Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2010
03/09/2010US7675073 Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities
03/09/2010US7675069 InAlGaN emitting light in ultraviolet short-wavelength region and process for preparing the same as well as ultraviolet light-emitting device using the same
03/09/2010US7675068 Methods of treating a silicon carbide substrate for improved epitaxial deposition and resulting structures and devices
03/09/2010US7675060 Semiconductor device and method for producing it
03/09/2010US7675000 System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
03/09/2010US7674999 Fast axis beam profile shaping by collimation lenslets for high power laser diode based annealing system
03/09/2010US7674756 Solvent compositions containing chlorofluoroolefins or fluoroolefins
03/09/2010US7674729 Method and apparatus for imprinting a circuit pattern using ultrasonic vibrations
03/09/2010US7674728 Deposition from liquid sources
03/09/2010US7674727 Nitrous oxide anneal of TEOS/ozone CVD for improved gapfill
03/09/2010US7674726 Parts for deposition reactors
03/09/2010US7674725 Treatment solution and method of applying a passivating layer
03/09/2010US7674724 Oxidizing method and oxidizing unit for object to be processed
03/09/2010US7674723 Plasma immersion ion implantation using an electrode with edge-effect suppression by a downwardly curving edge
03/09/2010US7674722 Method of forming gate insulating film, semiconductor device and computer recording medium
03/09/2010US7674721 Semiconductor device, semiconductor wafer, and methods of producing same device and wafer
03/09/2010US7674720 Stacking fault reduction in epitaxially grown silicon
03/09/2010US7674719 Via hole machining for microwave monolithic integrated circuits
03/09/2010US7674718 Method for forming spacers of different sizes
03/09/2010US7674717 Method of fabricating periodic nano-structure arrays with different feature sizes
03/09/2010US7674716 Adjuvant for use in simultaneous polishing of a cationically charged material and an anionically charged material, which forms a adsorption layer on the cationically charged material to increase the polishing selectivity of the anionically charged material; graft polyelectrolyte salt
03/09/2010US7674715 Method for forming tungsten materials during vapor deposition processes
03/09/2010US7674714 Method of fabricating semiconductor devices having a gate silicide
03/09/2010US7674713 Atmospheric pressure chemical vapor deposition
03/09/2010US7674712 Patterning method for light-emitting devices
03/09/2010US7674711 Method of fabricating flash memory device by forming a drain contact plug within a contact hole below and ILD interface
03/09/2010US7674710 Method of integrating metal-containing films into semiconductor devices
03/09/2010US7674709 Phase change memory cell with high read margin at low power operation
03/09/2010US7674708 Method for forming fine patterns of a semiconductor device
03/09/2010US7674707 Manufacturable reliable diffusion-barrier
03/09/2010US7674706 System for modifying small structures using localized charge transfer mechanism to remove or deposit material
03/09/2010US7674705 Method of forming a semiconductor device
03/09/2010US7674704 Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases
03/09/2010US7674703 Gridded contacts in semiconductor devices
03/09/2010US7674702 Solder bump formation in electronics packaging
03/09/2010US7674701 Methods of forming metal layers using multi-layer lift-off patterns
03/09/2010US7674700 Apparatus for manufacturing semiconductor device and method for manufacturing semiconductor device using the same
03/09/2010US7674699 III group nitride semiconductor substrate, substrate for group III nitride semiconductor device, and fabrication methods thereof
03/09/2010US7674698 Metal-substituted transistor gates
03/09/2010US7674697 MOSFET with multiple fully silicided gate and method for making the same
03/09/2010US7674696 Method of fabricating semiconductor device
03/09/2010US7674695 Wafer cleaning system
03/09/2010US7674694 Process for manufacturing a TFT device with source and drain regions having gradual dopant profile
03/09/2010US7674693 Method for manufacturing semiconductor device
03/09/2010US7674692 Nitride semiconductor light-emitting device and fabrication method thereof
03/09/2010US7674691 Method of manufacturing an electrical antifuse
03/09/2010US7674690 Inhibition of metal diffusion arising from laser dicing
03/09/2010US7674689 Method of making an integrated circuit including singulating a semiconductor wafer
03/09/2010US7674688 Sawing method for a semiconductor element with a microelectromechanical system
03/09/2010US7674687 Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving process
03/09/2010US7674686 Transplanted magnetic random access memory (MRAM) devices on thermally-sensitive substrates using laser transfer and method of making the same
03/09/2010US7674685 Semiconductor device isolation structures and methods of fabricating such structures
03/09/2010US7674684 Deposition methods for releasing stress buildup
03/09/2010US7674683 Bulk-isolated PN diode and method of forming a bulk-isolated PN diode
03/09/2010US7674682 Capacitor integration at top-metal level with a protective cladding for copper surface protection
03/09/2010US7674681 Semiconductor device and method for manufacturing the same
03/09/2010US7674680 Transistor having high dielectric constant gate insulating layer and source and drain forming Schottky contact with substrate
03/09/2010US7674679 Manufacturing method of semiconductor device and semiconductor device
03/09/2010US7674678 Method for producing a transistor component having a field plate
03/09/2010US7674677 Semiconductor device and a method for manufacturing the same
03/09/2010US7674676 Semiconductor device manufacturing method for forming diffused layers by impurity implantation using gate wiring layer mask
03/09/2010US7674675 Method of forming an integrated SOI fingered decoupling capacitor
03/09/2010US7674674 Method of forming a dual gated FinFET gain cell
03/09/2010US7674673 Semiconductor device and manufacturing method thereof
03/09/2010US7674672 Fabricating process for substrate with embedded passive component
03/09/2010US7674671 Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
03/09/2010US7674670 Methods of forming threshold voltage implant regions
03/09/2010US7674669 FIN field effect transistor
03/09/2010US7674668 Method of manufacturing a semiconductor device
03/09/2010US7674667 CMOS structure including topographic active region
03/09/2010US7674666 Fabrication of semiconductor device having composite contact
03/09/2010US7674665 Method of fabricating Schottky barrier transistor
03/09/2010US7674664 Method of fabricating liquid crystal display device having drive circuit
03/09/2010US7674663 Method of irradiating laser, laser irradiation system, and manufacturing method of semiconductor device
03/09/2010US7674662 Process for making thin film field effect transistors using zinc oxide
03/09/2010US7674661 Memory device and method of manufacturing the same
03/09/2010US7674660 Multilevel semiconductor device and method of manufacturing the same
03/09/2010US7674659 Method for fabricating a thin film transistor
03/09/2010US7674658 Semiconductor device and manufacturing method thereof
03/09/2010US7674657 Method of manufacture of encapsulated package
03/09/2010US7674656 Die positioning for packaged integrated circuits
03/09/2010US7674655 Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material
03/09/2010US7674654 Producing thin integrated semiconductor devices
03/09/2010US7674653 Die offset die to bonding
03/09/2010US7674652 Methods of forming an integrated circuit package
03/09/2010US7674651 Mounting method for semiconductor parts on circuit substrate
03/09/2010US7674650 Semiconductor device and manufacturing method thereof
03/09/2010US7674649 Radio frequency identification (RFID) tag lamination process using liner
03/09/2010US7674648 Extended dynamic range using variable sensitivity pixels
03/09/2010US7674647 Method for manufacturing photoelectric conversion device
03/09/2010US7674646 Three dimensional integrated passive device and method of fabrication
03/09/2010US7674645 Diode energy converter for chemical kinetic electron energy transfer
03/09/2010US7674644 Method for fabrication of group III nitride semiconductor
03/09/2010US7674643 Gallium nitride semiconductor light emitting device and method of manufacturing the same
03/09/2010US7674642 Method of fabricating linear cascade high-speed green light emitting diode
03/09/2010US7674641 Method for fabricating white-light-emitting flip-chip diode having silicon quantum dots
03/09/2010US7674640 Stacked die package system
03/09/2010US7674639 GaN based LED with etched exposed surface for improved light extraction efficiency and method for making the same
03/09/2010US7674638 Sensor device and production method therefor
03/09/2010US7674637 Monitoring cool-down stress in a flip chip process using monitor solder bump structures
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