Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2010
02/18/2010US20100040449 Apparatus For Mounting A Flip Chip On A Substrate
02/18/2010US20100040447 Transport apparatus
02/18/2010US20100040441 Foup opening/closing device and probe apparatus
02/18/2010US20100040438 System and Method for Transferring Packaged Semiconductors Between Storage Mediums
02/18/2010US20100040437 Load lock apparatus, processing system and substrate processing method
02/18/2010US20100040322 Integrated electro-optic device and method of making
02/18/2010US20100040100 Semiconductor laser
02/18/2010US20100039867 Electrically Isolated Gated Diode Nonvolatile Memory
02/18/2010US20100039865 Non-volatile semiconductor memory device and method of making the same
02/18/2010US20100039856 Programmable phase-change memory and method therefor
02/18/2010US20100039852 Dynamic Memory Cell Methods
02/18/2010US20100039850 Semiconductor memory device with ferroelectric memory
02/18/2010US20100039849 Read/write elements for a three-dimensional magnetic memory
02/18/2010US20100039848 Non-volatile programmable optical element employing f-centers
02/18/2010US20100039777 Microelectronic package with high temperature thermal interface material
02/18/2010US20100039774 Power Semiconductor Module And Method For Its Production
02/18/2010US20100039747 Electrostatic chuck assembly
02/18/2010US20100039740 System and method for excess voltage protection in a multi-die package
02/18/2010US20100039687 Apparatus for Performing Confocal Endoscopy
02/18/2010US20100039602 Electro-optical device and method for manufacturing the same
02/18/2010US20100039601 Lcd device
02/18/2010US20100039599 Thin film transistor array panel for liquid crystal display
02/18/2010US20100039596 Liquid crystal display device and method of manufacturing the same
02/18/2010US20100038833 Annealing apparatus
02/18/2010US20100038804 Integrated circuit package system with mold gate
02/18/2010US20100038803 Low fabrication cost, high performance, high reliability chip scale package
02/18/2010US20100038802 Stacked semiconductor device and method
02/18/2010US20100038801 Corrosion Control of Stacked Integrated Circuits
02/18/2010US20100038800 Through-silicon via structures including conductive protective layers and methods of forming the same
02/18/2010US20100038799 Semiconductor integrated circuit device, mounting structure of semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device
02/18/2010US20100038798 Method for correcting mask pattern, photomask, method for fabricating photomask, electron beam writing method for fabricating photomask, exposure method, semiconductor device, and method for fabricating semiconductor device
02/18/2010US20100038796 High aspect ratio contacts
02/18/2010US20100038795 Method of fabricating semiconductor device and semiconductor device
02/18/2010US20100038794 Three dimensional nanoscale circuit interconnect and method of assembly by dielectrophoresis
02/18/2010US20100038792 Semiconductor device
02/18/2010US20100038791 Resistive random access memory and method for fabricating the same
02/18/2010US20100038790 reliability of wide interconnects
02/18/2010US20100038789 Conformal adhesion promoter liner for metal interconnects
02/18/2010US20100038787 Semiconductor device and method of manufacturing the same
02/18/2010US20100038786 Method for manufacturing a semiconductor device
02/18/2010US20100038785 Materials for Adhesion Enhancement of Copper Film on Diffusion Barriers
02/18/2010US20100038784 Redundant barrier structure for interconnect and wiring applications, design structure and method of manufacture
02/18/2010US20100038783 Metal cap for back end of line (beol) interconnects, design structure and method of manufacture
02/18/2010US20100038782 Nitrogen-containing metal cap for interconnect structures
02/18/2010US20100038781 Integrated circuit packaging system having a cavity
02/18/2010US20100038780 Underfill flow guide structures and method of using same
02/18/2010US20100038778 Integrated circuit structures and fabricating methods that use voids in through holes as joining interfaces
02/18/2010US20100038777 Method of making a sidewall-protected metallic pillar on a semiconductor substrate
02/18/2010US20100038776 Miniature microwave package and process for fabricating the package
02/18/2010US20100038773 Bond pad for wafer and package for cmos imager
02/18/2010US20100038772 Semiconductor package and manufacturing method thereof
02/18/2010US20100038771 Integrated circuit package with open substrate
02/18/2010US20100038768 Integrated circuit package system for package stacking and manufacturing method thereof
02/18/2010US20100038767 Semiconductor device and method of manufacturing the same
02/18/2010US20100038766 Method for forming terminal of stacked package element and method for forming stacked package
02/18/2010US20100038762 Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device
02/18/2010US20100038760 Metal Leadframe Package with Secure Feature
02/18/2010US20100038759 Leadless Package with Internally Extended Package Leads
02/18/2010US20100038758 Semiconductor module with two cooling surfaces and method
02/18/2010US20100038757 Silicon wafer, method for manufacturing the same and method for heat-treating the same
02/18/2010US20100038756 (110) oriented silicon substrate and a bonded pair of substrates comprising said (110) oriented silicon substrate
02/18/2010US20100038755 Silicon wafer with controlled distribution of embryos that become oxygen precipitates by succeeding annealing and its manufacturing method
02/18/2010US20100038752 Modular & scalable intra-metal capacitors
02/18/2010US20100038751 Structure and method for manufacturing trench capacitance
02/18/2010US20100038749 Contact and VIA Interconnects Using Metal Around Dielectric Pillars
02/18/2010US20100038747 Electrically programmable fuse and fabrication method
02/18/2010US20100038746 Semiconductor structure and method for making isolation structure therein
02/18/2010US20100038744 Shallow Trench Isolation
02/18/2010US20100038742 Semiconductor device and manufacturing method thereof
02/18/2010US20100038741 Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module
02/18/2010US20100038737 Plastic image sensor packaging for image sensors
02/18/2010US20100038735 Magnet-assisted transistor devices
02/18/2010US20100038734 Vibration sensor and method for manufacturing the vibration sensor
02/18/2010US20100038733 Microelectromichanical system package with strain relief bridge
02/18/2010US20100038731 Non-volatile memory device
02/18/2010US20100038730 Semiconductor structures including a movable switching element, systems including same and methods of forming same
02/18/2010US20100038729 Method of manufacturing semiconductor device and semiconductor device
02/18/2010US20100038726 Radiation hardened device
02/18/2010US20100038725 Changing effective work function using ion implantation during dual work function metal gate integration
02/18/2010US20100038724 Metal-Gate High-K Reference Structure
02/18/2010US20100038723 Self-aligned borderless contacts for high density electronic and memory device integration
02/18/2010US20100038722 Mis transistor and cmos transistor
02/18/2010US20100038721 Method of forming a single metal that performs n work function and p work function in a high-k/metal gate process
02/18/2010US20100038719 Semiconductor apparatuses and methods of manufacturing the same
02/18/2010US20100038718 Electro-static discharge and latchup resistant semiconductor device
02/18/2010US20100038717 Semiconductor on Insulator Apparatus
02/18/2010US20100038715 Thin body silicon-on-insulator transistor with borderless self-aligned contacts
02/18/2010US20100038714 Device and process involving pinhole undercut area
02/18/2010US20100038713 Self-aligned tunneling pocket in field-effect transistors and processes to form same
02/18/2010US20100038710 Vertical power MOSFET semiconductor apparatus having separate base regions and manufacturing method thereof
02/18/2010US20100038708 Method and Structure for Forming a Shielded Gate Field Effect Transistor
02/18/2010US20100038707 Semiconductor device
02/18/2010US20100038705 Field effect device with gate electrode edge enhanced gate dielectric and method for fabrication
02/18/2010US20100038701 Integrated two device non-volatile memory
02/18/2010US20100038699 Nonvolatile semiconductor memory device and method for manufacturing same
02/18/2010US20100038696 Semiconductor Device and Method for Making Same
02/18/2010US20100038687 Selective deposition of amorphous silicon films on metal gates
02/18/2010US20100038686 Soi substrates and devices on soi substrates having a silicon nitride diffusion inhibition layer and methods for fabricating
02/18/2010US20100038685 Enhanced dislocation stress transistor
02/18/2010US20100038684 Transistor layout for manufacturing process control