Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2010
02/18/2010US20100038683 Integrated circuit modeling, design, and fabrication based on degradation mechanisms
02/18/2010US20100038682 Electronic devices with improved ohmic contact
02/18/2010US20100038679 Finfet with longitudinal stress in a channel
02/18/2010US20100038678 Photodiode with a Reduced Dark Current and Method for the Production Thereof
02/18/2010US20100038675 Power semiconductor devices and methods for manufacturing the same
02/18/2010US20100038672 Light emitting device and method for fabricating the same
02/18/2010US20100038670 Illumination assembly including chip-scale packaged light-emitting device
02/18/2010US20100038669 Vertical light emitting diodes
02/18/2010US20100038667 Optoelectronic Semiconductor Chip and Method for Manufacturing a Contact Structure for Such a Chip
02/18/2010US20100038661 Light-Emitting Diode With Non-Metallic Reflector
02/18/2010US20100038660 Two-phase cooling for light-emitting devices
02/18/2010US20100038658 Polymer light-emitting diode and fabrication of same by resonant infrared laser vapor deposition
02/18/2010US20100038656 Nitride LEDs based on thick templates
02/18/2010US20100038653 Diamond electronic devices and methods for their manufacture
02/18/2010US20100038652 Light emitting element and method of making same
02/18/2010US20100038651 Semiconductor device including semiconductor circuit made from semiconductor element and manufacturing method thereof
02/18/2010US20100038646 Method of manufacturing thin film transistor, thin film transistor, and display unit
02/18/2010US20100038644 Thin film transistor display panel and method of manufacturing the same
02/18/2010US20100038643 Organic light emitting display and manufacturing method of the same
02/18/2010US20100038642 Thin film transistor array panel and method of manufacturing the same
02/18/2010US20100038639 Semiconductor device and manufacturing method thereof
02/18/2010US20100038637 Composite Comprising Array of Needle-Like Crystal, Method for Producing the Same, Photovoltaic Conversion Element, Light Emitting Element, and Capacitor
02/18/2010US20100038636 Organic thin film transistor and method of manufacturing the same, and semiconductor device having the organic thin film transistor
02/18/2010US20100038629 Anisotropic Semiconductor Film and Method of Production Thereof
02/18/2010US20100038628 Chemical doping of nano-components
02/18/2010US20100038623 Methods and apparatus for increasing memory density using diode layer sharing
02/18/2010US20100038622 Metal Organic Vapor Phase Epitaxy and Molecular Beam Epitaxy; film for use in electronics, optics or optoelectronics
02/18/2010US20100038619 Variable resistance element, manufacturing method thereof, and electronic device
02/18/2010US20100038617 Semiconductor memory device
02/18/2010US20100038614 Methods of forming a phase change material, a phase change material, a phase change random access memory device including the phase change material, and a semiconductor structure including the phase change material
02/18/2010US20100038584 Polishing Composition and Polishing Method Using the Same
02/18/2010US20100038540 Image sensor for detecting wide spectrum and method of manufacturing the same
02/18/2010US20100038539 Pixel Interconnect Insulators and Methods Thereof
02/18/2010US20100038283 Wafer container having the latch and inflatable seal element
02/18/2010US20100038282 Front Opening Unified Pod with latch structure
02/18/2010US20100038253 Method and Apparatus for Maintaining Parallelism of Layers and/or Achieving Desired Thicknesses of Layers During the Electrochemical Fabrication of Structures
02/18/2010US20100038233 Ag-bi-base alloy sputtering target, and method for producing the same
02/18/2010US20100038035 Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
02/18/2010US20100038032 System and method for critical dimension reduction and pitch reduction
02/18/2010US20100037959 Method for supplying process gas, system for supplying process gas, and system for processing object to be processed
02/18/2010US20100037952 Selective Emitter Solar Cell and Fabrication Method Thereof
02/18/2010US20100037937 Photovoltaic cell with patterned contacts
02/18/2010US20100037881 Slicing method
02/18/2010US20100037577 Crop Anti-Wrapping Method and Apparatus
02/18/2010DE202009014987U1 Prüfvorrichtung zur elektrischen Prüfung von elektrischen Prüflingen Tester for electrical testing of electrical devices under test
02/18/2010DE112008001104T5 Vorrichtung zur Halbleiterwafer-Bearbeitung, Verfahren zur Ermittlung einer Bezugswinkelposition und Halbleiterwafer An apparatus for semiconductor wafer processing, method for determining a reference angular position and semiconductor wafer
02/18/2010DE10240422B4 Verfahren zur Herstellung eines Halbleiterelements mit einer Leitungsstruktur mit vergrößertem Metallsilizidbereich A method for manufacturing a semiconductor element having a line structure with enlarged Metallsilizidbereich
02/18/2010DE10226235B4 Verfahren zum Erhöhen der Abtragrate von Oxid unter Verwendung eines fixierten Schleifmittels A method for increasing the removal rate of oxide by using a fixed abrasive
02/18/2010DE102009034405A1 Halbleitervorrichtungen und Verfahren zum Herstellen einer Halbleitervorrichtung Semiconductor devices and the method of manufacturing a semiconductor device
02/18/2010DE102009029870A1 Verfahren zum Herstellen einer Halbleiteranordnung und Halbleiteranordnung A method of manufacturing a semiconductor device and semiconductor device
02/18/2010DE102009029844A1 Kupferdrahtbonden auf organischen Lötschutzmaterialien (OSP) und verbesserter Drahtbondungsprozess Copper wire bonding to organic Lötschutzmaterialien (OSP) and improved Drahtbondungsprozess
02/18/2010DE102008037653A1 Method for fabricating wafers from wafer block using block holder and sawing device, involves sawing of wafer blocks by sawing device, where wafer blocks are retained by block holder during sawing
02/18/2010DE102008035901A1 Verfahren zur Herstellung von optoelektronischen Bauelementen und optoelektronisches Bauelement A process for the production of opto-electronic devices and optoelectronic component
02/18/2010DE102007004861B4 Transistor mit eingebettetem Si/Ge-Material auf einem verspannten Halbleiter-auf-Isolator-Substrat und Verfahren zum Herstellen des Transistors Transistor with embedded Si / Ge material on a strained semiconductor-on-insulator substrate and method for fabricating the transistor
02/18/2010DE102006046727B4 Verfahren zur Herstellung einer Halbleiterstruktur mit einem Varaktor und einem Hochfrequenztransistor A method of fabricating a semiconductor structure including a varactor, and a high-frequency transistor
02/18/2010DE102006028543B4 Integrierte SiGe-NMOS- und PMOS-Transistoren in einem Hochleistungs-BICMOS-Prozess Integrated SiGe NMOS and PMOS transistors in a high performance BiCMOS process
02/18/2010DE102005038998B4 Metalloxidhalbleiter-Bauelement mit verbesserter Abschirmstruktur und Verfahren zur Herstellung Metal oxide semiconductor device having an improved shielding structure and methods for preparing
02/18/2010DE102005015454B4 Halbleitersensorbauteil mit Hohlraumgehäuse und Sensorchip sowie Verfahren zur Herstellung desselben Of the same semiconductor sensor device with housing cavity and the sensor chip and methods for preparing
02/18/2010DE10132430B4 Verfahren zur Bildung einer dünnen Oxidschicht mit einer verbesserten Zuverlässigkeit auf einer Halbleiteroberfläche A method of forming a thin oxide layer having improved reliability to a semiconductor surface
02/18/2010DE10108388B4 Halbleiterwafer-Bearbeitungsvorrichtung und Verfahren zum Dünnermachen eines Halbleiterwafers A semiconductor wafer processing apparatus and method for thinning a semiconductor wafer
02/18/2010CA2675187A1 Methods for producing carboxylic acid stabilized silver nanoparticles
02/17/2010EP2154726A2 A method for producing a JBS diode
02/17/2010EP2154725A1 Silicon carbide zener diode
02/17/2010EP2154724A2 Flexible flat structure with a layer having microstructures, method for producing the flexible flat structure and use thereof
02/17/2010EP2154719A2 Semiconductor device and method of manufacturing the same
02/17/2010EP2154717A2 Materials for adhesion enhancement of copper film on diffusion barriers
02/17/2010EP2154716A2 Nozzle
02/17/2010EP2154715A1 Method and apparatus for mounting solder ball
02/17/2010EP2154714A2 Temperature sensor with buffer layer
02/17/2010EP2154713A1 Method for manufacturing a sensor device with a stress relief layer
02/17/2010EP2154712A1 Method for preparing a partially or fully semi-insulating or P-doped ZnO substrate, substrates obtained, and electronic, electro-optical or optoelectronic devices comprising same.
02/17/2010EP2154711A1 Vaporizing apparatus and film forming apparatus provided with vaporizing apparatus
02/17/2010EP2154710A2 Substrate joining method and 3-D semiconductor device
02/17/2010EP2154709A2 Method of manufacturing group III nitride semiconductor layer bonded substrate
02/17/2010EP2154708A1 High-temperature bonding composition, substrate bonding method, and 3-D semiconductor device
02/17/2010EP2154571A1 Positive photosensitive resin composition and method of forming cured film therefrom
02/17/2010EP2154570A1 Photosensitive adhesive resin composition, adhesive film and light-receiving device
02/17/2010EP2154273A1 Method for production of ultraviolet light-emitting hexagonal boron nitride crystal
02/17/2010EP2154270A2 Non-polar a-plane gallium nitride thin films grown by metalorganic chemical vapor deposition
02/17/2010EP2154188A1 Resin composition containing fine metal oxide particles
02/17/2010EP2154183A1 Coated substrates and methods for their preparation
02/17/2010EP2153706A1 Electronic circuit device
02/17/2010EP2153467A1 Method for suppressing layout sensitivity of threshold voltage in a transistor array
02/17/2010EP2153464A2 Method of producing a wafer scale package
02/17/2010EP2153463A1 Memory arrays, semiconductor constructions and electronic systems; and methods of forming memory arrays, semiconductor constructions and electronic systems
02/17/2010EP2153462A2 Method for producing hybrid components
02/17/2010EP2152929A1 Semiconductor component, method for the production thereof, and use thereof
02/17/2010EP2152827A1 Dispersion comprising cerium oxide, silicon dioxide and amino acid
02/17/2010EP2152826A1 Chemical-mechanical polishing composition comprising metal-organic framework materials
02/17/2010EP2152822A2 Antireflective coating compositions
02/17/2010EP1757175B1 Method and apparatus for accurately applying structures to a substrate
02/17/2010EP1497855B1 Method for producing one or more monocrystalline layers, each with a different lattice structure, on one plane of a series of layers
02/17/2010EP1321978B1 Contact structure
02/17/2010EP1320785B1 Oxime derivatives and the use thereof as latent acids
02/17/2010EP1222685B1 Single step pendeo- and lateral epitaxial overgrowth of group iii-nitride layers
02/17/2010EP1197999B1 Method of forming low-dielectric-constant film, and semiconductor substrate with low-dielectric-constant film
02/17/2010EP1055250B1 Plasma processing apparatus
02/17/2010CN201408772Y Transmission device for solar battery silicon chip
02/17/2010CN201408748Y Silicon deep slot structure with depth-to-width ratio
02/17/2010CN201408747Y Crystal particle mounting die