03/04/2010WO2010023921A1 Semiconductor optical element array and manufacturing method therefore
03/04/2010WO2010023907A1 Mold release film for manufacturing semiconductor resin package and semiconductor resin package manufacturing method using same
03/04/2010WO2010023895A1 Sensitizing solution for electroless plating and electroless plating method
03/04/2010WO2010023889A1 Field-effect transistor, method for manufacturing same, and sputtering target
03/04/2010WO2010023846A1 Semiconductor substrate and method for manufacturing the same
03/04/2010WO2010023841A1 Laser apparatus, phototherapeutic apparatus, exposure apparatus, device manufacturing method and apparatus for inspecting subject to be inspected
03/04/2010WO2010023833A1 Magnetoresistive element, method for manufacturing same, and storage medium used in the manufacturing method
03/04/2010WO2010023829A1 Polishing head and polishing apparatus
03/04/2010WO2010023816A1 Method for manufacturing soi wafer, and soi wafer
03/04/2010WO2010023812A1 Semiconductor device
03/04/2010WO2010023807A1 Panel having a cleaning function, and method for cleaning a substrate treatment apparatus using the panel
03/04/2010WO2010023797A1 Semiconductor device and method for manufacturing same
03/04/2010WO2010023791A1 Method and device for defect inspection
03/04/2010WO2010023722A1 Semiconductor device and its manufacturing method
03/04/2010WO2010023720A1 Structure, electronic device, and method of forming structure
03/04/2010WO2010023608A2 Low cost mos transistor for rf applications
03/04/2010WO2010023401A1 Three-dimensional capacitor, and method for topologically designing such a capacitor
03/04/2010WO2010023323A1 Surface sensor
03/04/2010WO2010023308A1 Substrate for an electronic or electromechanical component and nano-elements
03/04/2010WO2010023273A1 Schottky-drain transistor
03/04/2010WO2010023225A1 Method and arrangement for producing a functional layer on a semiconductor component
03/04/2010WO2010023221A1 Coating system
03/04/2010WO2010023109A1 Coating chamber with a moveable shield
03/04/2010WO2010023082A1 A method of initiating molecular bonding
03/04/2010WO2010022974A1 Body contact for sram cell comprising double-channel transistors
03/04/2010WO2010022972A1 A structured strained substrate for forming strained transistors with reduced thickness of active layer
03/04/2010WO2010022971A1 Drive current adjustment for transistors formed in the same active region by locally providing embedded strain inducing semiconductor material in the active region
03/04/2010WO2010022970A1 A semiconductor device including stress relaxation gaps for enhancing chip package interaction stability
03/04/2010WO2010022969A1 Using a cap layer in metallization systems of semiconductor devices as a cmp and etch stop layer
03/04/2010WO2010022916A1 Method for producing ceramic passivation layers on silicon for solar cell manufacture
03/04/2010WO2010022856A1 Three-dimensional cmos circuit on two offset substrates and method for making same
03/04/2010WO2010022843A1 Device and method for transporting substrates
03/04/2010WO2010022824A2 Device and method for the wet processing of different substrates
03/04/2010WO2010022823A1 Device and method for handling substrates
03/04/2010WO2010022814A1 Stiffening layers for the relaxation of strained layers
03/04/2010WO2010022530A1 Method for manufacturing transparent conductive oxide (tco) films; properties and applications of such films
03/04/2010WO2010022503A1 Wafer-level fabrication of liquid crystal optoelectronic devices
03/04/2010WO2010005700A3 Method for detection of oversized sub-resolution assist features
03/04/2010WO2010005670A3 Methods of forming a plurality of capacitors
03/04/2010WO2010005620A3 Modular and readily configurable reactor enclosures and associated function modules
03/04/2010WO2010005167A3 Method of manufacturing single thin film for nondestructive sensor
03/04/2010WO2010002683A3 Method for fabricating high density pillar structures by double patterning using positive photoresist
03/04/2010WO2010002516A3 Low-cost double structure substrates and methods for their manufacture
03/04/2010WO2009158180A3 Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer
03/04/2010WO2009155073A3 Fixture drying apparatus and method
03/04/2010WO2009154882A3 Semiconductor power switches having trench gates
03/04/2010WO2009154813A3 Method of forming a split gate memory device and apparatus
03/04/2010WO2009154696A3 Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines
03/04/2010WO2009153129A3 Method for the manufacture of an electronic assembly
03/04/2010WO2009152108A3 The use of ge as isolation layer on sbxtey or gextey alloy to prevent interaction of te from sbxtey and gextey resulting in high te content and film crystallinity
03/04/2010WO2009151665A3 Methods and devices for processing a precursor layer in a group via environment
03/04/2010WO2009151656A3 Method of dielectric film treatment
03/04/2010WO2009148912A3 Methods of providing electrical isolation and semiconductor structures including same
03/04/2010WO2009148695A3 Edge termination for semiconductor devices
03/04/2010WO2009145526A3 Protective film composition for wafer dicing
03/04/2010WO2009143462A3 Method for attaching optical components onto silicon-based integrated circuits
03/04/2010WO2009143350A3 Electrical and optical system and methods for monitoring erosion of electrostatic chuck edge bead materials
03/04/2010WO2009143200A3 Substrate matrix to decouple tool and process effects
03/04/2010WO2009143026A3 Method of forming an electronic device using a separation technique
03/04/2010WO2009142982A3 Metal gate structure and method of manufacturing same
03/04/2010WO2009142947A3 Helium descumming
03/04/2010WO2009142911A3 Robust outlet plumbing for high power flow remote plasma source
03/04/2010WO2009140570A3 Process for forming an electroactive layer
03/04/2010WO2009139912A3 In-line effluent analysis method and apparatus for cmp process control
03/04/2010WO2009137773A3 Apparatus and methods for hyperbaric rapid thermal processing
03/04/2010WO2009137578A3 Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making
03/04/2010WO2009137272A3 Flowable dielectric equipment and processes
03/04/2010WO2009136771A3 Ferroelectric material and a ferroelectric layer formation method using the same
03/04/2010WO2009134925A3 Process for forming cobalt and cobalt silicide materials in copper contact applications
03/04/2010WO2009134083A3 Method for depositing ultra fine crystal particle polysilicon thin film
03/04/2010WO2009131913A3 Thermal interconnect and interface materials, methods of production and uses thereof
03/04/2010WO2009129430A3 Methods for forming metal-polymer hybrid tooling for forming parts having micro features
03/04/2010WO2009129334A3 Three-dimensional semiconductor device structures and methods
03/04/2010WO2009120721A3 Plasmostor: a-metal-oxide-si field effect plasmonic modulator
03/04/2010WO2009114798A4 Wafer container with tubular environmental control components
03/04/2010WO2009058695A3 Cool impact-ionization transistor and method for making same
03/04/2010WO2007092689A3 Thermal-and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive
03/04/2010WO2007078590A3 Silicide layers in contacts for high-k/metal gate transistors
03/04/2010US20100057264 Method and apparatus for controlling the compounding of a pharmaceutical admixture
03/04/2010US20100057249 Thermal processing apparatus, thermal processing method, and storage medium
03/04/2010US20100057239 Semiconductor manufacturing apparatus
03/04/2010US20100056030 Mechanism for detecting shaft motion, and conditioner head
03/04/2010US20100055927 Method of manufacturing semiconductor device and substrate processing apparatus
03/04/2010US20100055926 Manufacturing method of semiconductor device
03/04/2010US20100055925 Heater, manufacturing apparatus for semiconductor device, and manufacturing method for semiconductor device
03/04/2010US20100055924 Apparatus and method for edge bevel removal of copper from silicon wafers
03/04/2010US20100055923 Conformal Etch Material and Process
03/04/2010US20100055922 Method for fabricating semiconductor device
03/04/2010US20100055921 Selective Etching of Silicon Dioxide Compositions
03/04/2010US20100055920 Apparatus and method for enhancing plasma etch
03/04/2010US20100055919 Integration cmos compatible of micro/nano optical gain materials
03/04/2010US20100055918 Substrate processing apparatus and method of manufacturing semiconductor device
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